LZP-Series
Highest Lumen Density
Warm White Emitter
LZP-00WW0R
Key Features
Highest luminous flux / area single LED emitter
o
4650lm Warm White
o
40mm² light emitting area
Up to 90 Watt power dissipation on compact 12.0mm x 12.0mm footprint
Industry lowest thermal resistance per package size (0.6°C/W)
Industry leading lumen maintenance
Color Point Stability 7x improvement over Energy Star requirements
High CRI performance for true color rendering
Surface mount ceramic package with integrated glass lens
JEDEC Level 1 for Moisture Sensitivity Level
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Copper core MCPCB option with emitter thermal slug directly soldered to the copper core
Full suite of TIR secondary optics family available
Typical Applications
General lighting
Shop lighting
Stage and Studio lighting
Architectural lighting
Description
The LZP-00WW0R Warm White LED emitter can dissipate up to 90W of power in an extremely small package. With
a small 12.0mm x 12.0mm footprint, this package provides unmatched luminous flux density. The high quality
materials used in the package are chosen to optimize light output and minimize stresses which results in superior
reliability and lumen maintenance. The robust product design thrives in outdoor applications with high ambient
temperatures and high humidity.
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LZP-00WW0R (1.0-11/22/13)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Part number options
Base part number
Part number
Description
LZP-00WW0R-xxxx
LZP Warm White emitter
LZP-D0WW0R-xxxx
LZP Warm White emitter on 5 channel 4x6+1 Star MCPCB
Bin kit option codes
WW, Warm-White (2700K – 3500K)
Kit number
suffix
Min
flux
Bin
Color Bin Ranges
Description
0027
F2
8A1, 8A2, 8B1, 8B2, 8A4, 8A3, 8B4, 8B3, 8D1, 8D2,
8C1, 8C2, 8D4, 8D3, 8C4, 8C3
full distribution flux; 2700K ANSI CCT bin
0227
F2
8A2, 8B1, 8A3, 8B4, 8D2, 8C1, 8D3, 8C4
0427
F2
8A3, 8B4, 8D2, 8C1
0030
F2
7A1, 7A2, 7B1, 7B2, 7A4, 7A3, 7B4, 7B3, 7D1, 7D2,
7C1, 7C2, 7D4, 7D3, 7C4, 7C3
0230
F2
7A2, 7B1, 7A3, 7B4, 7D2, 7C1, 7D3, 7C4
0430
F2
7A3, 7B4, 7D2, 7C1
0035
F2
6A1, 6A2, 6B1, 6B2, 6A4, 6A3, 6B4, 6B3, 6D1, 6D2,
6C1, 6C2, 6D4, 6D3, 6C4, 6C3
0235
F2
6A2, 6B1, 6A3, 6B4, 6D2, 6C1, 6D3, 6C4
0435
F2
6A3, 6B4, 6D2, 6C1
full distribution flux; 2700K ANSI CCT half
bin
full distribution flux; 2700K ANSI CCT
quarter bin
full distribution flux; 3000K ANSI CCT bin
full distribution flux; 3000K ANSI CCT half
bin
full distribution flux; 3000K ANSI CCT
quarter bin
full distribution flux; 3500K ANSI CCT bin
full distribution flux; 3500K ANSI CCT half
bin
full distribution flux; 3500K ANSI CCT
quarter bin
