CBM-360-W65S-D32-UB101

CBM-360 Product Datasheet CBM-360 LEDs Features: • Extremely high optical output: Over 5,000 lumens from a single package (white) Table of Contents • High thermal conductivity package - junction to heat sink thermal resistance of only 0.9 6°C/W Technology Overview. . . . . . 2 • Four large, monolithic chips with uniform emitting area of 36 mm2 Test Specifications . . . . . . . . . 2 • Unencapsulated die with low profile protective window optimizes optical coupling in etendue-limited applications White Binning Structure. . . . 3 • Lumen maintenance of greater than 70% after 60,000 hours Chromaticity Bins. . . . . . . . . . 4 • Variable drive current: less than 1 A through 6.3 A Product Shipping & Labeling Information. . . . . . . 5 • High reliability • Environmentally friendly: RoHS compliant Electrical Characteristics. . . 6 Lifetime & Lumen Maintenance. . . . . . . . . . . . . . . 7 Spectral Characteristics. . . . .7 Applications Radiation Patterns . . . . . . . . . 8 • Fiber-coupled Illumination • Machine Vision Thermal Resistance . . . . . . . . 9 • Architectural and Entertainment Lighting • Microscopy Mechanical Dimensions . . . 10 • Transportation • Medical Lighting Ordering Information . . . . . 11 1 PDS-001253 Rev 11 © 2013 Luminus Devices, Inc. - All Rights Reserved Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com 1100 Technology Park Drive • Billerica, MA 01821 CBM-360 Product Datasheet Technology Overview Luminus Big Chip LEDs™ benefit from a suite of innovations in the fields of chip technology, packaging and thermal management. These breakthroughs allow illumination engineers and designers to achieve solutions that are high brightness and high efficiency. Luminus Technology Reliability Luminus’ technology enables large area LED chips with uniform brightness over the entire LED chip surface. The optical power and brightness produced by these large monolithic chips enable solutions which replace arc and halogen lamps where arrays of traditional high power LEDs cannot. Designed from the ground up, Luminus Big Chip LEDs are one of the most reliable light sources in the world today. Big Chip LEDs have passed a rigorous suite of environmental and mechanical stress tests, including mechanical shock, vibration, temperature cycling and humidity, and have been fully qualified for use in extreme high power and high current applications. With very low failure rates and median lifetimes that typically exceed 60,000 hours, Luminus Big Chip LEDs are ready for even the most demanding applications. Packaging Technology Thermal management is critical in high power LED applications. With a thermal resistance from junction to heat sink of 0.96º C/W, Luminus CBM-360 LEDs have the lowest thermal resistance of any LED on the market. This allows the LED to be driven at higher current densities while maintaining a low junction temperature, thereby resulting in brighter solutions and longer lifetimes. Environmental Benefits Luminus LEDs help reduce power consumption and the amount of hazardous waste entering the environment. All Big Chip LED products manufactured by Luminus are RoHS compliant and free of hazardous materials, including lead and mercury. Understanding Big Chip LED Test Specifications Every Luminus LED is fully tested to ensure that it meets the high quality standards expected from Luminus’ products. Testing Temperature Multiple Operating Points Luminus core board products are typically measured in such a way that the characteristics reported agree with how the devices will actually perform when incorporated into a system. This measurement is accomplished by mounting the devices on a 40ºC heat sink and allowing the device to reach thermal equilibrium while fully powered. Only after the device reaches equilibrium are the measurements taken. This method of measurement ensures that Luminus Big Chip LEDs perform in the field just as they are specified. The tables on the following pages provide typical optical and electrical characteristics. Since the LEDs can be operated over a wide range of drive conditions (currents from less than 1A to 6.3A, and duty cycle from 70 Common Characteristics Parameter Emitting