Studio White LED Emitter
LZ4-00SW08
Key Features
4-die Studio White (5300K) LED
CCT and color rendering matched to HID arc lamp
CRI85 minimum / R9 50 typical
Up to 10 Watt power dissipation on compact 7.0mm x 7.0mm footprint
Low Thermal Resistance (2.8°C/W)
Engineered ceramic package with integrated glass lens
JEDEC Level 1 for Moisture Sensitivity Level
Autoclave compliant (JEDEC JESD22-A102-C)
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available on Standard or Serially connected MCPCB (optional)
Full suite of TIR secondary optics family available
Typical Applications
Studio Lighting
Photography Lighting
High-end retail Lighting
Showrooms Lighting
Description
The LZ4-00SW08 Studio White LED emitter features CCT and color rendering matched to HID arc lamps used in
studio lighting. It delivers a daylight color temperature of 5300K, CRI greater than 85 and R9 red content of 50,
resulting in a natural color rendering of skin tones and other colors, which cannot be obtained by standard daylight
white LED emitters. The emitter, based on LED Engin’s LuxiGen technology platform, may be driven up to 10W of
power in a compact 7.0mmx7.0mm footprint. The emitter’s low thermal resistance allows users to drive the
emitter with high current, while keeping the junction temperature low to ensure long operating life.
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LZ4-00SW08 (1.1 - 11/20/13)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Part number options
Base part number
Part number
Description
LZ4-00SW08-xxxx
LZ4 Studio White emitter
LZ4-40SW08-xxxx
LZ4 Studio White emitter on Standard Star 1 channel MCPCB
Bin kit option codes
SW, Studio-White (5300K)
Kit number
suffix
Min
flux
Bin
Chromaticity bins
Description
0000
T
2D, 2C, 3A, 3B
full distribution flux; full distribution CCT
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Studio White Chromaticity Groups
0.40
5630K
0.39
0.38
0.37
0.36
3B
0.35
CIEy
Planckian Locus
2C
3A
0.34
2D
0.33
0.32
0.31
0.30
0.29
0.28
0.28
0.29
0.30
0.31
0.32
0.33
0.34
0.35
0.36
0.37
0.38
CIEx
Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below in the table.
Studio White Bin Coordinates
Bin code
2D
3A
CIEx
0.329
0.3371
0.3366
0.329
0.329
0.3371
0.3451
0.344
0.3366
0.3371
CIEy
0.3417
0.349
0.3369
0.33
0.3417
0.349
0.3554
0.3427
0.3369
0.349
Bin code
2C
3B
CIEx
0.329
0.3376
0.3371
0.329
0.329
0.3376
0.3463
0.3451
0.3371
0.3376
CIEy
0.3538
0.3616
0.349
0.3417
0.3538
0.3616
0.3687
0.3554
0.349
0.3616
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Luminous Flux Bins
Table 1:
Bin
Code
Minimum
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
(lm)
Maximum
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
(lm)
Typical
Luminous Flux (ΦV)
@ IF = 1000mA [2]
(lm)
T
U
445
556
556
695
650
810
Notes for Table 1:
1.
Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.
Forward Voltage Bins
Table 2:
Bin
Code
Minimum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
Maximum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
0
12.0
14.4
Notes for Table 2:
1.
Forward Voltage is binned with all four LED dice connected in series.
2.
LED Engin maintains a tolerance of ± 0.4V for forward voltage measurements for the four LEDs.
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Absolute Maximum Ratings
Table 3:
Parameter
Symbol
Value
DC Forward Current [1]
Peak Pulsed Forward Current [2]
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature [4]
Allowable Reflow Cycles
IF
IFP
VR
Tstg
TJ
Tsol
1000
2000
See Note 3
-40 ~ +150
150
260
6
121°C at 2 ATM,
100% RH for 168 hours
> 8,000 V HBM
Class 3B JESD22-A114-D
Autoclave Conditions [5]
ESD Sensitivity [6]
Unit
mA
mA
V
°C
°C
°C
Notes for Table 3:
1.
Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 10 for current derating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5.
5.
Autoclave Conditions per JEDEC JESD22-A102-C.
6.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00SW08 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 4:
Parameter
Symbol
Typical
Unit
Luminous Flux (@ IF = 700mA) [1]
Luminous Flux (@ IF = 1000mA) [1]
Luminous Efficacy (@ IF = 350mA)
Correlated Color Temperature
Color Rendering Index (CRI)
Viewing Angle [2
Total Included Angle [3
ΦV
ΦV
650
845
91
5300
88
105
135
lm
lm
lm/W
K
CCT
Ra
2Θ1/2
Θ0.9V
Degrees
Degrees
Notes for Table 4:
1.
Luminous flux typical value is for all four LED dice operating concurrently at rated current.
2.
Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
3.
Total Included Angle is the total angle that includes 90% of the total luminous flux.
Electrical Characteristics @ TC = 25°C
Table 5:
Parameter
[1]
Forward Voltage (@ IF = 700mA)
Forward Voltage (@ IF = 1000mA) [1]
Temperature Coefficient
of Forward Voltage [1]
Thermal Resistance
(Junction to Case)
Symbol
Typical
Unit
VF
VF
12.9
13.3
V
V
ΔVF/ΔTJ
-8.0
mV/°C
RΘJ-C
2.8
°C/W
Notes for Table 5:
1.