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Warm White Chromaticity Groups
Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below in the table.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Warm White Bin Coordinates
Bin code
6A1
6A4
6D1
6D4
7A1
7A4
7D1
7D4
8A1
8A4
8D1
8D4
CIEx
0.3889
0.3915
0.3981
0.3953
0.3889
0.3953
0.3981
0.4048
0.4017
0.3953
0.4017
0.4048
0.4116
0.4082
0.4017
0.4082
0.4116
0.4183
0.4147
0.4082
0.4147
0.4183
0.4242
0.4203
0.4147
0.4203
0.4242
0.43
0.4259
0.4203
0.4259
0.43
0.4359
0.4316
0.4259
0.4316
0.4359
0.4418
0.4373
0.4316
0.4373
0.4418
0.4475
0.4428
0.4373
0.4428
0.4475
0.4532
0.4483
0.4428
0.4483
0.4532
0.4589
0.4538
0.4483
0.4538
0.4589
0.4646
0.4593
0.4538
CIEy
0.369
0.3768
0.38
0.372
0.369
0.372
0.38
0.3832
0.3751
0.372
0.3751
0.3832
0.3865
0.3782
0.3751
0.3782
0.3865
0.3898
0.3814
0.3782
0.3814
0.3898
0.3919
0.3833
0.3814
0.3833
0.3919
0.3939
0.3853
0.3833
0.3853
0.3939
0.396
0.3873
0.3853
0.3873
0.396
0.3981
0.3893
0.3873
0.3893
0.3981
0.3994
0.3906
0.3893
0.3906
0.3994
0.4008
0.3919
0.3906
0.3919
0.4008
0.4021
0.3931
0.3919
0.3931
0.4021
0.4034
0.3944
0.3931
Bin code
6A2
6A3
6D2
6D3
7A2
7A3
7D2
7D3
8A2
8A3
8D2
8D3
CIEx
0.3915
0.3941
0.401
0.3981
0.3915
0.3981
0.401
0.408
0.4048
0.3981
0.4048
0.408
0.415
0.4116
0.4048
0.4116
0.415
0.4221
0.4183
0.4116
0.4183
0.4221
0.4281
0.4242
0.4183
0.4242
0.4281
0.4342
0.43
0.4242
0.43
0.4342
0.4403
0.4359
0.43
0.4359
0.4403
0.4465
0.4418
0.4359
0.4418
0.4465
0.4523
0.4475
0.4418
0.4475
0.4523
0.4582
0.4532
0.4475
0.4532
0.4582
0.4641
0.4589
0.4532
0.4589
0.4641
0.47
0.4646
0.4589
CIEy
0.3768
0.3848
0.3882
0.38
0.3768
0.38
0.3882
0.3916
0.3832
0.38
0.3832
0.3916
0.395
0.3865
0.3832
0.3865
0.395
0.3984
0.3898
0.3865
0.3898
0.3984
0.4006
0.3919
0.3898
0.3919
0.4006
0.4028
0.3939
0.3919
0.3939
0.4028
0.4049
0.396
0.3939
0.396
0.4049
0.4071
0.3981
0.396
0.3981
0.4071
0.4085
0.3994
0.3981
0.3994
0.4085
0.4099
0.4008
0.3994
0.4008
0.4099
0.4112
0.4021
0.4008
0.4021
0.4112
0.4126
0.4034
0.4021
Bin code
6B1
6B4
6C1
6C4
7B1
7B4
7C1
7C4
8B1
8B4
8C1
8C4
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CIEx
0.3941
0.3968
0.404
0.401
0.3941
0.401
0.404
0.4113
0.408
0.401
0.408
0.4113
0.4186
0.415
0.408
0.415
0.4186
0.4259
0.4221
0.415
0.4221
0.4259
0.4322
0.4281
0.4221
0.4281
0.4322
0.4385
0.4342
0.4281
0.4342
0.4385
0.4449
0.4403
0.4342
0.4403
0.4449
0.4513
0.4465
0.4403
0.4465
0.4513
0.4573
0.4523
0.4465
0.4523
0.4573
0.4634
0.4582
0.4523
0.4582
0.4634
0.4695
0.4641
0.4582
0.4641
0.4695
0.4756
0.47
0.4641
CIEy
0.3848
0.393
0.3966
0.3882
0.3848
0.3882
0.3966
0.4001
0.3916
0.3882
0.3916
0.4001
0.4037
0.395
0.3916
0.395
0.4037
0.4073
0.3984
0.395
0.3984
0.4073
0.4096
0.4006
0.3984
0.4006
0.4096
0.4119
0.4028
0.4006
0.4028
0.4119
0.4141
0.4049
0.4028
0.4049
0.4141
0.4164
0.4071
0.4049
0.4071
0.4164
0.4178
0.4085
0.4071
0.4085
0.4178
0.4193
0.4099
0.4085
0.4099
0.4193
0.4207
0.4112
0.4099
0.4112
0.4207
0.4221
0.4126
0.4112
Bin code
6B2
6B3
6C2
6C3
7B2
7B3
7C2
7C3
8B2
8B3
8C2
8C3
CIEx
0.3968
0.3996
0.4071
0.404
0.3968
0.404
0.4071
0.4146
0.4113
0.404
0.4113
0.4146
0.4222
0.4186
0.4113
0.4186
0.4222
0.4299
0.4259
0.4186
0.4259
0.4299
0.4364
0.4322
0.4259
0.4322
0.4364
0.443
0.4385
0.4322
0.4385
0.443
0.4496
0.4449
0.4385
0.4449
0.4496
0.4562
0.4513
0.4449
0.4513
0.4562
0.4624
0.4573
0.4513
0.4573
0.4624
0.4687
0.4634
0.4573
0.4634
0.4687
0.475
0.4695
0.4634
0.4695
0.475
0.4813
0.4756
0.4695
CIEy
0.393
0.4015
0.4052
0.3966
0.393
0.3966
0.4052
0.4089
0.4001
0.3966
0.4001
0.4089
0.4127
0.4037
0.4001
0.4037
0.4127
0.4165
0.4073
0.4037
0.4073
0.4165
0.4188
0.4096
0.4073
0.4096
0.4188
0.4212
0.4119
0.4096
0.4119
0.4212
0.4236
0.4141
0.4119
0.4141
0.4236
0.426
0.4164
0.4141
0.4164
0.426
0.4274
0.4178
0.4164
0.4178
0.4274
0.4289
0.4193
0.4178
0.4193
0.4289
0.4304
0.4207
0.4193
0.4207
0.4304
0.4319
0.4221
0.4207
LZP-00WW0R (1.0-11/22/13)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Luminous Flux Bins
Table 1:
Bin Code
F2
G2
H2
Minimum
Luminous Flux (ΦV)
@ IF = 700mA
/Channel [1,2]
(lm)
2,900
3,200
3,500
Maximum
Luminous Flux (ΦV)
@ IF = 700mA
/Channel [1,2]
(lm)
3,200
3,500
3,800
Notes:
1.
Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.
2.
Luminous Flux typical value is for all 24 LED dies operating at rated current. The LED is configured with 4 Channels of 6 dies in series.
Forward Voltage Bin
Table 2:
Bin Code
0
Minimum
Forward Voltage (VF)
@ IF = 700mA
/Channel [1]
(V)
18.0[2,3]
Maximum
Forward Voltage (VF)
@ IF = 700mA
/Channel [1]
(V)
21.6[2,3]
Notes:
1.
LED Engin maintains a tolerance of ± 0.24V for forward voltage measurements.
2.
All 4 white Channels have matched Vf for parallel operation
3.
Forward Voltage is binned with 6 LED dies connected in series. The LED is configured with 4 Channels of 6 dies in series each.
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Absolute Maximum Ratings
Table 3:
Parameter
Symbol
Value
Unit
DC Forward Current at Tjmax=135°C [1]
DC Forward Current at Tjmax=150°C [1]
Peak Pulsed Forward Current [2]
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature [4]
Allowable Reflow Cycles
IF
IF
IFP
VR
Tstg
TJ
Tsol
1200
1000
1500 /Channel
See Note 3
-40 ~ +150
150
260
6
mA
mA
mA
V
°C
°C
°C
> 8,000 V HBM
Class 3B JESD22-A114-D
ESD Sensitivity [5]
Notes:
1.
Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 12 for current de-rating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5.
5.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZP-00WW0R in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 4:
Parameter
[1]
Luminous Flux (@ IF = 700mA)
Luminous Flux (@ IF = 1000mA) [1]
Luminous Efficacy (@ IF = 350mA)
Correlated Color Temperature
Color Rendering Index (CRI)
Viewing Angle [2]
Symbol
Typical
Unit
ΦV
ΦV
3600
4650
86
3000
83 / 15
110
lm
lm
lm/W
K
CCT
Ra / R9
2Θ1/2
Degrees
Notes:
1.
Luminous flux typical value is for all 24 LED dies operating at rated current.
2.
Viewing Angle is the off-axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
Electrical Characteristics @ TC = 25°C
able 5:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 700mA)
Forward Voltage (@ IF = 1000mA) [1]
VF
VF
18.9 /Channel
19.5 /Channel
V
V
Temperature Coefficient
of Forward Voltage [1]
ΔVF/ΔTJ
-16.8
mV/°C
Thermal Resistance
(Junction to Case)
RΘJ-C
0.6
°C/W
[1]
Notes:
1.
Forward Voltage is measured for a single string of 6 dies connected in series. The LED is configured with 4 Channels of 6 dies in series each.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
IPC/JEDEC Moisture Sensitivity Level
Table 6 - IPC/JEDEC J-STD-20D.1 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and
includes the maximum time allowed out of the bag at the distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period. L70 defines the amount of operating hours at which the light
output has reached 70% of its original output.
Figure 1: De-rating curve for operation of all dies at 700mA
Notes:
1.
Ts is a thermal reference point on the case of the emitter.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Mechanical Dimensions (mm)
Pin Out
Ch.
Pad
Die
Color
Function
18
E
WW
Cathode
D
WW
C
WW
na
na
na
1
B
WW
A
WW
na
24
F
WW
Anode
17
J
WW
I
WW
Cathode
na
H
WW
na
G
WW
na
L
WW
na
3
K
WW
Anode
15
O
WW
N
WW
Cathode
na
2
S
WW
na
R
WW
na
Q
WW
na
5
P
WW
Anode
14
T
WW
Y
WW
Cathode
na
3
Figure 2: Package outline drawing.
X
WW
na
W
WW
na
V
WW
na
8
U
WW
2
M
-
Anode
na
23
M
-
na
4
Notes:
1.
LZP-00xW0R pin out polarity is reversed; therefore it is not compatible with MCPCB designed for LZP00xW00 products, except for LZP-00SW00 and LZP-00GW00.
2.
Index mark, Ts indicates case temperature measurement point.
3.
Unless otherwise noted, the tolerance = ± 0.20 mm.
4.
Thermal slug is electrically isolated
5
Recommended Solder Pad Layout (mm)
+24
-18
-17
+3
+5
-15
-14
+8
+23
-2
Figure 3: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad.
Notes:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
LED Engin recommends the use of copper core MCPCB’s which allow for the emitter thermal slug to be soldered directly to the copper core (so called pedestal
design). Such MCPCB technologies eliminate the high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter
thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance.
3. LED Engin recommends x-ray sample monitoring to screen for solder voids underneath the emitter thermal slug. The total area covered by solder voids should
be less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher
failure rates due to thermal over stress.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Reflow Soldering Profile
Figure 4: Reflow soldering profile for lead free soldering.
Typical Radiation Pattern
Figure 5: Typical representative spatial radiation pattern.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Relative Spectral Power Distribution
1.00
0.90
Relative Spectral Power
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
350
400
450
500
550
600
650
700
750
800
850
Wavelength (nm)
Figure 6: Typical relative spectral power vs. wavelength @ TC = 25°C.
Typical Forward Current Characteristics
1400
IF - Forward Current (mA)
1200
1000
800
600
400
200
0
15.0
16.0
17.0
18.0
19.0
20.0
21.0
22.0
VF - Forward Voltage (V)
Figure 7: Typical forward current vs. forward voltage @ TC = at 25°C.
Note:
1.
Forward Voltage is measured for a single string of 6 dies connected in series. The LED is configured with 4 Channels of 6 dies in series each.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Relative Light Output over Forward Current
160%
140%
Relatiive Light Output
120%
100%
80%
60%
40%
20%
0%
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 8: Typical relative light output vs. forward current @ TC = 25°C.
