High Luminous Efficacy
Warm White LED Emitter
LZ9-00WW00
Key Features
High Luminous Efficacy, Warm White LED
Can dissipate up to 20W
Ultra-small foot print – 7.0mm x 7.0mm
Surface mount ceramic package with integrated glass lens
Low Thermal Resistance (1.3°C/W)
Very high Luminous Flux density
JEDEC Level 1 for Moisture Sensitivity Level
Autoclave complaint (JEDEC JESD22-A102-C)
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available on MCPCB (optional)
Full suite of TIR secondary optics family available
Part Number Options
Base part number
Part number
Description
LZ9-00WW00-xxxx
9-die emitter CRI 80 minimum
LZ9-J0WW00-xxxx
9-die emitter CRI 80 minimum on Star MCPCB in 1x9 electrical configuration
LZ9-M0WW00-xxxx
9-die emitter CRI 80 minimum on Star MCPCB in 3x3 electrical configuration
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LZ9-00WW00 (1.7-02/23/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Bin Kit Option Codes
2700K CRI 80 Minimum
Kit number
suffix
Min
flux
Bin
Color Bin Ranges
Description
0027
X
8A1, 8A2, 8B1, 8B2, 8A4, 8A3, 8B4, 8B3, 8D1, 8D2,
8C1, 8C2, 8D4, 8D3, 8C4, 8C3
full distribution flux; 2700K ANSI CCT bin
0227
X
8A2, 8B1, 8A3, 8B4, 8D2, 8C1, 8D3, 8C4
0427
X
8A3, 8B4, 8D2, 8C1
full distribution flux; 2700K ANSI CCT half
bin
full distribution flux; 2700K ANSI CCT
quarter bin
3000K-3500K CRI 80 Minimum
Kit number
suffix
Min
flux
Bin
Color Bin Ranges
Description
0030
X
7A1, 7A2, 7B1, 7B2, 7A4, 7A3, 7B4, 7B3, 7D1, 7D2,
7C1, 7C2, 7D4, 7D3, 7C4, 7C3
full distribution flux; 3000K ANSI CCT bin
0230
X
7A2, 7B1, 7A3, 7B4, 7D2, 7C1, 7D3, 7C4
0430
X
7A3, 7B4, 7D2, 7C1
0035
X
6A1, 6A2, 6B1, 6B2, 6A4, 6A3, 6B4, 6B3, 6D1, 6D2,
6C1, 6C2, 6D4, 6D3, 6C4, 6C3
0235
X
6A2, 6B1, 6A3, 6B4, 6D2, 6C1, 6D3, 6C4
0435
X
6A3, 6B4, 6D2, 6C1
full distribution flux; 3000K ANSI CCT half
bin
full distribution flux; 3000K ANSI CCT
quarter bin
full distribution flux; 3500K ANSI CCT bin
full distribution flux; 3500K ANSI CCT half
bin
full distribution flux; 3500K ANSI CCT
quarter bin
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Warm White Chromaticity Groups
Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below in the table.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Warm White Bin Coordinates
Bin code
6A1
6A4
6D1
6D4
7A1
7A4
7D1
7D4
8A1
8A4
8D1
8D4
CIEx
0.3889
0.3915
0.3981
0.3953
0.3889
0.3953
0.3981
0.4048
0.4017
0.3953
0.4017
0.4048
0.4116
0.4082
0.4017
0.4082
0.4116
0.4183
0.4147
0.4082
0.4147
0.4183
0.4242
0.4203
0.4147
0.4203
0.4242
0.43
0.4259
0.4203
0.4259
0.43
0.4359
0.4316
0.4259
0.4316
0.4359
0.4418
0.4373
0.4316
0.4373
0.4418
0.4475
0.4428
0.4373
0.4428
0.4475
0.4532
0.4483
0.4428
0.4483
0.4532
0.4589
0.4538
0.4483
0.4538
0.4589
0.4646
0.4593
0.4538
CIEy
0.369
0.3768
0.38
0.372
0.369
0.372
0.38
0.3832
0.3751
0.372
0.3751
0.3832
0.3865
0.3782
0.3751
0.3782
0.3865
0.3898
0.3814
0.3782
0.3814
0.3898
0.3919
0.3833
0.3814
0.3833
0.3919
0.3939
0.3853
0.3833
0.3853
0.3939
0.396
0.3873
0.3853
0.3873
0.396
0.3981
0.3893
0.3873
0.3893
0.3981
0.3994
0.3906
0.3893
0.3906
0.3994
0.4008
0.3919
0.3906
0.3919
0.4008
0.4021
0.3931
0.3919
0.3931
0.4021
0.4034
0.3944
0.3931
Bin code
6A2
6A3
6D2
6D3
7A2
7A3
7D2
7D3
8A2
8A3
8D2
8D3
CIEx
0.3915
0.3941
0.401
0.3981
0.3915
0.3981
0.401
0.408
0.4048
0.3981
0.4048
0.408
0.415
0.4116
0.4048
0.4116
0.415
0.4221
0.4183
0.4116
0.4183
0.4221
0.4281
0.4242
0.4183
0.4242
0.4281
0.4342
0.43
0.4242
0.43
0.4342
0.4403
0.4359
0.43
0.4359
0.4403
0.4465
0.4418
0.4359
0.4418
0.4465
0.4523
0.4475
0.4418
0.4475
0.4523
0.4582
0.4532
0.4475
0.4532
0.4582
0.4641
0.4589
0.4532
0.4589
0.4641
0.47
0.4646
0.4589
CIEy
0.3768
0.3848
0.3882
0.38
0.3768
0.38
0.3882
0.3916
0.3832
0.38
0.3832
0.3916
0.395
0.3865
0.3832
0.3865
0.395
0.3984
0.3898
0.3865
0.3898
0.3984
0.4006
0.3919
0.3898
0.3919
0.4006
0.4028
0.3939
0.3919
0.3939
0.4028
0.4049
0.396
0.3939
0.396
0.4049
0.4071
0.3981
0.396
0.3981
0.4071
0.4085
0.3994
0.3981
0.3994
0.4085
0.4099
0.4008
0.3994
0.4008
0.4099
0.4112
0.4021
0.4008
0.4021
0.4112
0.4126
0.4034
0.4021
Bin code
6B1
6B4
6C1
6C4
7B1
7B4
7C1
7C4
8B1
8B4
8C1
8C4
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CIEx
0.3941
0.3968
0.404
0.401
0.3941
0.401
0.404
0.4113
0.408
0.401
0.408
0.4113
0.4186
0.415
0.408
0.415
0.4186
0.4259
0.4221
0.415
0.4221
0.4259
0.4322
0.4281
0.4221
0.4281
0.4322
0.4385
0.4342
0.4281
0.4342
0.4385
0.4449
0.4403
0.4342
0.4403
0.4449
0.4513
0.4465
0.4403
0.4465
0.4513
0.4573
0.4523
0.4465
0.4523
0.4573
0.4634
0.4582
0.4523
0.4582
0.4634
0.4695
0.4641
0.4582
0.4641
0.4695
0.4756
0.47
0.4641
CIEy
0.3848
0.393
0.3966
0.3882
0.3848
0.3882
0.3966
0.4001
0.3916
0.3882
0.3916
0.4001
0.4037
0.395
0.3916
0.395
0.4037
0.4073
0.3984
0.395
0.3984
0.4073
0.4096
0.4006
0.3984
0.4006
0.4096
0.4119
0.4028
0.4006
0.4028
0.4119
0.4141
0.4049
0.4028
0.4049
0.4141
0.4164
0.4071
0.4049
0.4071
0.4164
0.4178
0.4085
0.4071
0.4085
0.4178
0.4193
0.4099
0.4085
0.4099
0.4193
0.4207
0.4112
0.4099
0.4112
0.4207
0.4221
0.4126
0.4112
Bin code
6B2
6B3
6C2
6C3
7B2
7B3
7C2
7C3
8B2
8B3
8C2
8C3
CIEx
0.3968
0.3996
0.4071
0.404
0.3968
0.404
0.4071
0.4146
0.4113
0.404
0.4113
0.4146
0.4222
0.4186
0.4113
0.4186
0.4222
0.4299
0.4259
0.4186
0.4259
0.4299
0.4364
0.4322
0.4259
0.4322
0.4364
0.443
0.4385
0.4322
0.4385
0.443
0.4496
0.4449
0.4385
0.4449
0.4496
0.4562
0.4513
0.4449
0.4513
0.4562
0.4624
0.4573
0.4513
0.4573
0.4624
0.4687
0.4634
0.4573
0.4634
0.4687
0.475
0.4695
0.4634
0.4695
0.475
0.4813
0.4756
0.4695
CIEy
0.393
0.4015
0.4052
0.3966
0.393
0.3966
0.4052
0.4089
0.4001
0.3966
0.4001
0.4089
0.4127
0.4037
0.4001
0.4037
0.4127
0.4165
0.4073
0.4037
0.4073
0.4165
0.4188
0.4096
0.4073
0.4096
0.4188
0.4212
0.4119
0.4096
0.4119
0.4212
0.4236
0.4141
0.4119
0.4141
0.4236
0.426
0.4164
0.4141
0.4164
0.426
0.4274
0.4178
0.4164
0.4178
0.4274
0.4289
0.4193
0.4178
0.4193
0.4289
0.4304
0.4207
0.4193
0.4207
0.4304
0.4319
0.4221
0.4207
LZ9-00WW00 (1.7-02/23/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Luminous Flux Bins
Table 1:
Bin Code
Minimum
Luminous Flux (Φv)
@ IF = 700mA [1,2]
(lm)
Maximum
Luminous Flux (Φv)
@ IF = 700mA [1,2]
(lm)
X
1085
1357
Y
1357
1696
Notes for Table 1:
1.
Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.
Forward Voltage Range per String
Table 2:
Bin Code
Minimum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
Maximum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
0
9.0
10.8
Notes for Table 2:
1.
LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.
2.
Forward Voltage per string of 3 LED dies connected in series.
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Absolute Maximum Ratings
Table 3:
Parameter
Symbol
Value
Unit
DC Forward Current at Tjmax=135°C [1]
DC Forward Current at Tjmax=150°C [1]
Peak Pulsed Forward Current [2]
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature [4]
Allowable Reflow Cycles
IF
IF
IFP
VR
Tstg
TJ
Tsol
800
700
1000
See Note 3
-40 ~ +150
150
260
6
mA
mA
mA
V
°C
°C
°C
Autoclave Conditions [5]
121°C at 2 ATM,
100% RH for 168 hours
ESD Sensitivity [6]
> 8,000 V HBM
Class 3B JESD22-A114-D
Notes for Table 3:
1.
Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current
de-rating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020c. See Reflow Soldering Profile Figure 3.
5.
Autoclave Conditions per JEDEC JESD22-A102-C.
6.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ9-00Wx00 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 4:
Typical
Parameter
Symbol
Luminous Flux (@ IF = 700mA) [1]
Luminous Efficacy (@ IF =350mA)
Color Rendering Index (CRI)
Viewing Angle [2]
Total Included Angle [3]
Φv
2700K
3000K – 3500K
1350
79
1430
85
Unit
lm
lm/W
82
110
110
135
110
120
Notes for Table 4:
110
120
1.
Luminous flux typical value is for all 9 LED dies operating concurrently at rated current.
2.
Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak
value.
120
3.
Ra
2Θ½
Θ0.9
Degrees
Degrees
Total Included Angle is the total angle that includes 90% of the total luminous flux.
Electrical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Typical
Unit
Forward Voltage per String (@ IF = 700mA)
VF
9.7
V
Temperature Coefficient
of Forward Voltage (per String)
ΔVF/ΔTJ
-6.0
mV/°C
Thermal Resistance
(Junction to Case)
RΘJ-C
1.3
°C/W
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
IPC/JEDEC Moisture Sensitivity Level
Table 6 - IPC/JEDEC J-STD-20 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
Unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 6:
1.
The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag
and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period.
