Gallery White LED Emitter
LZP-00GW00
Key Features
24-die Gallery White (CRI 98) LED
3 SDCM color bins for CCT - 3000K
Superior Color Rendering: CRI (Ra) 98; R9 98 and R15 98
Up to 90 Watt power dissipation on compact 12.0mm x 12.0mm footprint
Industry lowest thermal resistance per package size (0.6°C/W)
Engineered ceramic package with integrated glass lens
JEDEC Level 1 for Moisture Sensitivity Level
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Copper core MCPCB option with emitter thermal slug directly soldered to the copper core
Full suite of TIR secondary optics family available
Typical Applications
Gallery lighting
Museum lighting
High-end retail lighting
Medical surgery lighting
Description
The LZP-00GW00 Gallery White features warm white light with an exceptional color rendering index (CRI) of 98, as
well as impressive individual R values (R1-16) in industry’s smallest footprint. It enables accurate color
representation and enhances the contrast of retail merchandise, artwork and skin tones, which cannot be obtained
with standard warm white LED emitters. The emitter, based on LED Engin’s LuxiGen technology platform, may be
driven up to 90W of power in a compact 12.0mmx12.0mm footprint. It has the industry lowest thermal resistance
per package size, which allows users to drive the emitter with higher current, while keeping the junction
temperature low to ensure long operating life.
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LZP-00GW00 (2.5 – 11/09/2018)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Part number options
Base part number
Part number
Description
LZP-00GW00-xxxx
LZP Gallery White emitter
LZP-D0GW00-xxxx
LZP Gallery White emitter on 5 channel 4x6+1 Star MCPCB
Bin kit option codes
GW, Gallery White (CRI 98)
Kit number
suffix
Min
flux
Bin
Chromaticity bins
Description
0030
D2
3-step MacAdams ellipse
full distribution flux; 3000K ANSI CCT
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Gallery White CCT Bins
3-step MacAdam ellipse color bins plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below in the table.
Gallery White 3-Step MacAdam Ellipse CCT Bin Coordinates
Nominal ANSI
CCT
3000
Center Point
(cx, cy)
(0.4366, 0.4042)
Major Axis
a
0.00967
Minor Axis
b
0.00399
Ellipse Rotation
Angle (⁰)
56.6
Luminous Flux Bins
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Table 1:
Bin Code
Minimum
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
(lm)
Maximum
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
(lm)
D2
2,350
2,600
E2
2,600
2,900
F2
2,900
3,200
Notes:
1.
Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.
2.
Luminous Flux typical value is for all 24 LED dies operating at rated current. The LED is configured with 4 Channels of 6 dies in series.
Forward Voltage Bin
Table 2:
Bin Code
0
Minimum
Forward Voltage (VF)
@ IF = 700mA
/Channel [1]
(V)
18.0[2,3]
Maximum
Forward Voltage (VF)
@ IF = 700mA
/Channel [1]
(V)
21.6[2,3]
Notes:
1.
LED Engin maintains a tolerance of ± 0.24V for forward voltage measurements.
2.
All 4 white Channels have matched Vf for parallel operation
3.
Forward Voltage is binned with 6 LED dies connected in series. The LED is configured with 4 Channels of 6 dies in series each.
Color Rendering Index Bin
Table 3:
Bin Code
Minimum
Color Rendering Index
@ IF = 700mA
0
95.0
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Absolute Maximum Ratings
Table 4:
Parameter
Symbol
Value
Unit
DC Forward Current at Tjmax=135°C [1]
DC Forward Current at Tjmax=150°C [1]
Peak Pulsed Forward Current [2]
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature [4]
Allowable Reflow Cycles
IF
IF
IFP
VR
Tstg
TJ
Tsol
1200
1000
1500 /Channel
See Note 3
-40 ~ +150
150
260
6
mA
mA
mA
V
°C
°C
°C
> 8,000 V HBM
Class 3B JESD22-A114-D
ESD Sensitivity [5]
Notes:
1.
Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 10 for current de-rating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5.
5.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZP-00GW00 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Typical
Unit
ΦV
ΦV
2650
3450
63
3000
98
110
lm
lm
lm/W
K
[1]
Luminous Flux (@ IF = 700mA)
Luminous Flux (@ IF = 1000mA) [1]
Luminous Efficacy (@ IF = 350mA)
Correlated Color Temperature
Color Rendering Index (CRI) [2]
Viewing Angle [3]
CCT
Ra
2Θ1/2
Degrees
Notes:
1.
Luminous flux typical value is for all 24 LED dies operating at rated current.
2.
Typical Ra and individual R1 through R16 values listed in Table 6
3.
Viewing Angle is the off-axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
Typical CRI (Ra) and individual R values
Table 6:
Ra
98
R1
98
R2
99
R3
97
R4
98
R5
98
R6
98
R7
98
R8
98
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R9
98
R10
99
R11
96
R12
86
R13
98
R14
97
R15
98
R16
96
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Electrical Characteristics @ TC = 25°C
Table 7:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 700mA) [1]
Forward Voltage (@ IF = 1000mA) [1]
VF
VF
19.4 /Channel
20.0 /Channel
V
V
Temperature Coefficient
of Forward Voltage [1]
ΔVF/ΔTJ
-12.0
mV/°C
Thermal Resistance
(Junction to Case)
RΘJ-C
0.6
°C/W
Notes:
1.