Forward Voltage typical value is for all four LED dice connected in series.
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IPC/JEDEC Moisture Sensitivity Level
Table 6 - IPC/JEDEC J-STD-20D.1 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
Unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 6:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and
includes the maximum time allowed out of the bag at the distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period.
Based on long-term WHTOL testing, LED Engin projects that the LZ4 Series will deliver, on average, 90% Lumen
Maintenance at 65,000 hours of operation at a forward current of 700 mA per die. This projection is based on
constant current operation with junction temperature maintained at or below 110°C.
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Mechanical Dimensions (mm)
Pin Out
Pad
Die
1
A
Anode
2
A
Cathode
3
B
Anode
4
B
Cathode
5
C
Anode
6
C
Cathode
7
D
Anode
8
D
Cathode
9 [2]
n/a
Thermal
1
Figure 1: Package outline drawing.
Notes for Figure 1:
1.
Index mark, Ts indicates case temperature measurement point.
2.
Unless otherwise noted, the tolerance = ± 0.20 mm.
3.
Thermal contact, Pad 9, is electrically neutral.
2
Function
3
8
4
7
6
5
Recommended Solder Pad Layout (mm)
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad.
Note for Figure 2a:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
This pad layout is “patent pending”.
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Recommended 8mil Stencil Apertures Layout (mm)
Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad.
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
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Typical Radiation Pattern
100
90
Relative Intensity (%)
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern.
Typical Relative Spectral Power Distribution
1.00
0.90
Relative Spectral Power
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
350
400
450
500
550
600
650
700
750
800
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C.
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Typical Chromaticity Coordinate Shift over Temperature
0.02
0.015
Cx
0.01
Cy
Cx, Cy
0.005
3E-17
-0.005
-0.01
-0.015
-0.02
0
10
20
30
40
50
60
70
80
90
100
Case Temperature (°C)
Figure 6: Typical chromaticity coordinate shift vs. Case temperature
Typical Relative Light Output
140%
Relatiive Light Output
120%
100%
80%
60%
40%
20%
0%
0
200
400
600
800
1000
IF - Forward Current (mA)
Figure 7: Typical relative light output vs. forward current @ TC = 25°C.
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Typical Relative Light Output over Temperature
110%
Relative Light Output
100%
90%
80%
70%
60%
0
10
20
30
40
50
60
Case Temperature (oC)
70
80
90
100
Figure 8: Typical relative light output vs. case temperature.
Typical Forward Current Characteristics
1200
IF - Forward Current (mA)
1000
800
600
400
200
0
10.0
11.0
12.0
13.0
14.0
VF - Forward Voltage (V)
Figure 9: Typical forward current vs. forward voltage @ T C = at 25°C.
Note for Figure 9:
1.
Forward Voltage curve assumes that all four LED dice are connected in series.
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Current De-rating
IF - Maximum Forward Current (mA)
1200
RΘ_J-A 5.0 °C/W
1000
RΘ_J-A 5.5 °C/W
RΘ_J-A 6.0 °C/W
800
700
(Rated)
600
400
200
0
0
25
50
75
Maximum Ambient Temperature (oC)
100
125
Figure 10: Maximum forward current vs. ambient temperature based on T J(MAX) = 150°C.
Notes for Figure 10:
1.
Maximum current assumes that all four LED dice are operating concurrently at the same current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00SW08 is typically 2.8°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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Emitter Tape and Reel Specifications (mm)
Figure 11: Emitter carrier tape specifications (mm).
Figure 12: Emitter Reel specifications (mm).
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LZ4 MCPCB Family
Part number
Type of MCPCB
Diameter
(mm)
LZ4-4xxxxx
1-channel
19.9
Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
2.8 + 1.1 = 3.9
12.9
700
Mechanical Mounting of MCPCB
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
To avoid MCPCB bending:
o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o It is recommended to always use plastics washers in combinations with the three screws.
o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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LZ4-4xxxxx
1 channel, Standard Star MCPCB (1x4) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink
The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W
Components used
MCPCB:
ESD chips:
HT04503
BZX585-C30
(Bergquist)
(NPX, for 4 LED dies in series)
Pad layout
Ch.
1
MCPCB
Pad
1,2,3
4,5
String/die
Function
1/ABCD
Cathode Anode +
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Company Information
LED Engin, based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and
light engines to create uncompromised lighting experiences for a wide range of entertainment, architectural,
general lighting and specialty applications. LuxiGen™ multi-die emitter and secondary lens combinations reliably
deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors
including whites, tunable whites, multi-color and UV LEDs in a unique patented compact ceramic package. Our
LuxiTuneTM series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality,
control, freedom and high density tunable white light solutions for a broad range of new recessed and
downlighting applications. The small size, yet remarkably powerful beam output and superior in-source color
mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is
required.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
Please contact sales@ledengin.com or (408) 922-7200 for more information.
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