Gallery White LED Emitter
LZ4-00GW08
Key Features
4-die Gallery White (CRI 98) LED
3 SDCM color bins for CCT - 3000K
Superior Color Rendering: CRI (Ra) 98; R9 98 and R15 98
Up to 10 Watt power dissipation on compact 7.0mm x 7.0mm footprint
Low Thermal Resistance (2.8°C/W)
Engineered ceramic package with integrated glass lens
JEDEC Level 1 for Moisture Sensitivity Level
Autoclave compliant (JEDEC JESD22-A102-C)
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available on Standard or Serially connected MCPCB (optional)
Full suite of TIR secondary optics family available
Typical Applications
Gallery lighting
Museum lighting
High-end retail lighting
Medical surgery lighting
Description
The LZ4-00GW08 Gallery White features warm white light with an exceptional color rendering index (CRI) of 98, as
well as impressive individual R values (R1-16) in industry’s smallest footprint. It enables accurate color
representation and enhances the contrast of retail merchandise, artwork and skin tones, which cannot be obtained
with standard warm white LED emitters. The emitter, based on LED Engin’s LuxiGen technology platform, may be
driven up to 10W of power in a compact 7.0mmx7.0mm footprint. It has the industry lowest thermal resistance per
package size, which allows users to drive the emitter with higher current, while keeping the junction temperature
low to ensure long operating life.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Part number options
Base part number
Part number
Description
LZ4-00GW08-xxxx
LZ4 Gallery White emitter
LZ4-40GW08-xxxx
LZ4 Gallery White emitter on Standard Star 1 channel MCPCB
Bin kit option codes
GW, Gallery White (CRI 98)
Kit number
suffix
Min
flux
Bin
Chromaticity bins
Description
0030
S
3-step MacAdams ellipse
full distribution flux; 3000K ANSI CCT
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Gallery White CCT Bins
3-step MacAdam ellipse color bins plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below in the table.
Gallery White 3-Step MacAdam Ellipse CCT Bin Coordinates
Nominal ANSI
CCT
3000
Center Point
(cx, cy)
(0.4366, 0.4042)
Major Axis
a
0.00967
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Minor Axis
b
0.00399
Ellipse Rotation
Angle (⁰)
56.6
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Luminous Flux Bins
Table 1:
Bin
Code
Minimum
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
(lm)
Maximum
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
(lm)
Typical
Luminous Flux (ΦV)
@ IF = 1000mA [2]
(lm)
S
T
356
445
445
556
810
650
Notes for Table 1:
1.
Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.
Forward Voltage Bin
Table 2:
Bin
Code
Minimum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
Maximum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
0
12.0
14.4
Notes for Table 2:
1.
Forward Voltage is binned with all four LED dice connected in series.
2.
LED Engin maintains a tolerance of ± 0.4V for forward voltage measurements for the four LEDs.
Color Rendering Index Bin
Table 3:
Bin Code
Minimum
Color Rendering Index
@ IF = 700mA
0
95.0
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Absolute Maximum Ratings
Table 4:
Parameter
Symbol
Value
DC Forward Current [1]
Peak Pulsed Forward Current [2]
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature [4]
Allowable Reflow Cycles
IF
IFP
VR
Tstg
TJ
Tsol
1000
2000
See Note 3
-40 ~ +150
150
260
6
121°C at 2 ATM,
100% RH for 168 hours
Autoclave Conditions [5]
Unit
mA
mA
V
°C
°C
°C
> 8,000 V HBM
Class 3B JESD22-A114-D
ESD Sensitivity [6]
Notes for Table 4:
1.
Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 10 for current derating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5.
5.
Autoclave Conditions per JEDEC JESD22-A102-C.
6.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00GW08 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Typical
Unit
Luminous Flux (@ IF = 700mA) [1]
Luminous Flux (@ IF = 1000mA) [1]
Luminous Efficacy (@ IF = 350mA)
Correlated Color Temperature
Color Rendering Index (CRI) [2]
Viewing Angle [3]
Total Included Angle [4]
ΦV
ΦV
480
620
67
3000
98
105
135
lm
lm
lm/W
K
CCT
Ra
2Θ1/2
Θ0.9V
Degrees
Degrees
Notes for Table 5:
1.
Luminous flux typical value is for all four LED dice operating concurrently at rated current.
2.
Typical Ra and individual R1 through R16 values listed in Table 6
3.
Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
4.
Total Included Angle is the total angle that includes 90% of the total luminous flux.
Typical CRI (Ra) and individual R values
Table 6:
Ra
98
R1
98
R2
99
R3
97
R4
98
R5
98
R6
98
R7
98
R8
98
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R9
98
R10
99
R11
96
R12
86
R13
98
R14
97
R15
98
R16
96
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Electrical Characteristics @ TC = 25°C
Table 7:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 700mA) [1]
Forward Voltage (@ IF = 1000mA) [1]
Temperature Coefficient
of Forward Voltage [1]
VF
VF
12.9
13.3
V
V
ΔVF/ΔTJ
-8.0
mV/°C
RΘJ-C
2.8
°C/W
Thermal Resistance
(Junction to Case)
Notes for Table 7:
1.
Forward Voltage typical value is for all four LED dice connected in series.
IPC/JEDEC Moisture Sensitivity Level
Table 8 - IPC/JEDEC J-STD-20D.1 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
Unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 8:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and
includes the maximum time allowed out of the bag at the distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period.
Based on long-term WHTOL testing, LED Engin projects that the LZ4 Series will deliver, on average, 90% Lumen
Maintenance at 65,000 hours of operation at a forward current of 700 mA per die. This projection is based on
constant current operation with junction temperature maintained at or below 110°C.
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Mechanical Dimensions (mm)
Pin Out
Pad
Die
1
A
Anode
2
A
Cathode
3
B
Anode
4
B
Cathode
5
C
Anode
6
C
Cathode
7
D
Anode
8
D
Cathode
9 [2]
n/a
Thermal
1
Figure 1: Package outline drawing.
Notes for Figure 1:
1.
Index mark, Ts indicates case temperature measurement point.
2.
Unless otherwise noted, the tolerance = ± 0.20 mm.
3.
Thermal contact, Pad 9, is electrically neutral.
2
Function
3
8
4
7
6
5
Recommended Solder Pad Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad for
non-pedestal and pedestal design
Note for Figure 2a:
1. Unless otherwise noted, the tolerance = ± 0.20 mm.
2. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate the high thermal resistance
dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system
thermal resistance.
3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less
than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure
rates due to thermal over stress.
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Recommended Solder Mask Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8 mil Stencil Apertures Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2c: Recommended 8mil stencil apertures for anode, cathode, and
thermal pad for non-pedestal and pedestal design
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
Typical Radiation Pattern
100
90
Relative Intensity (%)
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern.
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Typical Relative Spectral Power Distribution
1
0.9
Relative Spectral Power
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
350
400
450
500
550
600
650
700
750
800
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C.
Typical Relative Light Output over Forward Current
140%
Relatiive Light Output
120%
100%
80%
60%
40%
20%
0%
0
200
400
600
800
1000
IF - Forward Current (mA)
Figure 6: Typical relative light output vs. forward current @ TC = 25°C.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Typical Relative Light Output over Temperature
110%
Relative Light Output
100%
90%
80%
70%
60%
0
10
20
30
40
50
60
Case Temperature (oC)
70
80
90
100
Figure 7: Typical relative light output vs. case temperature.
Typical Chromaticity Coordinate Shift over Forward Current
0.0400
Delta_Cx
0.0300
Delta_Cy
Delta Cx, Delta Cy
0.0200
0.0100
0.0000
-0.0100
-0.0200
-0.0300
-0.0400
0
100
200
300
400
500
600
700
800
900
1000
IF - Forward Current (mA)
Figure 8: Typical chromaticity coordinate shift vs. forward current
Typical Chromaticity Coordinate Shift over Temperature
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0.0400
0.0300
Delta_Cx
Delta Cx, Delta Cy
0.0200
Delta_Cy
0.0100
0.0000
-0.0100
-0.0200
-0.0300
-0.0400
0
10
20
30
40
50
60
70
80
90
100
Case Temperature (°C)
Figure 9: Typical chromaticity coordinate shift vs. Case temperature
Typical Forward Current Characteristics
1200
IF - Forward Current (mA)
1000
800
600
400
200
0
10.0
11.0
12.0
13.0
14.0
VF - Forward Voltage (V)
Figure 10: Typical forward current vs. forward voltage @ TC = at 25°C.
Note for Figure 10:
1.
Forward Voltage curve assumes that all four LED dice are connected in series.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Current De-rating
IF - Maximum Forward Current (mA)
1200
RΘ_J-A 5.0 °C/W
1000
RΘ_J-A 5.5 °C/W
RΘ_J-A 6.0 °C/W
800
700
(Rated)
600
400
200
0
0
25
50
75
Maximum Ambient Temperature (oC)
100
125
Figure 11: Maximum forward current vs. ambient temperature based on TJ(MAX) = 150°C.