Forward Voltage is measured for a single string of 6 dies connected in series. The LED is configured with 4 Channels of 6 dies in series each.
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IPC/JEDEC Moisture Sensitivity Level
Table 8 - IPC/JEDEC J-STD-20D.1 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and includes the maximum time
allowed out of the bag at the distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period. L70 defines the amount of operating hours at which the light
output has reached 70% of its original output.
Figure 1: De-rating curve for operation of all dies at 700mA
Notes:
1.
See Figure 2 in Mechanical Dimensions section for exact Ts location.
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Mechanical Dimensions (mm)
Pin Out
Ch.
Pad
Die
Color
Function
18
E
GW
Cathode
D
GW
C
GW
na
na
na
1
B
GW
A
GW
na
24
F
Anode
17
J
GW
GW
I
GW
Cathode
na
H
GW
na
G
GW
na
L
GW
na
3
K
GW
Anode
15
O
GW
N
GW
Cathode
na
2
S
GW
na
R
GW
na
Q
GW
na
5
P
GW
Anode
14
T
GW
Y
GW
Cathode
na
3
Figure 2: Package outline drawing.
X
GW
na
W
GW
na
V
GW
na
8
U
GW
2
M
-
Anode
na
23
M
-
na
4
Notes:
1.
LZP-00GW00 pin out polarity is reversed; therefore it is not compatible with MCPCB designed for other LZP
White emitters (i.e LZP-00xW00), except for LZP-00SW00.
2.
Index mark, Ts indicates case temperature measurement point.
3.
Unless otherwise noted, the tolerance = ± 0.20 mm.
4.
Thermal slug is electrically isolated
5
Recommended Solder Pad Layout (mm)
+18
-24
-3
+17
+15
-5
-8
+14
+2
-23
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad
Notes:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
LED Engin recommends the use of copper core MCPCB’s which allow for the emitter thermal slug to be soldered directly to the copper core (so called pedestal
design). Such MCPCB technologies eliminate the high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter
thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance.
3.
LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less
than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure
rates due to thermal over stress.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Recommended Solder Mask Layout (mm)
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8 mil Stencil Apertures Layout (mm)
Figure 2c: Recommended 8mil stencil apertures for anode, cathode, and thermal pad
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Reflow Soldering Profile
Figure 4: Reflow soldering profile for lead free soldering.
Typical Radiation Pattern
Figure 5: Typical representative spatial radiation pattern.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Typical Relative Spectral Power Distribution
1
0.9
Relative Spectral Power
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
350
400
450
500
550
600
650
700
750
800
Wavelength (nm)
Figure 6: Typical relative spectral power vs. wavelength @ TC = 25°C.
Typical Relative Light Output over Forward Current
160%
140%
Relatiive Light Output
120%
100%
80%
60%
40%
20%
0%
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 7: Typical relative light output vs. forward current @ TC = 25°C.
Notes:
1.
Luminous Flux typical value is for all 24 LED dies operating concurrently at rated current pro Channel.
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Typical Relative Light Output over Temperature
Relatiive Light Output (%)
110
100
90
80
70
60
0
10
20
30
40
50
60
70
80
90
100
Case Temperature (°C)
Figure 8: Typical relative light output vs. case temperature.
Notes:
1.
Luminous Flux typical value is for all 24 LED dies operating concurrently at rated current pro Channel.
Typical Chromaticity Coordinate Shift over Forward Current
0.0400
Delta_Cx
0.0300
Delta_Cy
Delta Cx, Delta Cy
0.0200
0.0100
0.0000
-0.0100
-0.0200
-0.0300
-0.0400
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 9: Typical chromaticity coordinate shift vs. forward current
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Typical Chromaticity Coordinate Shift over Temperature
0.0400
0.0300
Delta_Cx
Delta Cx, Delta Cy
0.0200
Delta_Cy
0.0100
0.0000
-0.0100
-0.0200
-0.0300
-0.0400
0
10
20
30
40
50
60
70
80
90
100
Case Temperature (°C)
Figure 10: Typical chromaticity coordinate shift vs. Case temperature
Typical Forward Current Characteristics
1200
IF - Forward Current (mA)
1000
800
600
400
200
0
15.0
16.0
17.0
18.0
19.0
20.0
21.0
22.0
VF - Forward Voltage (V)
Figure 11: Typical forward current vs. forward voltage @ TC = at 25°C.
Note:
1.
Forward Voltage is measured for a single string of 6 dies connected in series. The LED is configured with 4 Channels of 6 dies in series each.