Based on accelerated lifetime testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen
Maintenance at 65,000 hours of operation at a forward current of 700 mA per die. This projection is based on
constant current operation with junction temperature maintained at or below 120°C.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Mechanical Dimensions (mm)
Emitter pin layout
Emitter
channel
Ch1 -
Emitter
pin
23, 24
Ch1
Die
Color
E
White
B
White
Ch1 +
17, 18
A
White
Ch2 -
2, 3
G
White
I
White
Ch2
Ch2 +
14, 15
C
White
Ch3 -
5, 6
D
White
H
White
F
White
Ch3
Ch3+
11, 12
NC pins: 1, 4, 7, 8, 9, 10, 13, 16, 19, 20,
21, 22
DNC pins: none
Notes:
NC = Not internally Connected (Electrically isolated)
DNC = Do Not Connect (Electrically Non isolated)
Figure 1: Package outline drawing.
Notes for Figure 1:
1.
Index mark indicates case temperature measurement point.
2.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended Solder Pad Layout (mm)
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad.
Note for Figure 2a:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
LED Engin recommends the use of pedestal MCPCB’s which allow the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such
MCPCB technologies eliminate the high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the
metal core of the MCPCB, thus lowering the overall system thermal resistance.
3.
LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less
than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure
rates due to thermal over stress.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Recommended Solder Mask Layout (mm)
Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad.
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8mil Stencil Apertures Layout (mm)
Figure 2c: Recommended 8mil stencil apertures layout for anode, cathode, and thermal pad.
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
Typical Radiation Pattern
100
90
Relative Intensity (%)
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Relative Spectral Power Distribution
1.0
Relative Spectral Power
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
430
480
530
580
630
680
730
780
830
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C, 3000K CRI 80
Typical Chromaticity Coordinate Shift over Temperature
0.02
0.015
Cx
0.01
Cy
Cx, Cy
0.005
3E-17
-0.005
-0.01
-0.015
-0.02
0
10
20
30
40
50
60
70
80
90
100
Case Temperature (°C)
Figure 6: Typical dominant wavelength shift vs. Case temperature.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Relative Light Output
140%
Relatiive Light Output
120%
100%
80%
60%
40%
20%
0%
0
200
400
600
800
1000
IF - Forward Current (mA)
Figure 7: Typical relative light output vs. forward current @ T C = 25°C
Typical Normalized Radiant Flux over Temperature
Relatiive Light Output (%)
110
100
90
80
70
60
0
10
20
30
40
50
60
70
80
90
100
Case Temperature (°C)
Figure 8: Typical relative light output vs. case temperature.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Forward Voltage Characteristics per String
1200
IF - Forward Current (mA)
1000
800
600
400
200
0
6.0
7.0
8.0
9.0
10.0
11.0
VF - Forward Voltage (V)
1
Figure 9: Typical forward current vs. forward voltage @ TC = 25°C.
Note for Figure 9:
1.
Forward Voltage per string of 3 LED dies connected in series.
Current De-rating
1000
IF - Maximum Current (mA)
800
700
(Rated)
600
400
R J-A = 4°C/W
R J-A = 5°C/W
R J-A = 6°C/W
200
0
0
25
50
75
100
125
150
Maximum Ambient Temperature (°C)
Figure 10: Maximum forward current vs. ambient temperature based on T J(MAX) = 150°C.
Notes for Figure 10:
1.
Maximum current assumes that all 9 LED dice are operating concurrently at the same current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ9-00Wx00 is typically 1.3°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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Emitter Tape and Reel Specifications (mm)
Figure 11: Emitter carrier tape specifications (mm).
Figure 12: Emitter Reel specifications (mm).
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LZ9 MCPCB Family
Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
Part number
Type of MCPCB
Diameter
(mm)
LZ9-Jxxxxx
1-channel
19.9
1.3 + 0.2 = 1.5
29.1
700
LZ9-Mxxxxx
3-channel
19.9
1.3 + 0.2 = 1.5
9.7/ ch
700/ ch
Mechanical Mounting of MCPCB
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
To avoid MCPCB bending:
o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o It is recommended to always use plastics washers in combinations with the three screws.
o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
o
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150 C.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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LZ9-Jxxxxx
1 channel, Standard Star MCPCB (1x9) Dimensions (mm)
Notes:
•
Unless otherwise noted, the tolerance = ± 0.2 mm.
