High Luminous Flux Density
Cool White LED Emitter
LZC-00CW00
Key Features
High Luminous Flux Density 12-die Cool White LED
More than 40 Watt power dissipation capability
Small foot print – 9.0mm x 9.0mm
Industry lowest thermal resistance per package size (0.7°C/W)
Surface mount ceramic package with integrated glass lens
Spatial color uniformity across radiation pattern
Excellent Color Rendering Index
JEDEC Level 1 for Moisture Sensitivity Level
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available with several MCPCB options
Full suite of TIR secondary optics family available
Typical Applications
General lighting
Down lighting
Architectural lighting
Street lighting
Stage and Studio lighting
Refrigeration lighting
Portable lighting
Description
The LZC-series 12-die White LED emitter has an electrical input power dissipation capability of more than 40 Watt
electrical power in an extremely small package. With a small 9.0mm x 9.0mm ultra-small footprint, this package
provides exceptional luminous flux density. LED Engin’s patent-pending thermally insulated phosphor layer
provides a spatial color uniformity across the radiation pattern and a consistent CCT over time and temperature.
The high quality materials used in the package are chosen to minimize stresses and optimize light output which
results in superior reliability and lumen maintenance. The robust product design thrives in outdoor applications
with high ambient temperatures and high humidity.
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Part number options
Base part number
Part number
Description
LZC-00CW00-xxxx
LZC emitter
LZC-70CW00-xxxx
LZC emitter on 1 channel 1x12 Star MCPCB
LZC-C0CW00-xxxx
LZC emitter on 2 channel 2x6 Star MCPCB
LZC-E0CWT1-xxxx
LZC emitter on 1 channel 1x12 Connectorized MCPCB
LZC-F0CWT1-xxxx
LZC emitter on 1 channel 2x6 Connectorized MCPCB
Bin kit option codes
CW, Cool-White (5000K – 6500K)
Kit number
suffix
Min
flux
Bin
Color Bin Ranges
Description
0000
Z
1U, 1A, 1B, 1V, 1Y, 1D, 1C, 1X, 2U, 2A, 2B, 2V, 2Y,
2D, 2C, 2X, 3U, 3A, 3B, 3V, 3Y, 3D, 3C, 3X
full distribution flux; full distribution CCT
C000
C2
1U, 1A, 1B, 1V, 1Y, 1D, 1C, 1X, 2U, 2A, 2B, 2V, 2Y,
2D, 2C, 2X, 3U, 3A, 3B, 3V, 3Y, 3D, 3C, 3X
C2 minimum flux bin; full distribution CCT
0050
Z
2Y, 2D, 2C, 2X, 3U, 3A, 3B, 3V, 3Y, 3D, 3C, 3X
full distribution flux; 5000K ANSI CCT bin
C050
C2
2Y, 2D, 2C, 2X, 3U, 3A, 3B, 3V, 3Y, 3D, 3C, 3X
C2 minimum flux bin; 5000K ANSI CCT bin
0055
Z
2U, 2Y, 3U, 2A, 2D, 3A, 2B, 2C, 3B, 2V, 2X, 3V
full distribution flux; 5500K ANSI CCT bin
C055
C2
2U, 2Y, 3U, 2A, 2D, 3A, 2B, 2C, 3B, 2V, 2X, 3V
C2 minimum flux bin; 5500K ANSI CCT bin
0056
Z
1Y, 1D, 1C, 1X, 2U, 2A, 2B, 2V, 2Y, 2D, 2C, 2X
full distribution flux; 5600K ANSI CCT bin
C056
C2
1Y, 1D, 1C, 1X, 2U, 2A, 2B, 2V, 2Y, 2D, 2C, 2X
C2 minimum flux bin; 5600K ANSI CCT bin
0065
Z
1U, 1A, 1B, 1V, 1Y, 1D, 1C, 1X, 2U, 2A, 2B, 2V
full distribution flux; 6500K ANSI CCT bin
C065
C2
1U, 1A, 1B, 1V, 1Y, 1D, 1C, 1X, 2U, 2A, 2B, 2V
C2 minimum flux bin; 6500K ANSI CCT bin
Notes:
1.
Default bin kit option is -0000
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
2
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Cool White Chromaticity Groups
0.40
0.38
3X
3V
3C
2X
0.36
3B
2V
2C
CIEy
1X
2B
0.34
1V
1A
3Y
2D
3U
2A
1D
Planckian Locus
3A
1C
1B
0.32
3D
2Y
2U
1Y
1U
0.30
0.28
0.28
0.30
0.32
0.34
0.36
0.38
CIEx
Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below in the table.
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
3
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Cool White Bin Coordinates
Bin code
1U
1Y
2U
2Y
3U
3Y
CIEx
0.3068
0.3144
0.3161
0.3093
0.3068
0.3144
0.3221
0.3231
0.3161
0.3144
0.3222
0.329
0.329
0.3231
0.3222
0.329
0.3366
0.3361
0.329
0.329
0.3366
0.344
0.3429
0.3361
0.3366
0.344
0.3515
0.3495
0.3429
0.344
CIEy
0.3113
0.3186
0.3059
0.2993
0.3113
0.3186
0.3261
0.312
0.3059
0.3186
0.3243
0.33
0.318
0.312
0.3243
0.33
0.3369
0.3245
0.318
0.33
0.3369
0.3428
0.3299
0.3245
0.3369
0.3428
0.3487
0.3339
0.3299
0.3428
Bin code
1A
1D
2A
2D
3A
3D
CIEx
0.3048
0.313
0.3144
0.3068
0.3048
0.313
0.3213
0.3221
0.3144
0.313
0.3215
0.329
0.329
0.3222
0.3215
0.329
0.3371
0.3366
0.329
0.329
0.3371
0.3451
0.344
0.3366
0.3371
0.3451
0.3533
0.3515
0.344
0.3451
CIEy
0.3207
0.329
0.3186
0.3113
0.3207
0.329
0.3373
0.3261
0.3186
0.329
0.335
0.3417
0.33
0.3243
0.335
0.3417
0.349
0.3369
0.33
0.3417
0.349
0.3554
0.3427
0.3369
0.349
0.3554
0.362
0.3487
0.3427
0.3554
Bin code
1B
1C
2B
2C
3B
3C
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
CIEx
0.3028
0.3115
0.313
0.3048
0.3028
0.3115
0.3205
0.3213
0.313
0.3115
0.3207
0.329
0.329
0.3215
0.3207
0.329
0.3376
0.3371
0.329
0.329
0.3376
0.3463
0.3451
0.3371
0.3376
0.3463
0.3551
0.3533
0.3451
0.3463
CIEy
0.3304
0.3391
0.329
0.3207
0.3304
0.3391
0.3481
0.3373
0.329
0.3391
0.3462
0.3538
0.3417
0.335
0.3462
0.3538
0.3616
0.349
0.3417
0.3538
0.3616
0.3687
0.3554
0.349
0.3616
0.3687
0.376
0.362
0.3554
0.3687
Bin code
1V
1X
2V
2X
3V
3X
CIEx
0.3005
0.3099
0.3115
0.3028
0.3005
0.3099
0.3196
0.3205
0.3115
0.3099
0.3196
0.329
0.329
0.3207
0.3196
0.329
0.3381
0.3376
0.329
0.329
0.3381
0.348
0.3463
0.3376
0.3381
0.348
0.3571
0.3551
0.3463
0.348
CIEy
0.3415
0.3509
0.3391
0.3304
0.3415
0.3509
0.3602
0.3481
0.3391
0.3509
0.3602
0.369
0.3538
0.3462
0.3602
0.369
0.3762
0.3616
0.3538
0.369
0.3762
0.384
0.3687
0.3616
0.3762
0.384
0.3907
0.376
0.3687
0.384
LZC-00CW00 (5.2-07/01/13)
4
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Luminous Flux Bins
Table 1:
Bin
Code
Minimum
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
(lm)
Maximum
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
(lm)
Typical
Luminous Flux (ΦV)
@ IF = 1000mA [2]
(lm)
Z
C2
1,696
2,120
2,120
2,350
2,400
3,000
Notes for Table 1:
1.
Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.
2.
Luminous Flux typical value is for all 12 LED dice operating concurrently at rated current.
Forward Voltage Bins
Table 2:
Bin
Code
Minimum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
Maximum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
0
38.40
47.04
Notes for Table 2:
1.
LED Engin maintains a tolerance of ± 0.48V for forward voltage measurements.
2.
Forward Voltage is binned with 12 LED dice connected in series. The actual LED is configured with two strings of 6 dice in series.
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
5
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Absolute Maximum Ratings
Table 3:
Parameter
Symbol
Value
Unit
DC Forward Current at Tjmax=130C [1]
DC Forward Current at Tjmax=150C [1]
Peak Pulsed Forward Current [2]
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature [4]
Allowable Reflow Cycles
IF
IF
IFP
VR
Tstg
TJ
Tsol
1200
1000
1500
See Note 3
-40 ~ +150
150
260
6
mA
mA
mA
V
°C
°C
°C
> 8,000 V HBM
Class 3B JESD22-A114-D
ESD Sensitivity [5]
Notes for Table 3:
1.
Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 10 for current derating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5.
5.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00CW40 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 4:
Parameter
Symbol
Typical
Unit
ΦV
ΦV
2100
2700
90
5500
>70
110
lm
lm
lm/W
K
[1]
Luminous Flux (@ IF = 700mA)
Luminous Flux (@ IF = 1000mA) [1]
Luminous Efficacy (@ IF = 350mA)
Correlated Color Temperature
Color Rendering Index (CRI)
Viewing Angle [2]
CCT
Ra
2Θ1/2
Degrees
Notes for Table 4:
1.
Luminous flux typical value is for all 12 LED dice operating concurrently at rated current.
2.
Viewing Angle is the off-axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
Electrical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 700mA)
Forward Voltage (@ IF = 1000mA) [1]
VF
VF
42.0
43.8
V
V
Temperature Coefficient
of Forward Voltage [1]
ΔVF/ΔTJ
-33.6
mV/°C
Thermal Resistance
(Junction to Case)
RΘJ-C
0.7
°C/W
[1]
Notes for Table 5:
1.
Forward Voltage is binned with 12 LED dice connected in series. The actual LED is configured with two strings of 6 dice in series.
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
6
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
IPC/JEDEC Moisture Sensitivity Level
Table 6 - IPC/JEDEC J-STD-20.1 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 6:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and
includes the maximum time allowed out of the bag at the distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period.
Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen
Maintenance at 65,000 hours of operation at a forward current of 700 mA per die. This projection is based on
constant current operation with junction temperature maintained at or below 125°C.
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
7
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Mechanical Dimensions (mm)
Pin Out
Pad
Series
Function
2
1
Cathode
3
1
Cathode
5
2
Cathode
6
2
Cathode
14
2
Anode
15
2
Anode
17
1
Anode
18
1
Anode
17
2
18
3
14
5
15
6
Figure 1: Package outline drawing.
Notes for Figure 1:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Thermal contact, Pad is electrically neutral.
Recommended Solder Pad Layout (mm)
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad.
Note for Figure 2a:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
8
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Recommended Solder Mask Layout (mm)
Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad.
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
9
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Radiation Pattern
Figure 4: Typical representative spatial radiation pattern.
Typical Relative Spectral Power Distribution
1
Relative Spectral Power
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
350
400
450
500
550
600
650
700
750
800
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C.
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
10
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Relative Light Output
140
Relative Light Output (%)
120
100
80
60
40
20
0
0
200
400
600
800
1000
80
100
IF - Forward Current (mA)
Figure 6: Typical relative light output vs. forward current @ TC = 25°C.
Notes for Figure 6:
1.
Luminous Flux typical value is for all 12 LED dice operating concurrently at rated current.
Typical Relative Light Output over Temperature
120
Relative Light Output (%)
110
100
90
80
70
60
0
20
40
60
Case Temperature (°C)
Figure 7: Typical relative light output vs. case temperature.
Notes for Figure 7:
1.
Luminous Flux typical value is for all 12 LED dice operating concurrently at rated current.
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
11
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Forward Current Characteristics
1200
IF - Forward Current (mA)
1000
800
600
400
200
0
36
37
38
39
40
41
42
43
44
45
VF - Forward Voltage (V)
Figure 8: Typical forward current vs. forward voltage @ T C = at 25°C.
Note for Figure 8:
1.
Forward Voltage assumes 12 LED dice connected in series. The actual LED is configured with two strings of 6 dice in series.
Current De-rating
IF - Maximum Current (mA)
1200
1000
800
700
(Rated)
600
400
RΘJ-A = 2.0°C/W
RΘJ-A = 3.0°C/W
RΘJ-A = 4.0°C/W
200
0
0
25
50
75
100
125
150
Maximum Ambient Temperature (°C)
Figure 9: Maximum forward current vs. ambient temperature based on T J(MAX) = 150°C.
Notes for Figure 9:
1.
Maximum current assumes that all LED dice are operating concurrently at the same current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZC-00xx00 is typically 0.7°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
12
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Emitter Tape and Reel Specifications (mm)
Figure 10: Emitter carrier tape specifications (mm).
Figure 11: Emitter Reel specifications (mm).
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
13
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZC MCPCB Family
Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
Part number
Type of MCPCB
Diameter
(mm)
LZC-7xxxxx
1-channel
28.3
0.7 + 0.6 = 1.3
42.0
700
LZC-Cxxxxx
2-channel
28.3
0.7 + 0.6 = 1.3
21.0
2 x 700
49.5
0.7 + 0.6 = 1.3
42.0
700
49.5
0.7 + 0.6 = 1.3
21.0
1400
LZC-ExxxT1
LZC-FxxxT1
1-channel
(1 x 12 string)
1-channel
(2 x 6 strings)
Mechanical Mounting of MCPCB
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
To avoid MCPCB bending:
o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o It is recommended to always use plastics washers in combinations with the three screws.
o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
14
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZC-7xxxxx
1 channel, Star MCPCB (1x12) Dimensions (mm)
Tc
Notes:
• Unless otherwise noted, the tolerance = ± 0.2 mm.
• Slots in MCPCB are for M3 or #4-40 mounting screws.
• LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
• Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode.
• LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.
• The thermal resistance of the MCPCB is: RΘC-B 0.6°C/W
Components used
MCPCB:
ESD chips:
HT04503
BZX585-C51
(Bergquist)
(NXP, for 12 LED dies in series)
Pad layout
Ch.
1
MCPCB
Pad
+
-
String/die
Function
1/BCEFGHJ
KLMPQ
Anode +
Cathode -
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
15
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZC-Cxxxxx
2 channel, Star MCPCB (2x6) Dimensions (mm)
Tc
Notes:
•
Unless otherwise noted, the tolerance = ± 0.2 mm.
•
Slots in MCPCB are for M3 or #4-40 mounting screws.
•
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
•
Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode.
•
LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink.
•
The thermal resistance of the MCPCB is: RΘC-B 0.6°C/W
Components used
MCPCB:
ESD chips:
HT04503
(Bergquist)
BZT52C36LP-36 (Diodes, Inc, for 6 LED dies in series)
Pad layout
Ch.
1
MCPCB
Pad
+
-
String/die
Function
1/BCEFGHJ
KLMPQ
Anode +
Cathode -
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
16
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZC-ExxxT1
1 channel, Connectorized MCPCB with Thermistor (1x12) Dimensions (mm)
Note for Figure 1:
•
Unless otherwise noted, the tolerance = ± 0.2 mm. angle = ± 1°
•
Slots in MCPCB are for M3 or #4-40 mounting screws. Maximum torque should not exceed 1N-m ( 8.9 lbf-in)
•
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
•
LED Engin recommends using thermally interface material when attaching the MCPCB to a heatsink
•
For the connectors it is recommended to use solid wires with gauge size, 18, 20 or 22 AWG. It is recommended to strip the insulation of the wires to a length
of 4-5mm. When stranded wires are used it is recommended to twists the strands at the end of the wire and use wire extraction toll to insert the wires.