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Current De-rating
IF - Maximum Current (mA)
1200
1000
800
700
(Rated)
600
400
R=Θ
= 2.0°C/W
1.0˚ C/W
J-A=
RΘJ-A
R=Θ
=
1.5˚
C/W
J-A
RΘJ-A = 3.0°C/W
R=Θ
=
2.0˚
C/W
J-A= 4.0°C/W
RΘJ-A
200
0
0
25
50
75
100
125
150
Maximum Ambient Temperature (°C)
Figure 12: Maximum forward current vs. ambient temperature based on TJ(MAX) = 150°C.
Notes:
1.
Maximum current assumes that all LED dies are operating at rated current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZP-series is typically 0.6°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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LZP MCPCB Family
Part number
Type of MCPCB
Diameter
(mm)
LZP-D0GW00
5-channel
(4x6+1 strings)
28.3
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Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
0.6 + 0.1 = 0.7
19.4
4 x 700
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
LZP-D0GW00
5-channel, Standard Star MCPCB (4x6+1) Mechanical Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.20 mm.
Slots in MCPCB are for M3 or #4 mounting screws.
LED Engin recommends using plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.
LED Engin uses a copper core MCPCB with pedestal design, allowing direct solder connect between the MCPCB copper core and the emitter thermal slug. The
thermal resistance of this copper core MCPCB is: RΘC-B 0.1°C/W
Components used
MCPCB:
ESD chips:
SuperMCPCB
BZT52C36LP
(Bridge Semiconductor, copper core with pedestal design)
(NXP, for 6 LED dies in series)
Pad layout
Ch.
1
2
3
4
5
MCPCB
Pad
1
10
2
9
3
8
4
7
5
6
String/die
1/EDCBAF
2/JIHGLK
3/ONSRQP
4/TYXWVU
5/M
Function
Anode +
Cathode Anode +
Cathode Anode +
Cathode Anode +
Cathode N/A
N/A
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Application Guidelines
MCPCB Assembly Recommendations
A good thermal design requires an efficient heat transfer from the MCPCB to the heat sink. In order to minimize air
gaps in between the MCPCB and the heat sink, it is common practice to use thermal interface materials such as
thermal pastes, thermal pads, phase change materials and thermal epoxies. Each material has its pros and cons
depending on the design. Thermal interface materials are most efficient when the mating surfaces of the MCPCB
and the heat sink are flat and smooth. Rough and uneven surfaces may cause gaps with higher thermal resistances,
increasing the overall thermal resistance of this interface. It is critical that the thermal resistance of the interface is
low, allowing for an efficient heat transfer to the heat sink and keeping MCPCB temperatures low.
When optimizing the thermal performance, attention must also be paid to the amount of stress that is applied on
the MCPCB. Too much stress can cause the ceramic emitter to crack. To relax some of the stress, it is advisable to
use plastic washers between the screw head and the MCPCB and to follow the torque range listed below. For
applications where the heat sink temperature can be above 50oC, it is recommended to use high temperature and
rigid plastic washers, such as polycarbonate or glass-filled nylon.
LED Engin recommends the use of the following thermal interface materials:
1.
Bergquist’s Gap Pad 5000S35, 0.020in thick
Part Number: Gap Pad® 5000S35 0.020in/0.508mm
Thickness: 0.020in/0.508mm
Thermal conductivity: 5 W/m-K
Continuous use max temperature: 200°C
Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the
recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m)
2.
3M’s Acrylic Interface Pad 5590H
Part number: 5590H @ 0.5mm
Thickness: 0.020in/0.508mm
Thermal conductivity: 3 W/m-K
Continuous use max temperature: 100°C
Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the
recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m)
Mechanical Mounting Considerations
The mounting of MCPCB assembly is a critical process step. Excessive mechanical stress build up in the MCPCB can
cause the MCPCB to warp which can lead to emitter substrate cracking and subsequent cracking of the LED dies
LED Engin recommends the following steps to avoid mechanical stress build up in the MCPCB:
o Inspect MCPCB and heat sink for flatness and smoothness.
o Select appropriate torque for mounting screws. Screw torque depends on the MCPCB mounting
method (thermal interface materials, screws, and washer).
o Always use three M3 or #4-40 screws with #4 washers.
o When fastening the three screws, it is recommended to tighten the screws in multiple small
steps. This method avoids building stress by tilting the MCPCB when one screw is tightened in a
single step.
o Always use plastic washers in combinations with the three screws. This avoids high point contact
stress on the screw head to MCPCB interface, in case the screw is not seated perpendicular.
o In designs with non-tapped holes using self-tapping screws, it is common practice to follow a
method of three turns tapping a hole clockwise, followed by half a turn anti-clockwise, until the
appropriate torque is reached.
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Wire Soldering
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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About LED Engin
LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED
emitters, optics and light engines to create uncompromised lighting experiences for a wide range of
entertainment, architectural, general lighting and specialty applications. LuxiGenTM multi-die emitter and
secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a
target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented
compact ceramic package. Our LuxiTuneTM series of tunable white lighting modules leverage our LuxiGen emitters
and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of
new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional
light is required. LED Engin is committed to providing products that conserve natural resources and reduce
greenhouse emissions; and reserves the right to make changes to improve performance without notice.
For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200.
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