LZ4-40G108-0G23

Green LED Emitter LZ4-00G108 Key Features  High Luminous Efficacy 10W Green LED  Ultra-small foot print – 7.0mm x 7.0mm  Surface mount ceramic package with integrated glass lens  Low Thermal Resistance (2.8°C/W)  Individually addressable die  Very high Luminous Flux density  JEDEC Level 1 for Moisture Sensitivity Level  Autoclave compliant (JEDEC JESD22-A102-C)  Lead (Pb) free and RoHS compliant  Reflow solderable (up to 6 cycles)  Emitter available on Serially Connected MCPCB (optional) Typical Applications  Architectural lighting  Automotive and Marine lighting  Stage and Studio lighting  Buoys  Beacons  Airfield lighting and signs Description The LZ4-00G108 Green LED emitter provides 10W power in an extremely small package. With a 7.0mm x 7.0mm ultra-small footprint, this package provides exceptional luminous flux density. LED Engin’s LZ4-00G108 LED offers ultimate design flexibility with individually addressable die. The patent-pending design has unparalleled thermal and optical performance. The high quality materials used in the package are chosen to optimize light output and minimize stresses which results in monumental reliability and lumen maintenance. The robust product design thrives in outdoor applications with high ambient temperatures and high humidity. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Part number options Base part number Part number Description LZ4-00G108-xxxx LZ4 emitter LZ4-40G108-xxxx LZ4 emitter on Standard Star 1 channel MCPCB Bin kit option codes G1, Green (525nm) Kit number suffix Min flux Bin Color Bin Range 0000 T G2 – G4 0G23 T G2 – G3 Description full distribution flux; full distribution wavelength full distribution flux; wavelength G2 and G3 bins Notes: 1. Default bin kit option is -0000 COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 2 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Luminous Flux Bins Table 1: Bin Code Minimum Luminous Flux (ΦV) @ IF = 700mA [1,2] (lm) Maximum Luminous Flux (ΦV) @ IF = 700mA [1,2] (lm) T 445 556 U 556 695 V 695 868 Notes for Table 1: 1. Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements. 2. Future products will have even higher levels of luminous flux performance. Contact LED Engin Sales for updated information. Dominant Wavelength Bins Table 2: Bin Code Minimum Dominant Wavelength (λD) @ IF = 700mA [1,2,3] (nm) Maximum Dominant Wavelength (λD) @ IF = 700mA [1,2,3] (nm) G2 520 525 G3 525 530 G4 530 535 Notes for Table 2: 1. Dominant wavelength is derived from the CIE 1931 Chromaticity Diagram and represents the perceived hue. 2. LED Engin maintains a tolerance of ± 1.0nm on dominant wavelength measurements. 3. Refer to Figure 6 for typical dominant wavelength shift over forward current. Forward Voltage Bins Table 3: Bin Code Minimum Forward Voltage (VF) @ IF = 700mA [1,2] (V) Maximum Forward Voltage (VF) @ IF = 700mA [1,2] (V) 0 12.8 16.8 Notes for Table 3: 1. Forward Voltage is binned with all four LED dice connected in series. 2. LED Engin maintains a tolerance of ± 0.16V for forward voltage measurements for the four LEDs. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 3 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Absolute Maximum Ratings Table 4: Parameter Symbol Value Unit IF IFP VR Tstg TJ Tsol 1000 1500 See Note 3 -40 ~ +150 150 260 6 mA mA V °C °C °C [1] DC Forward Current Peak Pulsed Forward Current [2] Reverse Voltage Storage Temperature Junction Temperature Soldering Temperature [4] Allowable Reflow Cycles Autoclave Conditions [5] 121°C at 2 ATM, 100% RH for 168 hours ESD Sensitivity [6] > 1,000 V HBM Class 1C JESD22-A114-D Notes for Table 4: 1. Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 11 for current derating. 2: Pulse forward current conditions: Pulse Width ≤ 10msec and Duty cycle ≤ 10%. 3. LEDs are not designed to be reverse biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3. 5. Autoclave Conditions per JEDEC JESD22-A102-C. 6. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00G108 in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @ TC = 25°C Table 5: Parameter Symbol Typical Unit ΦV ΦV λD 2Θ1/2 Θ0.9V 640 835 523 100 120 lm lm nm Degrees Degrees [1] Luminous Flux (@ IF = 700mA) Luminous Flux (@ IF = 1000mA) [1] Dominant Wavelength (@ IF = 350mA) [2] Viewing Angle [3] Total Included Angle [4] Notes for Table 5: 1. Luminous flux typical value is for all four LED dice operating concurrently at rated current. 2. Refer to Figure 6 for typical dominant wavelength shift over forward current. 3. Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value. 4. Total Included Angle is the total angle that includes 90% of the total luminous flux. Electrical Characteristics @ TC = 25°C Table 6: Parameter Symbol Typical Unit Forward Voltage (@ IF = 700mA) [1] Forward Voltage (@ IF = 1000mA) [1] VF VF 14.4 15.0 V V Temperature Coefficient of Forward Voltage [1] ΔVF/ΔTJ -10.2 mV/°C Thermal Resistance (Junction to Case) RΘJ-C 2.8 °C/W Notes for Table 6: 1. Forward Voltage typical value is for all four LED dice connected in series. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 4 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin IPC/JEDEC Moisture Sensitivity Level Table 7 - IPC/JEDEC J-STD-20 MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 Unlimited ≤ 30°C/ 85% RH 168 +5/-0 85°C/ 85% RH n/a n/a Notes for Table 7: 1. The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility. Average Lumen Maintenance Projections Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original light output remaining at a defined time period. Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen Maintenance at 65,000 hours of operation at a forward current of 700 mA per die. This projection is based on constant current operation with junction temperature maintained at or below 125°C. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 5 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Mechanical Dimensions (mm) Pin Out Pad Die 1 A Anode 2 A Cathode 3 B Anode 4 B Cathode 5 C Anode 6 C Cathode 7 D Anode 8 D Cathode 9 [2] n/a Thermal 1 Figure 1: Package outline drawing. Notes for Figure 1: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Thermal contact, Pad 9, is electrically neutral. Function 2 3 8 4 7 6 5 Recommended Solder Pad Layout (mm) Non-pedestal MCPCB Design Pedestal MCPCB Design Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad for non-pedestal and pedestal design Note for Figure 2a: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate t he high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance. 3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure rates due to thermal over stress. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 6 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Recommended Solder Mask Layout (mm) Non-pedestal MCPCB Design Pedestal MCPCB Design Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design Note for Figure 2b: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. Recommended 8 mil Stencil Apertures Layout (mm) Non-pedestal MCPCB Design Pedestal MCPCB Design Figure 2c: Recommended 8mil stencil apertures for anode, cathode, and thermal pad for non-pedestal and pedestal design Note for Figure 2c: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 7 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Reflow Soldering Profile Figure 3: Reflow soldering profile for lead free soldering. Typical Radiation Pattern 100 90 Relative Intensity (%) 80 70 60 50 40 30 20 10 0 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Angle (degree) Figure 4: Typical representative spatial radiation pattern. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 8 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Relative Spectral Power Distribution 1 Relative Spectral Power 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 450 500 550 600 650 700 Wavelength (nm) Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C. Typical Forward Current Characteristics 1200 IF - Forward Current (mA) 1000 800 600 400 200 0 12 12.5 13 13.5 14 14.5 15 15.5 16 VF - Forward Voltage (V) Figure 6: Typical forward current vs. forward voltage @ T C = at 25°C. Note for Figure 6: 1. Forward Voltage curve assumes that all four LED dice are connected in series. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 9 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Relative Light Output over Forward Current 140 Relative Light Output (%) 120 100 80 60 40 20 0 0 200 400 600 800 1000 IF - Forward Current (mA) Figure 7: Typical relative light output vs. forward current @ T C = 25°C. Typical Relative Light Output over Temperature 120 Relative Light Output (%) 100 80 60 40 20 0 0 25 50 75 100 125 150 Case Temperature (ºC) Figure 8: Typical relative light output vs. case temperature. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 10 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Relative Dominant Wavelength Shift over Forward Current Relative Dominant Wavlength (nm) 1 0 -1 -2 -3 -4 -5 -6 -7 300 400 500 600 700 800 900 1000 1100 IF - Forward Current (mA) Figure 9: Typical relative dominant wavelength shift vs. forward current @ TC = 25°C. Typical Relative Dominant Wavelength Shift over Temperature Relative Dominant Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 0 25 50 75 100 125 150 Case Temperature (ºC) Figure 10: Typical relative dominant wavelength shift vs. case temperature. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 11 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Current De-rating IF - Maximum Current (mA) 1200 1000 800 700 (Rated) 600 RΘJ-A = 4.0°C/W RΘJ-A = 5.0°C/W RΘJ-A = 6.0°C/W 400 200 0 0 25 50 75 100 125 150 Maximum Ambient Temperature (°C) Figure 11: Maximum forward current vs. ambient temperature based on T J(MAX) = 150°C. Notes for Figure 11: 1. Maximum current assumes that all four LED dice are operating concurrently at the same current. 2. RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00G108 is typically 2.8°C/W. 3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance]. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 12 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Emitter Tape and Reel Specifications (mm) Figure 12: Emitter carrier tape specifications (mm). Figure 13: Emitter Reel specifications (mm). COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 13 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZ4 MCPCB Family Part number Type of MCPCB Diameter (mm) LZ4-4xxxxx 1-channel 19.9 Emitter + MCPCB Typical Vf Typical If Thermal Resistance (V) (mA) (oC/W) 2.8 + 1.1 = 3.9 14.4 700 Mechanical Mounting of MCPCB   MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to substrate cracking and subsequently LED dies cracking. To avoid MCPCB bending: o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws. o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3 screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will increase the likelihood of board bending. o It is recommended to always use plastics washers in combinations with the three screws. o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after tightening (with controlled torque) and then re-tighten the screws again. Thermal interface material    To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when mounting the MCPCB on to the heat sink. There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal epoxies. An example of such material is Electrolube EHTC. It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating conditions. Wire soldering   To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601) COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 14 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZ4-4xxxxx 1 channel, Standard Star MCPCB (1x4) Dimensions (mm) Notes:  Unless otherwise noted, the tolerance = ± 0.2 mm.  Slots in MCPCB are for M3 or #4-40 mounting screws.  LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.  LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink  The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W Components used MCPCB: ESD chips: HT04503 BZX585-C30 (Bergquist) (NXP, for 4 LED dies in series) Pad layout Ch. 1 MCPCB Pad 1, 2, 3 4, 5 String/die Function 1/ABCD Cathode Anode + COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 15 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin About LED Engin LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and light engines to create uncompromised lighting experiences for a wide range of TM entertainment, architectural, general lighting and specialty applications. LuxiGen multi-die emitter and secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented TM compact ceramic package. Our LuxiTune series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required. LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions; and reserves the right to make changes to improve performance without notice. For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G108 (1.5 - 11/19/2018) 16 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin