High Luminous Efficacy
Amber LED Emitter
LZ1-00A100
Key Features
High Luminous Efficacy Amber LED
Ultra-small foot print – 4.4mm x 4.4mm
Surface mount ceramic package with integrated glass lens
Very high Luminous Flux density
New industry standard for Lumen Maintenance
Autoclave compliant (JEDEC JESD22-A102-C)
JEDEC Level 1 for Moisture Sensitivity Level
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available on Standard or Miniature MCPCB (optional)
Typical Applications
Emergency vehicle lighting
Strobe and warning lights
Marine and buoy lighting
Aviation and obstruction lighting
Roadway beacons and traffic signaling
Architectural lighting
Stage and studio lighting
Landscape lighting
Automotive signal and marker lights
Description
The LZ1-00A100 Amber LED emitter provides 5W power in an extremely small package. With a 4.4mm x 4.4mm
ultra-small footprint, this package provides exceptional luminous flux density. The patent-pending design has
unparalleled thermal and optical performance. The high quality materials used in the package are chosen to
optimize light output and minimize stresses which results in monumental reliability and lumen maintenance. The
robust product design thrives in outdoor applications with high ambient temperatures and high humidity.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Part number options
Base part number
Part number
Description
LZ1-00A100-xxxx
LZ1 emitter
LZ1-10A100-xxxx
LZ1 emitter on Standard Star MCPCB
LZ1-30A100-xxxx
LZ1 emitter on Miniature round MCPCB
Bin kit option codes
A1, Amber (590nm)
Kit number
suffix
Min
flux
Bin
Color Bin Range
Description
0000
K
A3 – A6
full distribution flux; full distribution
wavelength
Notes:
1.
Default bin kit option is -0000
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Luminous Flux Bins
Table 1:
Bin Code
Minimum
Luminous Flux (ΦV)
@ IF = 1000mA [1,2]
(lm)
Maximum
Luminous Flux (ΦV)
@ IF = 1000mA [1,2]
(lm)
K
75
93
L
93
117
M
117
146
Notes for Table 1:
1.
Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of
± 10% on flux measurements.
2.
Future products will have even higher levels of luminous flux performance. Contact LED Engin Sales for updated information.
Dominant Wavelength Bins
Table 2:
Bin Code
Minimum
Dominant Wavelength (λD)
@ IF = 1000mA [1]
(nm)
Maximum
Dominant Wavelength (λD)
@ IF = 1000mA [1]
(nm)
A3
587.5
590.0
A4
590.0
592.5
A5
592.5
595.0
A6
595.0
597.5
Notes for Table 2:
1.
Dominant wavelength is derived from the CIE 1931 Chromaticity Diagram and represents the perceived hue.
2.
LED Engin maintains a tolerance of ± 1.0nm on dominant wavelength measurements.
Forward Voltage Bins
Table 3:
Bin Code
Minimum
Forward Voltage (VF)
@ IF = 1000mA [1]
(V)
Maximum
Forward Voltage (VF)
@ IF = 1000mA [1]
(V)
0
2.24
2.9
Notes for Table 3:
1.
LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.
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Absolute Maximum Ratings
Table 4:
Parameter
Symbol
Value
Unit
DC Forward Current at Tjmax=100°C
[1]
IF
1200
mA
DC Forward Current at Tjmax=125°C
[1]
IF
1000
mA
IFP
2000
mA
Reverse Voltage
VR
See Note 3
V
Storage Temperature
Tstg
-40 ~ +125
°C
Junction Temperature
TJ
125
°C
Soldering Temperature [4]
Tsol
260
°C
Peak Pulsed Forward Current
[2]
Allowable Reflow Cycles
6
Autoclave Conditions [5]
121°C at 2 ATM,
100% RH for 168 hours
ESD Sensitivity [6]
> 8,000 V HBM
Class 3B JESD22-A114-D
Notes for Table 4:
1.
Maximum DC forward current is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 10 for current derating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3.
5.
Autoclave Conditions per JEDEC JESD22-A102-C.
6.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ1-00A100
in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in
ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Typical
Unit
ΦV
105
lm
Luminous Flux (@ IF = 1000mA)
Dominant Wavelength (@ IF = 1000mA)
[1]
λD
590
nm
Viewing Angle [2]
2Θ1/2
76
Degrees
Total Included Angle [3]
Θ0.9V
115
Degrees
Notes for Table 5:
1.
Amber LEDs have a significant shift in wavelength over temperature; please refer to Figure 6 for details. Caution must be ex ercised if designing to meet a
regulated color space due to this behavior as product may shift out of legal color space under elevated temperatures.
2.
Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
3.
Total Included Angle is the total angle that includes 90% of the total luminous flux.
Electrical Characteristics @ TC = 25°C
Table 6:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 1000mA)
VF
2.6
V
Forward Voltage (@ IF = 1200mA)
VF
2.7
V
Temperature Coefficient
of Forward Voltage
ΔVF/ΔTJ
-1.9
mV/°C
Thermal Resistance
(Junction to Case)
RΘJ-C
10
°C/W
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IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
Unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 7:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and
includes the maximum time allowed out of the bag at the distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period.
Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen
Maintenance at 65,000 hours of operation at a forward current of 1000 mA. This projection is based on constant
current operation with junction temperature maintained at or below 110°C.
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Mechanical Dimensions (mm)
Pin Out
Pad
Function
1
Cathode
2
Anode
3
Anode
4
Cathode
5
[2]
Thermal
1
2
5
4
3
Figure 1: Package outline drawing.
Notes for Figure 1:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Thermal contact, Pad 5, is electrically connected to the Anode, Pads 2 and 3. Do not electrically connect any electrical pad s to the thermal contact, Pad 5.
LED Engin recommends mounting the LZ1-00A100 to a MCPCB that provides insulation between all electrical pads and the thermal contact, Pad 5. LED Engin
offers LZ1-10A100 and LZ1-30A100 MCPCB options which provide both electrical and thermal contact insulation with low thermal resistance. Please refer to
Application Note MCPCB Options 1 and 3, or contact a LED Engin sales representative for more information.
Recommended Solder Pad Layout (mm)
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad
Note for Figure 2a:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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Recommended Solder Mask Layout (mm)
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8mil Stencil Apertures Layout (mm)
Figure 2c: Recommended 8mil stencil apertures layout for anode, cathode, and thermal pad
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
Typical Radiation Pattern
100%
90%
Relative Intensity
80%
70%
60%
50%
40%
30%
20%
10%
0%
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10
20
30
40
50
60
70
80
90
Angle (degrees)
Figure 4: Typical representative spatial radiation pattern.
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Typical Relative Spectral Power Distribution
1
0.9
Relative Spectral Power
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
400
450
500
550
600
650
700
Wavelength (nm)
Figure 5: Relative spectral power vs. wavelength @ TC = 25°C.
Typical Relative Dominant Wavelength Shift over Temperature
Dominant Wavelength Shift (nm)
8
7
6
5
4
3
2
1
0
0
20
40
60
80
100
Case Temperature (ºC)
Figure 6: Typical dominant wavelength shift vs. case temperature.
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Typical Relative Light Output
140
Relative Light Output (%)
120
100
80
60
40
20
0
0
200
400
600
800
1000
1200
1400
1600
IF - Forward Current (mA)
Figure 7: Typical relative light output vs. forward current @ TC = 25°C.
Typical Relative Light Output over Temperature
160
Relative Light Output (%)
140
120
100
80
60
40
20
0
0
20
40
60
80
100
Case Temperature (ºC)
Figure 8: Typical relative light output vs. case temperature.
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Typical Forward Current Characteristics
1600
IF - Forward Current (mA)
1400
1200
1000
800
600
400
200
0
1.8
2
2.2
2.4
2.6
2.8
3
VF - Forward Voltage (V)
Figure 9: Typical forward current vs. forward voltage @ T C = 25°C.
Current De-rating
1600
IF - Maximum Current (mA)
1400
1200
1000
(Rated)
800
600
RΘJ-A = 9°C/W
RΘJ-A = 12°C/W
RΘJ-A = 15°C/W
400
200
0
0
25
50
75
100
125
Maximum Ambient Temperature (ºC)
Figure 10: Maximum forward current vs. ambient temperature based on T J(MAX) = 125°C.
Notes for Figure 10:
1.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ1-00A100 is typically 10°C/W.
2.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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Emitter Tape and Reel Specifications (mm)
Figure 11: Emitter carrier tape specifications (mm).
Figure 12: Emitter reel specifications (mm).
Notes for Figure 12:
1.
Reel quantity minimum: 200 emitters. Reel quantity maximum: 2500 emitters.
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LZ1 MCPCB Family
Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
Part number
Type of MCPCB
Diameter
(mm)
LZ1-1xxxxx
1-channel Star
19.9
10.5 + 1.5 = 12.0
2.6
1000
LZ1-3xxxxx
1-channel Mini
11.5
10.5 + 2.0 = 12.5
2.6
1000
Mechanical Mounting of MCPCB
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
To avoid MCPCB bending:
o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o It is recommended to always use plastics washers in combinations with the three screws.
o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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LZ1-1xxxxx
1 channel, Standard Star MCPCB (1x1) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.
The thermal resistance of the MCPCB is: RΘC-B 1.5°C/W
Components used
MCPCB:
HT04503
ESD/TVS Diode: BZT52C5V1LP-7
VBUS05L1-DD1
(Bergquist)
(Diodes, Inc., for 1 LED die)
(Vishay Semiconductors, for 1 LED die)
Pad layout
Ch.
1
MCPCB
Pad
1,2,3
4,5,6
String/die
Function
1/A
Cathode Anode +
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LZ1-3xxxxx
1 channel, Mini Round MCPCB (1x1) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.20 mm.
Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.
The thermal resistance of the MCPCB is: RΘC-B 2.0°C/W
Components used
MCPCB:
HT04503
ESD/TVS Diode: BZT52C5V1LP-7
VBUS05L1-DD1
(Bergquist)
(Diodes, Inc., for 1 LED die)
(Vishay Semiconductors, for 1 LED die)
Pad layout
Ch.
1
MCPCB
Pad
1
2
String/die
Function
1/A
Anode +
Cathode -
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Company Information
LED Engin, Inc., based in California’s Silicon Valley, specializes in ultra-bright, ultra compact solid state lighting
solutions allowing lighting designers & engineers the freedom to create uncompromised yet energy efficient
lighting experiences. The LuxiGen™ Platform — an emitter and lens combination or integrated module solution,
delivers superior flexibility in light output, ranging from 3W to 90W, a wide spectrum of available colors, including
whites, multi-color and UV, and the ability to deliver upwards of 5,000 high quality lumens to a target. The small
size combined with powerful output allows for a previously unobtainable freedom of design wherever high-flux
density, directional light is required. LED Engin’s packaging technologies lead the industry with products that
feature lowest thermal resistance, highest flux density and consummate reliability, enabling compact and efficient
solid state lighting solutions.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
Please contact sales@ledengin.com or (408) 922-7200 for more information.
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