Notes for Figure 11:
1.
Maximum current assumes that all four LED dice are operating concurrently at the same current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00GW08 is typically 2.8°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Emitter Tape and Reel Specifications (mm)
Figure 12: Emitter carrier tape specifications (mm).
Figure 13: Emitter Reel specifications (mm).
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LZ4 MCPCB Family
Part number
Type of MCPCB
Diameter
(mm)
LZ4-4xxxxx
1-channel
19.9
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Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
2.8 + 1.1 = 3.9
12.9
700
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LZ4-4xxxxx
1 channel, Standard Star MCPCB (1x4) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink
The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W
Components used
MCPCB:
ESD chips:
HT04503
BZX585-C30
(Bergquist)
(NPX, for 4 LED dies in series)
Pad layout
Ch.
1
MCPCB
Pad
1,2,3
4,5
String/die
Function
1/ABCD
Cathode Anode +
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Application Guidelines
MCPCB Assembly Recommendations
A good thermal design requires an efficient heat transfer from the MCPCB to the heat sink. In order to minimize air
gaps in between the MCPCB and the heat sink, it is common practice to use thermal interface materials such as
thermal pastes, thermal pads, phase change materials and thermal epoxies. Each material has its pros and cons
depending on the design. Thermal interface materials are most efficient when the mating surfaces of the MCPCB
and the heat sink are flat and smooth. Rough and uneven surfaces may cause gaps with higher thermal resistances,
increasing the overall thermal resistance of this interface. It is critical that the thermal resistance of the interface is
low, allowing for an efficient heat transfer to the heat sink and keeping MCPCB temperatures low.
When optimizing the thermal performance, attention must also be paid to the amount of stress that is applied on
the MCPCB. Too much stress can cause the ceramic emitter to crack. To relax some of the stress, it is advisable to
use plastic washers between the screw head and the MCPCB and to follow the torque range listed below. For
applications where the heat sink temperature can be above 50oC, it is recommended to use high temperature and
rigid plastic washers, such as polycarbonate or glass-filled nylon.
LED Engin recommends the use of the following thermal interface materials:
1.
Bergquist’s Gap Pad 5000S35, 0.020in thick
Part Number: Gap Pad® 5000S35 0.020in/0.508mm
Thickness: 0.020in/0.508mm
Thermal conductivity: 5 W/m-K
Continuous use max temperature: 200°C
Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the
recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m)
2.
3M’s Acrylic Interface Pad 5590H
Part number: 5590H @ 0.5mm
Thickness: 0.020in/0.508mm
Thermal conductivity: 3 W/m-K
Continuous use max temperature: 100°C
Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the
recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m)
Mechanical Mounting Considerations
The mounting of MCPCB assembly is a critical process step. Excessive mechanical stress build up in the MCPCB can
cause the MCPCB to warp which can lead to emitter substrate cracking and subsequent cracking of the LED dies
LED Engin recommends the following steps to avoid mechanical stress build up in the MCPCB:
o Inspect MCPCB and heat sink for flatness and smoothness.
o Select appropriate torque for mounting screws. Screw torque depends on the MCPCB mounting
method (thermal interface materials, screws, and washer).
o Always use three M3 or #4-40 screws with #4 washers.
o When fastening the three screws, it is recommended to tighten the screws in multiple small
steps. This method avoids building stress by tilting the MCPCB when one screw is tightened in a
single step.
o Always use plastic washers in combinations with the three screws. This avoids high point contact
stress on the screw head to MCPCB interface, in case the screw is not seated perpendicular.
o In designs with non-tapped holes using self-tapping screws, it is common practice to follow a
method of three turns tapping a hole clockwise, followed by half a turn anti-clockwise, until the
appropriate torque is reached.
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Wire Soldering
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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About LED Engin
LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED
emitters, optics and light engines to create uncompromised lighting experiences for a wide range of
entertainment, architectural, general lighting and specialty applications. LuxiGenTM multi-die emitter and
secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a
target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented
compact ceramic package. Our LuxiTuneTM series of tunable white lighting modules leverage our LuxiGen emitters
and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of
new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional
light is required. LED Engin is committed to providing products that conserve natural resources and reduce
greenhouse emissions; and reserves the right to make changes to improve performance without notice.
For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200.
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