DR1040-100-R

Technical Data 4147 Effective April 2016 Supersedes March 2007 DR1040 Shielded power inductors Applications • LED/LCD backlighting • High definition televisions (HDTV) • Server and desktop power supplies • Portable electronics • Graphics cards and battery powered systems • Point-of-load (POL) modules • Printers and peripherals Environmental Data Description • Shielded drum core • Inductance range from 1.4 μH to 323 μH • Current range from 0.52 A to 10 A • 10.5 mm x 10.3 mm footprint surface mount package in a 4.0 mm height • Ferrite core material • Halogen free, lead free, RoHS compliant • Storage temperature range (Component): • -40 °C to +125 °C • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) • Solder reflow temperature: J-STD-020D compliant HALOGEN Pb HF FREE DR1040 Shielded power inductors  Technical Data 4147 Effective April 2016 Product Specifications OCL1 (μH) ±30% Irms2 (A) Isat2 (A) DCR (mΩ) typical @ 20°C DCR (mΩ) maximum @ 20°C K-factor4 DR1040-1R5-R 1.35 6.5 10 6.0 8.1 15.5 DR1040-2R5-R 2.4 6.1 7.8 7.0 9.0 12.0 DR1040-3R8-R 3.6 5.5 6.4 9.6 13 9.9 DR1040-5R2-R 5.2 5.4 5.5 14 17 8.3 DR1040-7R0-R 6.8 4.5 4.8 17 20 7.2 DR1040-8R2-R 8.1 3.98 4.6 24 29 6.4 DR1040-100-R 9.6 3.8 4.4 26 35 5.7 DR1040-150-R 14.9 3.1 3.6 37 50 4.7 DR1040-220-R 21.1 ±20% 2.5 2.9 54 73 4.0 DR1040-330-R 32.6 2.2 2.45 69 93 3.3 DR1040-470-R 45.8 1.9 2.1 95 128 2.8 DR1040-680-R 65.3 1.42 1.65 152 183 2.3 DR1040-820-R 87 1.29 1.47 214 260 2.0 DR1040-101-R 101 1.25 1.35 225 304 1.9 DR1040-151-R 148 0.85 1.15 356 430 1.6 DR1040-221-R 216 0.70 0.92 530 640 1.3 DR1040-331-R 323 0.52 0.70 810 1090 1.0 Part Number 5 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc, +25 ºC 2. Irms: DC current for an approximate temperature rise of 30 ºC without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125 ºC under worst case operating conditions verified in the end application. 3. Isat: Peak current for approximately 35% rolloff @ +25 ºC 4. K-factor: K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p: (mT), K: (K-factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps).. 5. Part Number Definition: DR1040-xxx-R DR1040 = Product code and size -xxx= inductance value in μH, R= decimal point, If no R is present then last character equals number of zeros -R suffix = RoHS compliant Dimensions (mm) Part marking: inductance value in uH. R = decimal point. If no R is present then last character equals number of zeroes. wwlly = date code, R = revision level Do not route traces or vias underneath the inductor 2 www.eaton.com/elx DR1040 Shielded power inductors Technical Data 4147 Effective April 2016  Packaging information (mm) Supplied in tape and reel packaging , 850 parts per 13” diameter reel Temperature rise vs. total loss Temperature Rise ( ) 120 100 80 60 40 20 0 0 0.2 0.4 0.6 0.8 1 1.2 Total Loss (W) www.eaton.com/elx 3 DR1040 Shielded power inductors  Technical Data 4147 Effective April 2016 Core loss vs. Bp-p 1 MHz 10 500 kHz 300 kHz 200 kHz 100 kHz Core Loss (W) 1 0.1 0.01 0.001 1 10 Bp-p (mT) 100 1000 Inductance characteristics %OCL vs. Isat 120% 100% % of OCL 80% 60% 40% -40 °C +25 °C +85 °C 20% 0% 0% 20% 40% 60% 80% % of Isat 4 www.eaton.com/elx 100% 120% 140% 160% DR1040 Shielded power inductors Technical Data 4147 Effective April 2016  Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3