The thermal resistance of the MCPCB is: RΘC-B 0.6°C/W
Components used
MCPCB:
HT04503
ESD chips: BZX585-C51
Thermistor: NCP15WF104F03RC
Connectors: 00-9276-002-0-21-1-06
Ch.
1
T
Pad
LED1+
LED1NTC
NTC
Emitter pin
14, 15
2, 3
na
na
(Bergquist)
(NXP, for 12 LED dies in series)
(Murata, 100kOhm for the LZx-xxxxT1, please see
www.murata.com for details on calculating the thermistor
temperature)
(AVX, poke-home)
Function
Anode
Cathode
Anode
Cathode
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
17
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZC-FxxxT1
1 channel, Connectorized MCPCB with Thermistor (2x6) Dimensions (mm)
Note for Figure 1:
• Unless otherwise noted, the tolerance = ± 0.2 mm. angle = ± 1°
• Slots in MCPCB are for M3 or #4-40 mounting screws. Maximum torque should not exceed 1N-m ( 8.9 lbf-in)
• LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
• LED Engin recommends using thermally interface material when attaching the MCPCB to a heatsink
• For the connectors it is recommended to use solid wires with gauge size, 18, 20 or 22 AWG. It is recommended to strip the insulation of the
wires to a length of 4-5mm. When stranded wires are used it is recommended to twists the strands at the end of the wire and use wire
extraction toll to insert the wires.
The thermal resistance of the MCPCB is: RΘC-B 0.6°C/W
Components used
MCPCB:
ESD chips:
Thermistor:
HT04503
BZT52C36LP
NCP15WF104F03RC
Connectors:
00-9276-002-0-21-1-06
Ch.
1
T
Pad
LED1+
LED1NTC
NTC
Emitter pin
14, 15, 17, 18
2, 3, 5, 6
na
na
(Bergquist)
(NXP, for 6 LED dies in series)
(Murata, 100kOhm for the LZx-xxxxT1, please see
www.murata.com for details on calculating the thermistor
temperature)
(AVX, poke-home)
Function
Anode
Cathode
Anode
Cathode
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
18
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Appendix: Wire Insertion and Extraction Instructions AVX poke-home
For the AVX poke-home it is recommended to use solid wires with gauge size, 18, 20 or 22 AWG, but stranded wire
can be used as well. Push the wire in and then give slight tug on the wire to confirm that it is properly engaged.
Wire Insertion Solid conductor
Strip insulation length 4-5mm
Insert into appropriate hole to a stop
Inserted wire will be retained by contact
Wire Insertion Stranded wire conductor
Twist strands together
Insert tool into contact operation slot
Insert wire
Remove tool
Wire extraction
Insert tool into contact
Extract wire
Remove tool
Extraction Tool References:
Thin Blade Wire Extraction Tool: AVX P/N - 0692-7670-0101-000
Miniature Precision Screw Driver, 0.047” Tip Width
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
19
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Company Information
LED Engin, based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and
light engines to create uncompromised lighting experiences for a wide range of entertainment, architectural,
general lighting and specialty applications. LuxiGen™ multi-die emitter and secondary lens combinations reliably
deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors
including whites, tunable whites, multi-color and UV LEDs in a unique patented compact ceramic package. Our
LuxiTuneTM series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality,
control, freedom and high density tunable white light solutions for a broad range of new recessed and
downlighting applications. The small size, yet remarkably powerful beam output and superior in-source color
mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is
required.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
Please contact sales@ledengin.com or (408) 922-7200 for more information.
COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED.
LZC-00CW00 (5.2-07/01/13)
20
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com