Cool White LED Emitter
LZC-00CW0R
Key Features
High Luminous Flux Density 12-die Cool White LED
More than 40 Watt power dissipation capability
Small foot print – 9.0mm x 9.0mm
Industry lowest thermal resistance per package size (0.7°C/W)
Surface mount ceramic package with integrated glass lens
Spatial color uniformity across radiation pattern
Excellent Color Rendering Index
JEDEC Level 1 for Moisture Sensitivity Level
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available with several MCPCB options
Full suite of TIR secondary optics family available
Typical Applications
General lighting
Down lighting
Architectural lighting
Street lighting
Stage and Studio lighting
Refrigeration lighting
Portable lighting
Description
The LZC-series 12-die White LED emitter has an electrical input power dissipation capability of more than 40 Watt
electrical power in an extremely small package. With a small 9.0mm x 9.0mm ultra-small footprint, this package
provides exceptional luminous flux density. The high quality materials used in the package are chosen to minimize
stresses and optimize light output which results in superior reliability and lumen maintenance. The robust product
design thrives in outdoor applications with high ambient temperatures and high humidity.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Part number options
Base part number
Part number
Description
LZC-00CW0R-xxxx
LZC emitter
LZC-70CW0R-xxxx
LZC emitter on 1 channel 1x12 Star MCPCB
LZC-C0CW0R-xxxx
LZC emitter on 2 channel 2x6 Star MCPCB
Bin kit option codes
CW, Cool-White (5000K – 6500K)
Kit number
suffix
Min
flux
Bin
Color Bin Ranges
Description
0055
B2
2U, 2Y, 3U, 2A, 2D, 3A, 2B, 2C, 3B, 2V, 2X, 3V
full distribution flux; 5500K ANSI CCT bin
0065
B2
1U, 1A, 1B, 1V, 1Y, 1D, 1C, 1X, 2U, 2A, 2B, 2V
full distribution flux; 6500K ANSI CCT bin
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Cool White Chromaticity Groups
0.40
0.38
3X
3V
3C
2X
0.36
3B
2V
2C
CIEy
1X
2B
0.34
1V
1D
1A
3Y
2D
3U
2A
1B
Planckian Locus
3A
1C
0.32
3D
2Y
2U
1Y
1U
0.30
0.28
0.28
0.30
0.32
0.34
0.36
0.38
CIEx
Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below in the table.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Cool White Bin Coordinates
Bin code
1U
1Y
2U
2Y
3U
3Y
CIEx
0.3068
0.3144
0.3161
0.3093
0.3068
0.3144
0.3221
0.3231
0.3161
0.3144
0.3222
0.329
0.329
0.3231
0.3222
0.329
0.3366
0.3361
0.329
0.329
0.3366
0.344
0.3429
0.3361
0.3366
0.344
0.3515
0.3495
0.3429
0.344
CIEy
0.3113
0.3186
0.3059
0.2993
0.3113
0.3186
0.3261
0.312
0.3059
0.3186
0.3243
0.33
0.318
0.312
0.3243
0.33
0.3369
0.3245
0.318
0.33
0.3369
0.3428
0.3299
0.3245
0.3369
0.3428
0.3487
0.3339
0.3299
0.3428
Bin code
1A
1D
2A
2D
3A
3D
CIEx
0.3048
0.313
0.3144
0.3068
0.3048
0.313
0.3213
0.3221
0.3144
0.313
0.3215
0.329
0.329
0.3222
0.3215
0.329
0.3371
0.3366
0.329
0.329
0.3371
0.3451
0.344
0.3366
0.3371
0.3451
0.3533
0.3515
0.344
0.3451
CIEy
0.3207
0.329
0.3186
0.3113
0.3207
0.329
0.3373
0.3261
0.3186
0.329
0.335
0.3417
0.33
0.3243
0.335
0.3417
0.349
0.3369
0.33
0.3417
0.349
0.3554
0.3427
0.3369
0.349
0.3554
0.362
0.3487
0.3427
0.3554
Bin code
1B
1C
2B
2C
3B
3C
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CIEx
0.3028
0.3115
0.313
0.3048
0.3028
0.3115
0.3205
0.3213
0.313
0.3115
0.3207
0.329
0.329
0.3215
0.3207
0.329
0.3376
0.3371
0.329
0.329
0.3376
0.3463
0.3451
0.3371
0.3376
0.3463
0.3551
0.3533
0.3451
0.3463
CIEy
0.3304
0.3391
0.329
0.3207
0.3304
0.3391
0.3481
0.3373
0.329
0.3391
0.3462
0.3538
0.3417
0.335
0.3462
0.3538
0.3616
0.349
0.3417
0.3538
0.3616
0.3687
0.3554
0.349
0.3616
0.3687
0.376
0.362
0.3554
0.3687
Bin code
1V
1X
2V
2X
3V
3X
CIEx
0.3005
0.3099
0.3115
0.3028
0.3005
0.3099
0.3196
0.3205
0.3115
0.3099
0.3196
0.329
0.329
0.3207
0.3196
0.329
0.3381
0.3376
0.329
0.329
0.3381
0.348
0.3463
0.3376
0.3381
0.348
0.3571
0.3551
0.3463
0.348
CIEy
0.3415
0.3509
0.3391
0.3304
0.3415
0.3509
0.3602
0.3481
0.3391
0.3509
0.3602
0.369
0.3538
0.3462
0.3602
0.369
0.3762
0.3616
0.3538
0.369
0.3762
0.384
0.3687
0.3616
0.3762
0.384
0.3907
0.376
0.3687
0.384
LZC-00CW0R (1.4-11/09/2018)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Luminous Flux Bins
Table 1:
Bin
Code
Minimum
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
(lm)
Maximum
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
(lm)
Typical
Luminous Flux (ΦV)
@ IF = 1000mA [2]
(lm)
B2
C2
D2
E2
F2
1.908
2,120
2,350
2,600
2,900
2,120
2,350
2,600
2,900
3,200
2,600
3,000
3,200
3,600
4,000
Notes for Table 1:
1.
Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.
2.
Luminous Flux typical value is for all 12 LED dice operating concurrently at rated current.
Forward Voltage Bins
Table 2:
Bin
Code
Minimum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
Maximum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
0
36.0
43.2
Notes for Table 2:
1.
LED Engin maintains a tolerance of ± 0.48V for forward voltage measurements.
2.
Forward Voltage is binned with 12 LED dice connected in series. The actual LED is configured with two strings of 6 dice in series.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Absolute Maximum Ratings
Table 3:
Parameter
Symbol
Value
Unit
DC Forward Current at Tjmax=130C [1]
DC Forward Current at Tjmax=150C [1]
Peak Pulsed Forward Current [2]
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature [4]
Allowable Reflow Cycles
IF
IF
IFP
VR
Tstg
TJ
Tsol
1200
1000
1500
See Note 3
-40 ~ +150
150
260
6
mA
mA
mA
V
°C
°C
°C
> 8,000 V HBM
Class 3B JESD22-A114-D
ESD Sensitivity [5]
Notes for Table 3:
1.
Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 10 for current derating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5.
5.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00CW40 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 4:
Parameter
Symbol
Typical
Unit
ΦV
ΦV
2350
3000
112
5500
>70
110
lm
lm
lm/W
K
[1]
Luminous Flux (@ IF = 700mA)
Luminous Flux (@ IF = 1000mA) [1]
Luminous Efficacy (@ IF = 350mA)
Correlated Color Temperature
Color Rendering Index (CRI)
Viewing Angle [2]
CCT
Ra
2Θ1/2
Degrees
Notes for Table 4:
1.
Luminous flux typical value is for all 12 LED dice operating concurrently at rated current.
2.
Viewing Angle is the off-axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
Electrical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 700mA)
Forward Voltage (@ IF = 1000mA) [1]
VF
VF
37.8
39.0
V
V
Temperature Coefficient
of Forward Voltage [1]
ΔVF/ΔTJ
-33.6
mV/°C
Thermal Resistance
(Junction to Case)
RΘJ-C
0.7
°C/W
[1]
Notes for Table 5:
1.
Forward Voltage is binned with 12 LED dice connected in series. The actual LED is configured with two strings of 6 dice in series.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
IPC/JEDEC Moisture Sensitivity Level
Table 6 - IPC/JEDEC J-STD-20.1 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 6:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and
includes the maximum time allowed out of the bag at the distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period.
Based on long-term LM80 testing, LED Engin projects that the LZC Series will deliver, on average, 70% Lumen
Maintenance at 70,000 hours of operation at a forward current of 700 mA per die. This projection is based on
constant current operation with junction temperature maintained at or below 110°C.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Mechanical Dimensions (mm)
Pin Out
Pad
Channel
Function
2
1
Anode
3
1
Anode
5
2
Anode
6
2
Anode
14
2
Cathode
15
2
Cathode
17
1
Cathode
18
1
Cathode
Figure 1: Package outline drawing.
Notes for Figure 1:
1.
LZC-00CW0R is compatible with MCPCB designed for LZC-00WW00, LZC-00NW00, and LZC-00CW00 when emitter is rotated 180 degree with respect to the
LZC-00xW00 position on the MCPCB.
2.
Index mark, Tc indicates case temperature measurement point.
3.
Unless otherwise noted, the tolerance = ± 0.20 mm.
4.
Thermal contact pad is electrically neutral.
Recommended Solder Pad Layout (mm)
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad.
Note for Figure 2a:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Recommended 8mil Stencil Apertures Layout (mm)
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad.
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Typical Radiation Pattern
100
90
Relative Intensity (%)
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern.
Typical Relative Spectral Power Distribution
1
Relative Spectral Power
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
350
400
450
500
550
600
650
700
750
800
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Typical Relative Light Output over Forward Current
160%
140%
Relatiive Light Output
120%
100%
80%
60%
40%
20%
0%
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 6: Typical relative light output vs. forward current @ TC = 25°C.
Notes for Figure 6:
1.
Luminous Flux typical value is for all 12 LED dice operating concurrently at rated current.
Typical Relative Light Output over Temperature
Relatiive Light Output (%)
110
100
90
80
70
60
0
10
20
30
40
50
60
70
80
90
100
Case Temperature (°C)
Figure 7: Typical relative light output vs. case temperature.
Notes for Figure 7:
1.
Luminous Flux typical value is for all 12 LED dice operating concurrently at rated current.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Typical Forward Current Characteristics
1400
IF - Forward Current (mA)
1200
1000
800
600
400
200
0
31.0
33.0
35.0
37.0
39.0
41.0
43.0
VF - Forward Voltage (V)
Figure 8: Typical forward current vs. forward voltage @ TC = at 25°C.
Note for Figure 8:
1.
Forward Voltage assumes 12 LED dice connected in series. The actual LED is configured with two strings of 6 dice in series.
Current De-rating
IF - Maximum Current (mA)
1200
1000
800
700
(Rated)
600
400
RΘJ-A = 2.0°C/W
RΘJ-A = 3.0°C/W
RΘJ-A = 4.0°C/W
200
0
0
25
50
75
100
125
150
Maximum Ambient Temperature (°C)
Figure 9: Maximum forward current vs. ambient temperature based on TJ(MAX) = 150°C.
Notes for Figure 9:
1.
Maximum current assumes that all LED dice are operating concurrently at the same current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZC-00CW0R is typically 0.7°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Emitter Tape and Reel Specifications (mm)
Figure 10: Emitter carrier tape specifications (mm).
Figure 11: Emitter Reel specifications (mm).
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
LZC MCPCB Family
Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
Part number
Type of MCPCB
Diameter
(mm)
LZC-7xxxxx
1-channel
28.3
0.7 + 0.6 = 1.3
37.8
700
LZC-Cxxxxx
2-channel
28.3
0.7 + 0.6 = 1.3
18.9
2 x 700
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LZC-7xxxxx
1-Channel MCPCB Mechanical Dimensions (mm)
Tc
Notes:
• Unless otherwise noted, the tolerance = ± 0.2 mm.
• Slots in MCPCB are for M3 or #4-40 mounting screws.
• LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
• Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode.
• LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.
• The thermal resistance of the MCPCB is: RΘC-B 0.6°C/W
Components used
MCPCB:
ESD chips:
HT04503
BZX585-C51
(Bergquist)
(NPX, for 12 LED dies in series)
Pad layout
Ch.
1
MCPCB
Pad
+
-
String/die
Function
1/BCEFGHJ
KLMPQ
Anode +
Cathode -
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
LZC-Cxxxxx
2 channel, Star MCPCB (2x6) Dimensions (mm)
Tc
Notes:
•
Unless otherwise noted, the tolerance = ± 0.2 mm.
•
Slots in MCPCB are for M3 or #4-40 mounting screws.
•
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
•
Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode.
•
LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink.
•
The thermal resistance of the MCPCB is: RΘC-B 0.6°C/W
Components used
MCPCB:
ESD chips:
HT04503
BZT52C36LP
(Bergquist)
(NPX, for 6 LED dies in series)
Pad layout
Ch.
1
2
MCPCB
Pad
1+
12+
2-
String/die
1/JKLMPQ
2/BCEFGH
Function
Anode +
Cathode Anode +
Cathode -
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Application Guidelines
MCPCB Assembly Recommendations
A good thermal design requires an efficient heat transfer from the MCPCB to the heat sink. In order to minimize air
gaps in between the MCPCB and the heat sink, it is common practice to use thermal interface materials such as
thermal pastes, thermal pads, phase change materials and thermal epoxies. Each material has its pros and cons
depending on the design. Thermal interface materials are most efficient when the mating surfaces of the MCPCB
and the heat sink are flat and smooth. Rough and uneven surfaces may cause gaps with higher thermal resistances,
increasing the overall thermal resistance of this interface. It is critical that the thermal resistance of the interface is
low, allowing for an efficient heat transfer to the heat sink and keeping MCPCB temperatures low.
When optimizing the thermal performance, attention must also be paid to the amount of stress that is applied on
the MCPCB. Too much stress can cause the ceramic emitter to crack. To relax some of the stress, it is advisable to
use plastic washers between the screw head and the MCPCB and to follow the torque range listed below. For
applications where the heat sink temperature can be above 50oC, it is recommended to use high temperature and
rigid plastic washers, such as polycarbonate or glass-filled nylon.
LED Engin recommends the use of the following thermal interface materials:
1.
Bergquist’s Gap Pad 5000S35, 0.020in thick
Part Number: Gap Pad® 5000S35 0.020in/0.508mm
Thickness: 0.020in/0.508mm
Thermal conductivity: 5 W/m-K
Continuous use max temperature: 200°C
Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the
recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m)
2.
3M’s Acrylic Interface Pad 5590H
Part number: 5590H @ 0.5mm
Thickness: 0.020in/0.508mm
Thermal conductivity: 3 W/m-K
Continuous use max temperature: 100°C
Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the
recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m)
Mechanical Mounting Considerations
The mounting of MCPCB assembly is a critical process step. Excessive mechanical stress build up in the MCPCB can
cause the MCPCB to warp which can lead to emitter substrate cracking and subsequent cracking of the LED dies
LED Engin recommends the following steps to avoid mechanical stress build up in the MCPCB:
o Inspect MCPCB and heat sink for flatness and smoothness.
o Select appropriate torque for mounting screws. Screw torque depends on the MCPCB mounting
method (thermal interface materials, screws, and washer).
o Always use three M3 or #4-40 screws with #4 washers.
o When fastening the three screws, it is recommended to tighten the screws in multiple small
steps. This method avoids building stress by tilting the MCPCB when one screw is tightened in a
single step.
o Always use plastic washers in combinations with the three screws. This avoids high point contact
stress on the screw head to MCPCB interface, in case the screw is not seated perpendicular.
o In designs with non-tapped holes using self-tapping screws, it is common practice to follow a
method of three turns tapping a hole clockwise, followed by half a turn anti-clockwise, until the
appropriate torque is reached.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Wire Soldering
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
About LED Engin
LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED
emitters, optics and light engines to create uncompromised lighting experiences for a wide range of
entertainment, architectural, general lighting and specialty applications. LuxiGenTM multi-die emitter and
secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a
target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented
compact ceramic package. Our LuxiTuneTM series of tunable white lighting modules leverage our LuxiGen emitters
and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of
new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional
light is required. LED Engin is committed to providing products that conserve natural resources and reduce
greenhouse emissions; and reserves the right to make changes to improve performance without notice.
For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200.
COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
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