LZP-D0SW00-0000

Studio White LED Emitter LZP-00SW00 Key Features  24-die Studio White (5300K) LED  CCT and color rendering matched to HID arc lamp  CRI85 minimum / R9 50 typical  Up to 90 Watt power dissipation on compact 12.0mm x 12.0mm footprint  Industry lowest thermal resistance per package size (0.6°C/W)  Engineered ceramic package with integrated glass lens  JEDEC Level 1 for Moisture Sensitivity Level  Lead (Pb) free and RoHS compliant  Reflow solderable (up to 6 cycles)  Copper core MCPCB option with emitter thermal slug directly soldered to the copper core  Full suite of TIR secondary optics family available Typical Applications  Studio Lighting  Photography Lighting  High-end retail Lighting  Showrooms Lighting Description The LZP-00SW00 Studio White LED emitter features CCT and color rendering matched to HID arc lamps used in studio lighting. It delivers a daylight color temperature of 5300K, CRI greater than 85 and R9 red content of 50, resulting in a natural color rendering of skin tones and other colors, which cannot be obtained by standard daylight white LED emitters. The emitter, based on LED Engin’s LuxiGen technology platform, may be driven up to 90W of power in a compact 12.0mmx12.0mm footprint. It has the industry lowest thermal resistance per package size, which allows users to drive the emitter with higher current, while keeping the junction temperature low to ensure long operating life. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Part number options Base part number Part number Description LZP-00SW00-xxxx LZP Studio White emitter LZP-D0SW00-xxxx LZP Studio White emitter on 5 channel 4x6+1 Star MCPCB Bin kit option codes SW, Studio-White (5300K) Kit number suffix Min flux Bin Chromaticity bins Description 0000 G2 2D, 2C, 3A, 3B full distribution flux; full distribution CCT COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 2 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Studio White Chromaticity Groups 0.40 5630K 0.39 0.38 0.37 0.36 3B 0.35 CIEy Planckian Locus 2C 3A 0.34 2D 0.33 0.32 0.31 0.30 0.29 0.28 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 CIEx Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram. Coordinates are listed below in the table. Studio White Bin Coordinates Bin code 2D 3A CIEx 0.329 0.3371 0.3366 0.329 0.329 0.3371 0.3451 0.344 0.3366 0.3371 CIEy 0.3417 0.349 0.3369 0.33 0.3417 0.349 0.3554 0.3427 0.3369 0.349 Bin code 2C 3B CIEx 0.329 0.3376 0.3371 0.329 0.329 0.3376 0.3463 0.3451 0.3371 0.3376 CIEy 0.3538 0.3616 0.349 0.3417 0.3538 0.3616 0.3687 0.3554 0.349 0.3616 COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 3 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Luminous Flux Bins Table 1: Bin Code Minimum Luminous Flux (ΦV) @ IF = 700mA [1,2] (lm) Maximum Luminous Flux (ΦV) @ IF = 700mA [1,2] (lm) G2 3,200 3,500 H2 3,500 3,800 Notes: 1. Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements. 2. Luminous Flux typical value is for all 24 LED dies operating at rated current. The LED is configured with 4 Channels of 6 dies in series. Forward Voltage Bin Table 2: Bin Code 0 Minimum Forward Voltage (VF) @ IF = 700mA /Channel [1] (V) 18.0[2,3] Maximum Forward Voltage (VF) @ IF = 700mA /Channel [1] (V) 21.6[2,3] Notes: 1. LED Engin maintains a tolerance of ± 0.24V for forward voltage measurements. 2. All 4 white Channels have matched Vf for parallel operation 3. Forward Voltage is binned with 6 LED dies connected in series. The LED is configured with 4 Channels of 6 dies in series each. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 4 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Absolute Maximum Ratings Table 3: Parameter Symbol Value Unit DC Forward Current at Tjmax=135°C [1] DC Forward Current at Tjmax=150°C [1] Peak Pulsed Forward Current [2] Reverse Voltage Storage Temperature Junction Temperature Soldering Temperature [4] Allowable Reflow Cycles IF IF IFP VR Tstg TJ Tsol 1200 1000 1500 /Channel See Note 3 -40 ~ +150 150 260 6 mA mA mA V °C °C °C > 8,000 V HBM Class 3B JESD22-A114-D ESD Sensitivity [5] Notes: 1. Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current de-rating. 2: Pulse forward current conditions: Pulse Width ≤ 10msec and Duty cycle ≤ 10%. 3. LEDs are not designed to be reverse biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5. 5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZP-00SW00 in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @ TC = 25°C Table 4: Parameter Symbol Typical Unit ΦV ΦV 3600 4650 85 5300 88 110 lm lm lm/W K [1] Luminous Flux (@ IF = 700mA) Luminous Flux (@ IF = 1000mA) [1] Luminous Efficacy (@ IF = 350mA) Correlated Color Temperature Color Rendering Index (CRI) Viewing Angle [2] CCT Ra 2Θ1/2 Degrees Notes: 1. Luminous flux typical value is for all 24 LED dies operating at rated current. 2. Viewing Angle is the off-axis angle from emitter centerline where the luminous intensity is ½ of the peak value. Electrical Characteristics @ TC = 25°C Table 5: Parameter Symbol Typical Unit Forward Voltage (@ IF = 700mA) Forward Voltage (@ IF = 1000mA) [1] VF VF 19.4 /Channel 20.0 /Channel V V Temperature Coefficient of Forward Voltage [1] ΔVF/ΔTJ -12.0 mV/°C Thermal Resistance (Junction to Case) RΘJ-C 0.6 °C/W [1] Notes: 1. Forward Voltage is measured for a single string of 6 dies connected in series. The LED is configured with 4 Channels of 6 dies in series each. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 5 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com IPC/JEDEC Moisture Sensitivity Level Table 6 - IPC/JEDEC J-STD-20D.1 MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 unlimited ≤ 30°C/ 85% RH 168 +5/-0 85°C/ 85% RH n/a n/a Notes: 1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor’s facility. Average Lumen Maintenance Projections Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original light output remaining at a defined time period. L70 defines the amount of operating hours at which the light output has reached 70% of its original output. Figure 1: De-rating curve for operation of all dies at 700mA Notes: 1. See Figure 2 in Mechanical Dimensions section for exact Ts location. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 6 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Mechanical Dimensions (mm) Pin Out Ch. Pad Die Color Function 18 E SW Cathode D SW C SW na na na 1 B SW A SW na 24 F Anode 17 J SW SW I SW Cathode na H SW na G SW na L SW na 3 K SW Anode 15 O SW N SW Cathode na 2 S SW na R SW na Q SW na 5 P SW Anode 14 T SW Y SW Cathode na 3 Figure 2: Package outline drawing. X SW na W SW na V SW na 8 U SW 2 M - Anode na 23 M - na 4 Notes: 1. LZP-00SW00 pin out polarity is reversed; therefore it is not compatible with MCPCB designed for other LZP White emitters (i.e LZP-00xW00). 2. Index mark, Ts indicates case temperature measurement point. 3. Unless otherwise noted, the tolerance = ± 0.20 mm. 4. Thermal slug is electrically isolated 5 Recommended Solder Pad Layout (mm) +24 -18 -17 +3 +5 -15 -14 +8 +23 -2 Figure 3: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad. Notes: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. LED Engin recommends the use of copper core MCPCB’s which allow for the emitter thermal slug to be soldered directly to the copper core (so called pedestal design). Such MCPCB technologies eliminate the high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance. 3. LED Engin recommends x-ray sample monitoring to screen for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure rates due to thermal over stress. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 7 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Reflow Soldering Profile Figure 4: Reflow soldering profile for lead free soldering. Typical Radiation Pattern Figure 5: Typical representative spatial radiation pattern. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 8 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Relative Spectral Power Distribution 1.00 0.90 Relative Spectral Power 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 350 400 450 500 550 600 650 700 750 800 90 100 Wavelength (nm) Figure 6: Typical relative spectral power vs. wavelength @ TC = 25°C. Typical Chromaticity Coordinate Shift over Temperature 0.02 0.015 Cx 0.01 Cy Cx, Cy 0.005 3E-17 -0.005 -0.01 -0.015 -0.02 0 10 20 30 40 50 60 70 80 Case Temperature (°C) Figure 7: Typical chromaticity coodinate shift vs. Case temperature. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 9 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Relative Light Output 160% 140% Relatiive Light Output 120% 100% 80% 60% 40% 20% 0% 0 200 400 600 800 1000 1200 IF - Forward Current (mA) Figure 8: Typical relative light output vs. forward current @ TC = 25°C. Notes: 1. Luminous Flux typical value is for all 24 LED dies operating concurrently at rated current pro Channel. Typical Relative Light Output over Temperature Relatiive Light Output (%) 110 100 90 80 70 60 0 10 20 30 40 50 60 70 80 90 100 Case Temperature (°C) Figure 9: Typical relative light output vs. case temperature. Notes: 1. Luminous Flux typical value is for all 24 LED dies operating concurrently at rated current pro Channel. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 10 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Typical Forward Current Characteristics 1200 IF - Forward Current (mA) 1000 800 600 400 200 0 15.0 16.0 17.0 18.0 19.0 20.0 21.0 22.0 VF - Forward Voltage (V) Figure 10: Typical forward current vs. forward voltage @ T C = at 25°C. Note: 1. Forward Voltage is measured for a single string of 6 dies connected in series. The LED is configured with 4 Channels of 6 dies in series each. Current De-rating IF - Maximum Current (mA) 1200 1000 800 700 (Rated) 600 400 R=ΘJ-A= 1.0˚ C/W R=ΘJ-A= 1.5˚ C/W RΘ = 2.0°C/W R=ΘJ-A J-A= 2.0˚ C/W RΘJ-A = 3.0°C/W RΘJ-A = 4.0°C/W 200 0 0 25 50 75 100 125 150 Maximum Ambient Temperature (°C) Figure 11: Maximum forward current vs. ambient temperature based on T J(MAX) = 150°C. Notes: 1. Maximum current assumes that all LED dies are operating at rated current. 