•
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.
The thermal resistance of the MCPCB is: RΘC-B 0.2°C/W. This low thermal resistance is possible by utilizing a copper based MCPCB with pedestal design. The
emitter thermal slug is in direct contact with the copper core. There are several vendors that offer similar solutions, some of them are: Rayben, Bergquist,
SinkPad, Bridge-Semiconductor.
Components used
MCPCB:
ESD chips:
Jumpers:
MHE-301 copper
BZX585-C47
CRCW06030000Z0
(Rayben)
(NXP, for 9 LED die)
(Vishay)
Pad layout
Ch.
1
MCPCB
Pad
1
2
String/die
Function
1/ABCDEF
GHI
Cathode Anode +
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LZ9-Mxxxxx
3 channel, Standard Star MCPCB (3x3) Dimensions (mm)
Notes:
•
Unless otherwise noted, the tolerance = ± 0.2 mm.
•
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.
The thermal resistance of the MCPCB is: RΘC-B 0.2°C/W. This low thermal resistance is possible by utilizing a copper based MCPCB with pedestal design. The
emitter thermal slug is in direct contact with the copper core. There are several vendors that offer similar solutions, some of them are: Rayben, Bergquist,
SinkPad, Bridge-Semiconductor.
Components used
MCPCB:
ESD chips:
MHE-301 copper
BZX884-C18
(Rayben)
(NXP, for 3 LED die)
Pad layout
Ch.
1
2
3
MCPCB
Pad
4
3
5
2
6
1
String/die
1/ABE
2/CGI
3/DFH
Function
Cathode Anode +
Cathode Anode +
Cathode Anode +
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LZ9 secondary TIR optics family
LLxx-3T06-H
Optical Specification
degrees
degrees
Optical
4
efficiency
%
LLSP-3T06-H
17
36
90
5.4
LLNF-3T06-H
26
49
90
2.2
LLFL-3T06-H
39
83
90
1.2
Part number
1
Beam angle
2
Field angle
3
On-axis
5
intensity
cd/lm
Notes:
1.
Lenses can also be ordered without the holder. Replace –H with –O for this option.
2.
Beam angle is defined as the full width at 50% of the max intensity (FWHM).
3.
Field angle is defined as the full width at 10% of the max intensity.
4.
Optical efficiency is defined as the ratio between the incoming flux and the outgoing flux.
5.
On-axis intensity is defined as the ratio between the total input lumen and the intensity in the optical center of the lens.
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Typical Relative Intensity over Angle
100%
LZ9 emitter
LLSP-3T06-H
80%
Relative Intensity
LLNF-3T06-H
LLFL-3T06-H
60%
40%
20%
0%
-90
-60
-30
0
30
60
90
Angle (degrees)
General Characteristics
Symbol
Value
Rating
Unit
Height from Seating Plane
19.2
Typical
mm
Diameter
38.9
Typical
mm
Mechanical
Material
Lens
PMMA
Holder
Polycarbonate
Optical
1
Transmission (>90%)
λ
410-1100
Min-Max.
nm
Storage Temperature
Tstg
-40 ~ +110
Min-Max.
°C
Operating Temperature
Tsol
-40 ~ +110
Min-Max.
°C
Environmental
Notes:
1.
It is not recommended to use a UV emitter with this lens due to lower transmission at wavelengths < 410nm.
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Mechanical Dimensions
Lens with Holder
Lens
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Company Information
LED Engin, based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and
light engines to create uncompromised lighting experiences for a wide range of entertainment, architectural,
general lighting and specialty applications. LuxiGen™ multi-die emitter and secondary lens combinations reliably
deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors
including whites, tunable whites, multi-color and UV LEDs in a unique patented compact ceramic package. Our
LuxiTuneTM series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality,
control, freedom and high density tunable white light solutions for a broad range of new recessed and
downlighting applications. The small size, yet remarkably powerful beam output and superior in-source color
mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is
required.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
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