Area Emitting Area Dimensions Color Temperature 4 Color Rendering Index (Typical) Forward Voltage Temperature Coefficient4 -3.07 mV/ºC Absolute Maximum Ratings Parameter Symbol Maximum Current5 Maximum Junction Temperature 6 Storage Temperature Range Tj-max Values Unit 6.3 A 150 ºC -40/+100 ºC Note 1: All ratings are based on operation with a constant heat sink temperature Ths =40ºC. See Thermal Resistance section for Ths definition. Note 2: Listed drive conditions are typical for common applications. CBM-360-White devices can be driven at currents ranging from 1A to 6.3A and at duty cycles ranging from 1% to 100%. Drive current and duty cycle should be adjusted as necessary to maintain the junction temperature desired to meet application lifetime requirements. Note 3: Unless otherwise noted, values listed are typical. Note 4: CCT value based off of CIE measurement. CIE measurement uncertainty for white devices is estimated to be +/- 0.01. Note 5: Forward voltage temperature coefficient at current density of 0.70 A/mm2. Contact Luminus for value at other drive conditions. Note 6: CBM-360-White LED™ are designed for operation to an absolute maximum forward drive current density of 0.7 A/mm2. Product lifetime data is specified at recommended forward drive currents. Sustained operation at absolute maximum currents will result in a reduction of device lifetime compared to recommended forward drive currents. Actual device lifetimes will also depend on junction temperature. Refer to the lifetime derating curves for further information. In pulsed operation, rise time from 10-90% of forward current should be larger than 0.5 microseconds. Note 7: Lifetime dependent on LED junction temperature. Input power and thermal system must be properly managed to ensure lifetime. See charts on pg 7 for further information. Note 8: Special design considerations must be observed for operation under 1 A. Please contact Luminus for further information. Note 9: Caution must be taken not to stare at the light emitted from these LEDs. Under special circumstances, the high intensity could damage the eye. 6 PDS-001253 Rev 11 © 2013 Luminus Devices, Inc. - All Rights Reserved Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com 1100 Technology Park Drive • Billerica, MA 01821 CBM-360 Product Datasheet Relative Output Flux vs. Forward Current1 Forward Current vs. Forward Voltage 12 160% Relative Luminus Flux (%) 140% 9 120% Current (A) 100% 80% 60% 6 3 40% 20% 0% 0 0 2 4 Current (A) 6 13 8 14 Forward Voltage (V) 160 1.2 140 1.0 120 100 80 60 40 15 0.8 L70 0.6 0.4 0.2 20 0 1000 10000 0.0 100000 1 10 100 Median Lifetime Extrapolation (Hours) 1000 10000 100000 Time (hours) Typical Spectrum4 Current Derating Curve 16 1.2 14 1 LED Drive Current (A) Relative Spectral Power Distribution 14.5 Lumen Maintenance vs. Time3 Lumen Maintenance (%) Device Junction Temperature (°C) Mean Lifetime2 13.5 0.8 0.6 0.4 0.2 12 10 8 6 Rth Rth Rth Rth 4 2 0 400 450 500 550 600 650 j-a j-a j-a j-a = = = = 1.22 1.50 1.75 2.00 C/W C/W C/W C/W 0 700 0 Wavelength (nm) 20 40 60 80 100 120 140 Ambient Temperature (C) Note 1: Yellow squares indicate typical operating conditions. Note 2: Mean expected lifetime in dependence of junction temperature at 0.70 A/mm2 in continuous operation. Lifetime defined as time to 70% of initial intensity. Based on lifetime test data. Data can be used to model failure rate over typical product lifetime (contact Luminus for lifetime reliability test data for 1A/mm2 condition). Note 3: Lumen maintenance in dependence of time at 0.70A/mm2 in continuous operation with junction temperatures of 100 ºC. Note 4: Typical spectrum at current density of 0.70 A/mm2 in continuous operation. 