2. RΘJ-C [Junction to Case Thermal Resistance] for the LZP-series is typically 0.6°C/W. 3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance]. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 11 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Emitter Tape and Reel Specifications (mm) Figure 12: Emitter carrier tape specifications (mm). Figure 13: Emitter Reel specifications (mm). COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 12 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com LZP MCPCB Family Part number Type of MCPCB Diameter (mm) LZP-D0SW00 5-channel (4x6+1 strings) 28.3 Emitter + MCPCB Typical Vf Typical If Thermal Resistance (V) (mA) (oC/W) 0.6 + 0.1 = 0.7 19.4 4 x 700 Mechanical Mounting of MCPCB   MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to substrate cracking and subsequently LED dies cracking. To avoid MCPCB bending: o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws. o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3 screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will increase the likelihood of board bending. o It is recommended to always use plastics washers in combinations with the three screws. o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after tightening (with controlled torque) and then re-tighten the screws again. Thermal interface material    To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when mounting the MCPCB on to the heat sink. There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal epoxies. An example of such material is Electrolube EHTC. It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating conditions. Wire soldering   To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601) COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 13 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com LZP-D0SW00 5-channel, Standard Star MCPCB (4x6+1) Mechanical Dimensions (mm) Notes:  Unless otherwise noted, the tolerance = ± 0.20 mm.  Slots in MCPCB are for M3 or #4 mounting screws.  LED Engin recommends using plastic washers to electrically insulate screws from solder pads and electrical traces.  LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.  LED Engin uses a copper core MCPCB with pedestal design, allowing direct solder connect between the MCPCB copper core and the emitter thermal slug. The thermal resistance of this copper core MCPCB is: RΘC-B 0.1°C/W Components used MCPCB: ESD chips: SuperMCPCB BZT52C36LP (Bridge Semiconductor, copper core with pedestal design) (NXP, for 6 LED dies in series) Pad layout Ch. 1 2 3 4 5 MCPCB Pad 1 10 2 9 3 8 4 7 5 6 String/die 1/EDCBAF 2/JIHGLK 3/ONSRQP 4/TYXWVU 5/M Function Anode + Cathode Anode + Cathode Anode + Cathode Anode + Cathode N/A N/A COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 14 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Appendix: Wire Insertion and Extraction Instructions AVX poke-home For the AVX poke-home it is recommended to use solid wires with gauge size, 18, 20 or 22 AWG, but stranded wire can be used as well. Push the wire in and then give slight tug on the wire to confirm that it is properly engaged. Wire Insertion Solid conductor  Strip insulation length 4-5mm  Insert into appropriate hole to a stop  Inserted wire will be retained by contact Wire Insertion Stranded wire conductor  Twist strands together  Insert tool into contact operation slot  Insert wire  Remove tool Wire extraction  Insert tool into contact  Extract wire  Remove tool Extraction Tool References: Thin Blade Wire Extraction Tool: AVX P/N - 0692-7670-0101-000 or Miniature Precision Screw Driver, 0.047” Tip Width COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 15 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com Company Information LED Engin, based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and light engines to create uncompromised lighting experiences for a wide range of entertainment, architectural, general lighting and specialty applications. LuxiGen™ multi-die emitter and secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented compact ceramic package. Our LuxiTuneTM series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior in-source color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required. LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions. LED Engin reserves the right to make changes to improve performance without notice. Please contact sales@ledengin.com or (408) 922-7200 for more information. COPYRIGHT © 2013 LED ENGIN. ALL RIGHTS RESERVED. LZP-00SW00 (1.1 – 11/20/13) 16 LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com