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SSM-80-W40M-T91-LA500

SSM-80-W40M-T91-LA500

  • 厂商:

    LUMINUS(朗明纳斯)

  • 封装:

    LED-3P_11X10MM_SM

  • 描述:

    BIG CHIP LED HB MODULE WHITE

  • 详情介绍
  • 数据手册
  • 价格&库存
SSM-80-W40M-T91-LA500 数据手册
SSM-80 Product Datasheet SSM-80 LEDs Features: • 3000K Efficacy over 100 lm/W, Flux over 1,600 lumens Table of Contents Technology Overview. . . . . . 2 • High density small form-factor light source ideal for spot and directional applications • ANSI compatible flux binning • Low thermal resistance: 1.0 °C/W Test Specifications . . . . . . . . . 2 • Lumen maintenance of greater than 70% after 60,000 hours White Binning Structure. . . . 3 • RoHS compliant Chromaticity Bins. . . . . . . . . . 4 Product Shipping & Labeling Information. . . . . . . 6 • High reliability • Electrically isolated thermal path • 13V typical input voltage • Narrow beam focus, MR-16 form factor Electrical Characteristics. . . 7 Spectral Characteristics. . . . .8 Radiation Patterns . . . . . . . . . 8 Thermal Resistance . . . . . . . . 9 Mechanical Dimensions . . . 10 Solder Profile . . . . . . . . . . . . . 12 Applications • Indoor Lighting • Track Lighting • Directional spot • High-Output Area Lighting • MR-16 light engine Tape & Reel Drawing . . . . . . 13 Ordering Information . . . . . 14 1 PDS-001674 Rev 08 © 2011 Luminus Devices, Inc. - All Rights Reserved Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com 1100 Technology Park Drive • Billerica, MA 01821 SSM-80 Product Datasheet Technology Overview Luminus Big Chip LEDs™ benefit from a suite of innovations in the fields of chip technology, packaging and thermal management. These breakthroughs allow illumination engineers and designers to achieve solutions that are high brightness and high efficiency. Photonic Lattice Technology Luminus’ photonic lattice technology enables large area LED chips with uniform brightness over the entire LED chip surface. The optical power and brightness produced by these large monolithic chips enable solutions which replace arc and halogen lamps where arrays of traditional high power LEDs cannot. For red, green and blue LEDs, the photonic lattice structures extract more light and create radiation patterns that are more collimated than traditional LEDs. Having higher collimation from the source increases optical collection efficiencies and simplifies optical designs. Packaging Technology Thermal management is critical in high power LED applications. With a thermal resistance from junction to case of 1.0º C/W. Luminus SSM-80 package is designed with high quality materials to provide customers with industry leading package thermal conductivity. This allows the LED to be driven at higher current densities while maintaining a low junction temperature, thereby resulting in brighter solutions and longer lifetimes. The package is easy to use, and ready to be mounted in the lighting system. Reliability Designed from the ground up, Luminus Big Chip LEDs are one of the most reliable light sources in the world today. Big Chip LEDs have passed a rigorous suite of environmental and mechanical stress tests, including mechanical shock, vibration, temperature cycling and humidity, and have been fully qualified for use in extreme high power and high current applications. With very low failure rates and median lifetimes that typically exceed 60,000 hours, Luminus Big Chip LEDs are ready for even the most demanding applications. Environmental Benefits Luminus LEDs help reduce power consumption and the amount of hazardous waste entering the environment. All Big Chip LED products manufactured by Luminus are RoHS compliant and free of hazardous materials, including lead and mercury. Understanding Big Chip LED Test Specifications Every Luminus LED is fully tested to ensure that it meets the high quality standards expected from Luminus’ products. Testing Temperature Multiple Operating Points (0.7A, 1.4A, 2.0 A) Luminus core board products are typically measured in such a way that the characteristics reported agree with how the devices will actually perform when incorporated into a system. This measurement is accomplished by mounting the devices on a 40ºC heat sink and allowing the device to reach thermal equilibrium while fully powered. Only after the device reaches equilibrium are the measurements taken. This method of measurement ensures that Luminus Big Chip LEDs perform in the field just as they are specified. The tables on the following pages provide typical optical and electrical characteristics. Since the LEDs can be operated over a wide range of drive conditions (currents from less than 350mA to 2.0 A, and duty cycle from
SSM-80-W40M-T91-LA500
物料型号:SSM-80

器件简介:Luminus Big Chip LEDs™ 利用芯片技术、封装技术和热管理的创新,提供高亮度和高效率的照明解决方案。

引脚分配:文档中没有提供具体的引脚分配图,但提到了发光区域尺寸和电气特性。

参数特性: - 3000K色温下效率超过100 lm/W,光通量超过1600流明。 - 高密度小尺寸光源,适合聚光和定向应用。 - ANSI兼容的光通量分选。 - 低热阻:1.0°C/W。 - 60,000小时后光通量维持率超过70%。 - 符合RoHS标准。 - 高可靠性。 - 电气隔离的热路径。 - 典型输入电压13V。 - 窄光束聚焦,MR-16封装形式。

功能详解: - 光子晶格技术,提供大尺寸LED芯片,整个芯片表面亮度均匀。 - 封装技术,具有1.0ºC/W的热阻,使用高质量材料提供行业领先的封装热导率。 - 可靠性设计,通过了包括机械冲击、振动、温度循环和湿度在内的一系列环境和机械应力测试。

应用信息: - 室内照明、轨道照明、定向聚光、高输出区域照明、MR-16光源引擎。

封装信息: - 机械尺寸详细描述了SSM-80发射器和星型板的尺寸。 - 焊接轮廓提供了SAC 305焊接温度曲线和无铅焊接指南。

订购信息: - 提供了不同色温和CRI的SSM-80产品的订购型号,以及相应的评估模块。
SSM-80-W40M-T91-LA500 价格&库存

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