7 PDS-001253 Rev 11 © 2013 Luminus Devices, Inc. - All Rights Reserved Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com 1100 Technology Park Drive • Billerica, MA 01821 CBM-360 Product Datasheet Relative Luminous Flux vs. Junction Temperature 100% Relative Luminous Flux (%) 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 25 50 75 100 125 150 Junction Temperature (°C) Typical Radiation Patterns Typical Polar Radiation Pattern for White Typical Angular Radiation Pattern for White 120% -30° 30° 100% -60° Relative Intensity (%) 80% 60° 60% 40% 20% -120% -100% -80% -60% -40% -20% 0% 20% 40% 60% 80% 100% 120% 0% -80 -60 -40 -20 0 20 40 60 80 Anglular Displacement (Degrees) 120° 240° 150° 210° 8 PDS-001253 Rev 11 © 2013 Luminus Devices, Inc. - All Rights Reserved Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com 1100 Technology Park Drive • Billerica, MA 01821 CBM-360 Product Datasheet Thermal Resistance Typical Thermal Resistance Window Tj Die Junction Rθj-b1 0.83 ºC/W Tb Window Frame Rθb-hs1 0.13 ºC/W Thermistor Rθj-hs2 0.96 ºC/W Rθj-ref1 0.69 ºC/W Tref Ths Copper Core-Board Thermal Interface Material Heat Sink Ta Note 1: Thermal resistance values are based on FEA model results correlated to measured Rθj-hs data. Note 2: Thermal resistance is measured using eGraf 1205 thermal interface material. Ths definition = 3 mm from core-board Thermistor Information Electrical Pinout The thermistor used in CBM-360 mounted on core-boards is from Murata Manufacturing Co. The global part number is NCP18XH103J03RB. Please see http://www.murata.com/ for details on calculating thermistor temperature. 1 2 9 PDS-001253 Rev 11 © 2013 Luminus Devices, Inc. - All Rights Reserved Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com 1100 Technology Park Drive • Billerica, MA 01821 CBM-360 Product Datasheet Mechanical Dimensions – CBM-360-W Emitter DIMENSIONS IN MILLIMETERS +0.07 3.00 - 0.00 .13 M A B 36.0±0.5 27.95 2x 3.4 FASTENER HOLES 0.26 M A B 3.2 METAL SUBSTRATE 1. 27.06 A B 1. B 11.24 10.76 5.50 +0.07 3.00 - 0.00 1. 36.0±0.5 51 A SERIAL NUMBER BAR CODE AREA 1.09±0.13 TOP OF SUBSTRATE (DATUM B ) 1. TO TOP OF GLASS 0.62±0.16 TO OF EMITTING AREA TO TOP OF GLASS A 14.2 0.47±0.05 TOP OF METAL SUBSTRATE (DATUM B) 1. TO EMITTING AREA 27.5 2.9 2.6 5.6 SECTION A-A DETAIL B Recommended connector ERNI MaxBridge p/n 284117 For detailed drawing please refer to DWG-001246 document 10 PDS-001253 Rev 11 © 2013 Luminus Devices, Inc. - All Rights Reserved Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com 1100 Technology Park Drive • Billerica, MA 01821 CBM-360 Product Datasheet Ordering Information Ordering Part Number 1,2 CBM-360-WDLS-D32-VB150 Color 6500K White 5700K White Description CBM-360 white Big Chip LED™ consisting of four 9 mm2 LEDs wired in series, thermistor, and 2-pin connector, on a copper-core PCB Note 1: VB150 - denotes a bin kit comprising of all flux bins with a minimum flux of 4,550 lumens and chromaticity bins at the 6500K color point. Note 2: For ordering information on all available bin kits, please see PDS-001834: CBM-360 Binning & Labeling document. Note 3: Standard packaging increment (SPI) is 10 for D32 configuration. The products, their specifications and other information appearing in this document are subject to change by Luminus Devices without notice. Luminus Devices assumes no liability for errors that may appear in this document, and no liability otherwise arising from the application or use of the product or information contained herein. None of the information provided herein should be considered to be a representation of the fitness or suitability of the product for any particular application or as any other form of warranty. Luminus Devices’ product warranties are limited to only such warranties as accompany a purchase contract or purchase order for such products. Nothing herein is to be construed as constituting an additional warranty. No information contained in this publication may be considered as a waiver by Luminus Devices of any intellectual property rights that Luminus Devices may have in such information. Big Chip LEDs™ is a registered trademark of Luminus Devices, Inc., all rights reserved. This product is protected by U.S. Patents 6,831,302; 7,074,631; 7,083,993; 7,084,434; 7,098,589; 7,105,861; 7,138,666; 7,166,870; 7,166,871; 7,170,100; 7,196,354; 7,211,831; 7,262,550; 7,274,043; 7,301,271; 7,341,880; 7,344,903; 7,345,416; 7,348,603; 7,388,233; 7,391,059 Patents Pending in the U.S. and other countries. 11 PDS-001253 Rev 11 © 2013 Luminus Devices, Inc. - All Rights Reserved Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com 1100 Technology Park Drive • Billerica, MA 01821