Notes:
1.
Luminous Flux typical value is for all 24 LED dies operating concurrently at rated current per Channel.
Typical Relative Light Output over Temperature
Relatiive Light Output (%)
110
100
90
80
70
60
0
10
20
30
40
50
60
70
80
90
100
Case Temperature (°C)
Figure 9: Typical relative light output vs. case temperature.
Notes:
1.
Luminous Flux typical value is for all 24 LED dies operating concurrently at rated current per Channel.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Chromaticity Coordinate Shift over Current
0.0200
0.0150
Delta_Cx
Delta_Cy
Delta Cx, Delta Cy
0.0100
0.0050
0.0000
-0.0050
-0.0100
-0.0150
-0.0200
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 10: Typical dominant wavelength shift vs. Case temperature.
Typical Chromaticity Coordinate Shift over Temperature
0.02
0.015
Cx
Delta Cx, Delta Cy
0.01
Cy
0.005
3E-17
-0.005
-0.01
-0.015
-0.02
0
10
20
30
40
50
60
70
80
90
100
Case Temperature (°C)
Figure 11: Typical dominant wavelength shift vs. Case temperature.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Current De-rating
IF - Maximum Current (mA)
1200
1000
800
700
(Rated)
600
400
RΘJ-A
2.0°C/W
R=Θ
C/W
J-A== 1.0˚
RΘJ-A
=
3.0°C/W
R=Θ
=
1.5˚
C/W
J-A
RΘJ-A
=
4.0°C/W
R=Θ
=
2.0˚
C/W
J-A
200
0
0
25
50
75
100
125
150
Maximum Ambient Temperature (°C)
Figure 12: Emitter carrier tape specifications (mm).
Notes:
1.
Maximum current assumes that all LED dies are operating at rated current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZP-series is typically 0.6°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Emitter Tape and Reel Specifications (mm)
Figure 13: Emitter Reel specifications (mm).
Figure 14: Emitter Reel specifications (mm).
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZP MCPCB Family
Part number
Type of MCPCB
Diameter
(mm)
LZP-DxxxxR
5-channel
(4x6+1 strings)
28.3
Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
0.6 + 0.1 = 0.7
18.9
4 x 700
Mechanical Mounting of MCPCB
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
To avoid MCPCB bending:
o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o It is recommended to always use plastics washers in combinations with the three screws.
o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
o
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150 C.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZP-DxxxxR
5-channel, Standard Star MCPCB (4x6+1) Mechanical Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.20 mm.
Slots in MCPCB are for M3 or #4 mounting screws.
LED Engin recommends using plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.
LED Engin uses a copper core MCPCB with pedestal design, allowing direct solder connect between the MCPCB copper core and the emitter thermal slug. The
thermal resistance of this copper core MCPCB is: RΘC-B 0.1°C/W
Components used
MCPCB:
ESD chips:
SuperMCPCB
BZT52C36LP
(Bridge Semiconductor, copper core with pedestal design)
(NXP, for 6 LED dies in series)
Pad layout
Ch.
1
2
3
4
5
MCPCB
Pad
1
10
2
9
3
8
4
7
5
6
String/die
1/EDCBAF
2/JIHGLK
3/ONSRQP
4/TYXWVU
5/M
Function
Anode +
Cathode Anode +
Cathode Anode +
Cathode Anode +
Cathode N/A
N/A
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Company Information
LED Engin, based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and
light engines to create uncompromised lighting experiences for a wide range of entertainment, architectural,
general lighting and specialty applications. LuxiGen™ multi-die emitter and secondary lens combinations reliably
deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors
including whites, tunable whites, multi-color and UV LEDs in a unique patented compact ceramic package. Our
TM
LuxiTune series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality,
control, freedom and high density tunable white light solutions for a broad range of new recessed and
downlighting applications. The small size, yet remarkably powerful beam output and superior in-source color
mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is
required.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
Please contact sales@ledengin.com or (408) 922-7200 for more information.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com