LZ9-J0GW00-0430

Gallery White LED Emitter LZ9-00GW00 Key Features  9-die Gallery White (CRI 98) LED  3 SDCM color bins for CCT - 3000K  Superior Color Rendering: CRI (Ra) 98; R9 98 and R15 98  Up to 20 Watt power dissipation on compact 7.0mm x 7.0mm footprint  Low Thermal Resistance (1.3°C/W)  Engineered ceramic package with integrated glass lens  Very high Luminous Flux density  JEDEC Level 1 for Moisture Sensitivity Level  Autoclave compliant (JEDEC JESD22-A102-C)  Lead (Pb) free and RoHS compliant  Reflow solderable (up to 6 cycles)  Emitter available on MCPCB (optional)  Full suite of TIR secondary optics family available Typical Applications  Gallery lighting  Museum lighting  High-end retail lighting  Medical surgery lighting Description The LZ9‐00GW00 Gallery White features warm white light with an exceptional color rendering index (CRI) of 98, as well as impressive individual R values (R1‐16) in industry’s smallest footprint. It enables accurate color representation and enhances the contrast of retail merchandise, artwork and skin tones, which cannot be obtained with standard warm white LED emitters. The emitter, based on LED Engin’s LuxiGen technology platform, may be driven up to 20W of power in a compact 7.0mmx7.0mm footprint. It has the industry lowest thermal resistance per package size, which allows users to drive the emitter with higher current, while keeping the junction temperature low to ensure long operating life. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Part Number Options Base part number Part number Description LZ9-00GW00-xxxx 9-die emitter Gallery White LZ9-J0GW00-xxxx 9-die emitter Gallery White on Star MCPCB in 1x9 electrical configuration LZ9-M0GW00-xxxx 9-die emitter Gallery White on Star MCPCB in 3x3 electrical configuration Bin Kit Option Codes GW, Gallery White (CRI 98) Kit number suffix Min flux Bin Color Bin Ranges Description 0030 W 3-step MacAdams ellipse full distribution flux; 3000K ANSI CCT COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 2 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Gallery White CCT Bins 3-step MacAdam ellipse color bins plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram. Coordinates are listed below in the table. Gallery White 3-Step MacAdam Ellipse CCT Bin Coordinates Nominal ANSI CCT 3000 Center Point (cx, cy) (0.4366, 0.4042) COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. Major Axis a 0.00967 3 Minor Axis b 0.00399 Ellipse Rotation Angle (⁰) 56.6 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Luminous Flux Bins Table 1: Bin Code Minimum Luminous Flux (Φv) @ IF = 700mA [1,2] (lm) Maximum Luminous Flux (Φv) @ IF = 700mA [1,2] (lm) W 868 1085 X 1085 1357 Notes for Table 1: 1. Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements. Forward Voltage Range per String Table 2: Bin Code Minimum Forward Voltage (VF) @ IF = 700mA [1,2] (V) Maximum Forward Voltage (VF) @ IF = 700mA [1,2] (V) 0 9.0 10.8 Notes for Table 2: 1. LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements. 2. Forward Voltage per string of 3 LED dies in series. Color Rendering Index Bin Table 3: Bin Code Minimum Color Rendering Index @ IF = 700mA 0 95.0 COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 4 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Absolute Maximum Ratings Table 4: Parameter Symbol Value Unit IF IF IFP VR Tstg TJ Tsol 800 700 1000 See Note 3 -40 ~ +150 150 260 6 mA mA [1] DC Forward Current at Tjmax=135°C DC Forward Current at Tjmax=150°C [1] Peak Pulsed Forward Current [2] Reverse Voltage Storage Temperature Junction Temperature Soldering Temperature [4] Allowable Reflow Cycles Autoclave Conditions [5] 121°C at 2 ATM, 100% RH for 168 hours ESD Sensitivity [6] > 8,000 V HBM Class 3B JESD22-A114-D mA V °C °C °C Notes for Table 4: 1. Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current de-rating. 2: Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%. 3. LEDs are not designed to be reverse biased. 4. Solder conditions per JEDEC 020c. See Reflow Soldering Profile Figure 3. 5. Autoclave Conditions per JEDEC JESD22-A102-C. 6. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ9-00GW00 in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @ TC = 25°C Table 5: Parameter Symbol Luminous Flux (@ IF = 700mA) [1] Luminous Efficacy (@ IF = 350mA) Correlated Color Temperature Color Rendering Index (CRI) [2] Viewing Angle [3] Total Included Angle [4] Φv Typical Unit 1060 1300 67 850 76 3000 900 50 98 53 110 110 135 110 120 110 120 120 CCT Ra 2Θ½ Θ0.9 lm lm/W K Degrees Degrees Notes for Table 5: 1. Luminous flux typical value is for all 9 LED dies operating concurrently at rated current. 2. Typical Ra and individual R1 through R16 values listed in Table 6 3. Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value. 4. Total Included Angle is the total angle that includes 90% of the total luminous flux. Typical CRI (Ra) and individual R values Table 6: Ra 98 R1 98 R2 99 R3 97 R4 98 R5 98 COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. R6 98 R7 98 R8 98 5 R9 98 R10 99 R11 96 R12 86 R13 98 R14 97 R15 98 R16 96 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Electrical Characteristics @ TC = 25°C Table 7: Parameter Symbol Typical Unit Forward Voltage per String (@ IF = 700mA) VF 9.7 V Temperature Coefficient of Forward Voltage (per String) ΔVF/ΔTJ -6.0 mV/°C Thermal Resistance (Junction to Case) RΘJ-C 1.3 °C/W IPC/JEDEC Moisture Sensitivity Level Table 8 - IPC/JEDEC J-STD-20 MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 Unlimited ≤ 30°C/ 85% RH 168 +5/-0 85°C/ 85% RH n/a n/a Notes: 1. The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility. Average Lumen Maintenance Projections Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original light output remaining at a defined time period. Based on accelerated lifetime testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen Maintenance at 65,000 hours of operation at a forward current of 700mA per die. This projection is based on constant current operation with junction temperature maintained at or below 120°C. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 6 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Mechanical Dimensions (mm) Emitter pin layout Emitter channel Emitter pin Die Color Ch1 - 23, 24 E White B White Ch1 Ch1 + 17, 18 A White Ch2 - 2, 3 G White I White Ch2 Ch2 + 14, 15 C White Ch3 - 5, 6 D White H White F White Ch3 Ch3+ 11, 12 NC pins: 1, 4, 7, 8, 9, 10, 13, 16, 19, 20, 21, 22 DNC pins: none Figure 1: Package outline drawing. Notes: NC = Not internally Connected (Electrically isolated) DNC = Do Not Connect (Electrically Non isolated) Notes for Figure 1: 1. Index mark indicates case temperature measurement point. 2. Unless otherwise noted, the tolerance = ± 0.20 mm. Recommended Solder Pad Layout (mm) Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad. Note for Figure 2a: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. LED Engin recommends the use of pedestal MCPCB’s which allow the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB technology eliminates the high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance. 3. LED Engin recommends x-ray sample monitoring to screen for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure rates due to thermal over stress. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 7 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Recommended Solder Mask Layout (mm) Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad. Note for Figure 2b: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. Recommended 8mil Stencil Apertures Layout (mm) Figure 2c: Recommended 8mil stencil apertures layout for anode, cathode, and thermal pad. Note for Figure 2c: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 8 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Reflow Soldering Profile Figure 3: Reflow soldering profile for lead free soldering. Typical Radiation Pattern 100 90 Relative Intensity (%) 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angular Displacement (Degrees) Figure 4: Typical representative spatial radiation pattern. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 9 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Relative Spectral Power Distribution 1 0.9 Relative Spectral Power 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 350 400 450 500 550 600 650 700 750 800 Wavelength (nm) Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C Typical Relative Light Output over Forward Current 140% Relatiive Light Output 120% 100% 80% 60% 40% 20% 0% 0 200 400 600 800 1000 IF - Forward Current (mA) Figure 6: Typical relative light output vs. forward current @ TC = 25°C. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 10 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Normalized Radiant Flux over Temperature Relatiive Light Output (%) 110 100 90 80 70 60 0 10 20 30 40 50 60 70 80 90 100 Case Temperature (°C) Figure 7: Typical relative light output vs. case temperature. Typical Chromaticity Coordinate Shift over Forward Current 0.0400 Delta_Cx 0.0300 Delta_Cy Delta Cx, Delta Cy 0.0200 0.0100 0.0000 -0.0100 -0.0200 -0.0300 -0.0400 0 100 200 300 400 500 600 700 800 IF - Forward Current (mA) Figure 8: Typical chromaticity coordinate shift vs. forward current COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 11 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Chromaticity Coordinate Shift over Temperature 0.0400 0.0300 Delta_Cx Delta Cx, Delta Cy 0.0200 Delta_Cy 0.0100 0.0000 -0.0100 -0.0200 -0.0300 -0.0400 0 10 20 30 40 50 60 70 80 90 100 Case Temperature (°C) Figure 9: Typical chromaticity coordinate shift vs. Case temperature Typical Forward Voltage Characteristics per String 1000 IF - Forward Current (mA) 800 600 400 200 0 7.0 8.0 9.0 10.0 11.0 VF - Forward Voltage (V) Figure 10: Typical forward current vs. forward voltage1 @ TC = 25°C. Note for Figure 10: 1. Forward Voltage per string of 3 LED dies connected in series. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 12 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Current De-rating 1000 IF - Maximum Current (mA) 800 700 (Rated) 600 400 R R R 200 = 4°C/W J-A = 5°C/W J-A = 6°C/W J-A 0 0 25 50 75 100 125 150 Maximum Ambient Temperature (°C) Figure 11: Maximum forward current vs. ambient temperature based on TJ(MAX) = 150°C. Notes for Figure 11: 1. Maximum current assumes that all 9 LED dice are operating concurrently at the same current. 2. RΘJ-C [Junction to Case Thermal Resistance] for the LZ9-00GW00 is typically 1.3°C/W. 3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance]. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 13 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Emitter Tape and Reel Specifications (mm) Figure 12: Emitter carrier tape specifications (mm). Figure 13: Emitter Reel specifications (mm). COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 14 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZ9 MCPCB Family Emitter + MCPCB Typical Vf Typical If Thermal Resistance (V) (mA) (oC/W) Part number Type of MCPCB Diameter (mm) LZ9-Jxxxxx 1-channel 19.9 1.3 + 0.2 = 1.5 29.1 700 LZ9-Mxxxxx 3-channel 19.9 1.3 + 0.2 = 1.5 9.7/ ch 700/ ch COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 15 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZ9-Jxxxxx 1 channel, Standard Star MCPCB (1x9) Dimensions (mm) Notes: • Unless otherwise noted, the tolerance = ± 0.2 mm. • Slots in MCPCB are for M3 or #4-40 mounting screws.  LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.  LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.  The thermal resistance of the MCPCB is: RΘC-B 0.2°C/W. This low thermal resistance is possible by utilizing a copper based MCPCB with pedestal design. The emitter thermal slug is in direct contact with the copper core. There are several vendors that offer similar solutions, some of them are: Rayben, Bergquist, SinkPad, Bridge-Semiconductor. Components used MCPCB: ESD chips: Jumpers: MHE-301 copper BZX585-C47 CRCW06030000Z0 (Rayben) (NXP, for 9 LED die) (Vishay) Pad layout Ch. 1 MCPCB Pad 1 2 String/die Function 1/ABCDEF GHI Cathode Anode + COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 16 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZ9-Mxxxxx 3 channel, Standard Star MCPCB (3x3) Dimensions (mm) Notes: • Unless otherwise noted, the tolerance = ± 0.2 mm. • Slots in MCPCB are for M3 or #4-40 mounting screws.  LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.  LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.  The thermal resistance of the MCPCB is: RΘC-B 0.2°C/W. This low thermal resistance is possible by utilizing a copper based MCPCB with pedestal design. The emitter thermal slug is in direct contact with the copper core. There are several vendors that offer similar solutions, some of them are: Rayben, Bergquist, SinkPad, Bridge-Semiconductor. Components used MCPCB: ESD chips: MHE-301 copper BZX884-C18 (Rayben) (NXP, for 3 LED die) Pad layout Ch. 1 2 3 MCPCB Pad 4 3 5 2 6 1 String/die 1/ABE 2/CGI 3/DFH Function Cathode Anode + Cathode Anode + Cathode Anode + COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 17 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZ9 secondary TIR optics family LLxx-3T06-H Optical Specification degrees Optical efficiency 4 % On-axis intensity 5 cd/lm 17 36 90 5.4 LLNF-3T06-H 26 49 90 2.2 LLFL-3T06-H 39 83 90 1.2 Beam angle 2 Field angle 3 degrees LLSP-3T06-H Part number 1 Notes: 1. Lenses can also be ordered without the holder. Replace –H with –O for this option. 2. Beam angle is defined as the full width at 50% of the max intensity (FWHM). 3. Field angle is defined as the full width at 10% of the max intensity. 4. Optical efficiency is defined as the ratio between the incoming flux and the outgoing flux. 5. On-axis intensity is defined as the ratio between the total input lumen and the intensity in the optical center of the lens. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 18 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Relative Intensity over Angle 100% LZ9 emitter LLSP-3T06-H 80% Relative Intensity LLNF-3T06-H LLFL-3T06-H 60% 40% 20% 0% -90 -60 -30 0 30 60 90 Angle (degrees) General Characteristics Symbol Value Rating Unit Height from Seating Plane 19.2 Typical mm Diameter 38.9 Typical mm Mechanical Material Lens PMMA Holder Polycarbonate Optical Transmission1 (>90%) λ 410-1100 Min-Max. nm Storage Temperature Tstg -40 ~ +110 Min-Max. °C Operating Temperature Tsol -40 ~ +110 Min-Max. °C Environmental Notes: 1. It is not recommended to use a UV emitter with this lens due to lower transmission at wavelengths < 410nm. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 19 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Mechanical dimensions Lens with Holder COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. Lens 20 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Application Guidelines MCPCB Assembly Recommendations A good thermal design requires an efficient heat transfer from the MCPCB to the heat sink. In order to minimize air gaps in between the MCPCB and the heat sink, it is common practice to use thermal interface materials such as thermal pastes, thermal pads, phase change materials and thermal epoxies. Each material has its pros and cons depending on the design. Thermal interface materials are most efficient when the mating surfaces of the MCPCB and the heat sink are flat and smooth. Rough and uneven surfaces may cause gaps with higher thermal resistances, increasing the overall thermal resistance of this interface. It is critical that the thermal resistance of the interface is low, allowing for an efficient heat transfer to the heat sink and keeping MCPCB temperatures low. When optimizing the thermal performance, attention must also be paid to the amount of stress that is applied on the MCPCB. Too much stress can cause the ceramic emitter to crack. To relax some of the stress, it is advisable to use plastic washers between the screw head and the MCPCB and to follow the torque range listed below. For applications where the heat sink temperature can be above 50oC, it is recommended to use high temperature and rigid plastic washers, such as polycarbonate or glass-filled nylon. LED Engin recommends the use of the following thermal interface materials: 1. Bergquist’s Gap Pad 5000S35, 0.020in thick  Part Number: Gap Pad® 5000S35 0.020in/0.508mm  Thickness: 0.020in/0.508mm  Thermal conductivity: 5 W/m-K  Continuous use max temperature: 200°C  Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m) 2. 3M’s Acrylic Interface Pad 5590H  Part number: 5590H @ 0.5mm  Thickness: 0.020in/0.508mm  Thermal conductivity: 3 W/m-K  Continuous use max temperature: 100°C  Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m) Mechanical Mounting Considerations The mounting of MCPCB assembly is a critical process step. Excessive mechanical stress build up in the MCPCB can cause the MCPCB to warp which can lead to emitter substrate cracking and subsequent cracking of the LED dies LED Engin recommends the following steps to avoid mechanical stress build up in the MCPCB: o Inspect MCPCB and heat sink for flatness and smoothness. o Select appropriate torque for mounting screws. Screw torque depends on the MCPCB mounting method (thermal interface materials, screws, and washer). o Always use three M3 or #4-40 screws with #4 washers. o When fastening the three screws, it is recommended to tighten the screws in multiple small steps. This method avoids building stress by tilting the MCPCB when one screw is tightened in a single step. o Always use plastic washers in combinations with the three screws. This avoids high point contact stress on the screw head to MCPCB interface, in case the screw is not seated perpendicular. o In designs with non-tapped holes using self-tapping screws, it is common practice to follow a method of three turns tapping a hole clockwise, followed by half a turn anti-clockwise, until the appropriate torque is reached. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 21 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Wire Soldering   To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601) COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 22 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin About LED Engin LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and light engines to create uncompromised lighting experiences for a wide range of entertainment, architectural, general lighting and specialty applications. LuxiGenTM multi-die emitter and secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented compact ceramic package. Our LuxiTuneTM series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required. LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions; and reserves the right to make changes to improve performance without notice. For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 23 LZ9-00GW00 (2.4 –11/09/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin