LZC-83MC00-0000

High Luminous Efficacy RGB LED Emitter LZC-03MC00 Key Features  Ultra-bright, Ultra-compact 40W RGB LED  Full spectrum of brilliant colors with superior color mixing  Small high density foot print – 9.0mm x 9.0mm  Surface mount ceramic package with integrated glass lens  Exceptionally low Thermal Resistance (0.7°C/W)  Electrically neutral thermal path  Extreme Luminous Flux density  JEDEC Level 1 for Moisture Sensitivity Level  Lead (Pb) free and RoHS compliant  Reflow solderable (up to 6 cycles)  Emitter available on 3-channel MCPCB (optional)  Recommended use with LL-3T08 family of High Efficiency / High Uniformity color-mixing lenses for perfect color uniformity from 8 to 32 deg. Typical Applications  Architectural Lighting  Entertainment  Stage and Studio Lighting  Accent Lighting Description The LZC-03MC00 RGB LED emitter enables a full spectrum of brilliant colors with the highest light output, highest flux density, and superior color mixing available. It outperforms other colored lighting solutions with multiple red, green and blue LED die in a single, compact emitter. With 40W power capability and a 9.0mm x 9.0mm ultra-small footprint, this package provides exceptional luminous flux density. LED Engin’s RGB LED offers ultimate design flexibility with three individually addressable color channels. The patented design with thermally and electrically isolated pads has unparalleled thermal and optical performance. The high quality materials used in the package are chosen to optimize light output and minimize stresses which results in monumental reliability and lumen maintenance. The robust product design thrives in outdoor applications with high ambient temperatures and high humidity. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Part Number Options Base part number Part number Description LZC-03MC00-xxxx LZC emitter LZC-83MC00-xxxx LZC emitter on 3 channel 3x4 Star MCPCB Notes: 1. See “Part Number Nomenclature” for full overview on LED Engin part number nomenclature. Bin Kit Option Codes MC, Red-Green-Blue (RGB) Kit number suffix Min flux Bin Color Bin Range 0000 02R R2 – R2 07G G2 – G3 07B B01 – B02 Description Red full distribution flux; full distribution wavelength Green full distribution flux; full distribution wavelength Blue full distribution flux; full distribution wavelength Notes: Default bin kit option is -0000 COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 2 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Luminous Flux Bins Table 1: Minimum Maximum Luminous Flux (ΦV) Luminous Flux (ΦV) @ IF = 700mA [1,2] @ IF = 700mA [1,2] (lm) (lm) Bin Code 4 Red 02R 4 Green 4 Blue 4 Red 240 4 Green 4 Blue 400 07G 330 520 07B 64 103 08B 103 175 Notes for Table 1: 1. Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ±10% on flux measurements. 2. Each color consists of 4 die in series for binning purposes. Dominant Wavelength Bins Table 2: Bin Code R2 G2 G3 B01 B02 Minimum Dominant Wavelength (λD) @ IF = 700mA [1,2] (nm) 1 Red 2 Green [2] 1 Blue 618 520 525 452 457 Maximum Dominant Wavelength (λD) @ IF = 700mA [1,2] (nm) 1 Red 2 Green [2] 1 Blue 630 525 530 457 462 Notes for Table 2: 1. LED Engin maintains a tolerance of ± 1.0nm on dominant wavelength measurements. 2. Green LEDs are binned for dominant wavelength @ IF = 350mA. Refer to Figure 6 for typical dominant wavelength shift over forward current. Forward Voltage Bin Table 3: Bin Code 0 Minimum Forward Voltage (VF) @ IF = 700mA [1,2] (V) 4 Red 4 Green 4 Blue 8.00 12.80 12.80 Maximum Forward Voltage (VF) @ IF = 700mA [1,2] (V) 4 Red 4 Green 4 Blue 11.84 17.20 17.76 Notes for Table 3: 1. Forward Voltage is binned with all four LED dice connected in series. 2. LED Engin maintains a tolerance of ± 0.16V for forward voltage measurements for the four LEDs. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 3 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Absolute Maximum Ratings Table 4: Parameter DC Forward Current [1] Peak Pulsed Forward Current [2] Reverse Voltage Storage Temperature Junction Temperature [Blue, Green] Junction Temperature [Red] Soldering Temperature [4] Allowable Reflow Cycles Symbol IF IFP VR Tstg TJ TJ Tsol Value 1000 1500 See Note 3 -40 ~ +150 150 125 260 6 Unit mA mA V °C °C °C °C > 8,000 V HBM Class 3B JESD22-A114-D ESD Sensitivity [5] Notes for Table 4: 1. Maximum DC forward current is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 11 for current derating. 2: Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%. 3. LEDs are not designed to be reverse biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5. 5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZC-03MC00 in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @ TC = 25°C Table 5: Parameter Symbol Luminous Flux (@ IF = 700mA) Luminous Flux (@ IF = 1000mA) Dominant Wavelength Viewing Angle [2] Total Included Angle [3] ΦV ΦV λD 2Θ½ Θ0.9 Red 280 360 623 Typical Green 455 590 523 95 115 Blue [1] 100 130 460 Unit lm lm nm Degrees Degrees Notes for Table 5: 1. When operating the Blue LED, observe IEC 60825-1 class 2 rating. Do not stare into the beam. 2. Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value. 3. Total Included Angle is the total angle that includes 90% of the total luminous flux. Electrical Characteristics @ TC = 25°C Table 6: VF VF 4 Red 9.4 10.2 Typical 4 Green 16.8 18.0 4 Blue 14.0 14.6 ΔVF/ΔTJ -7.6 -11.6 -12.0 Parameter Symbol Forward Voltage (@ IF = 700mA) Forward Voltage (@ IF = 1000mA) Temperature Coefficient of Forward Voltage Thermal Resistance (Junction to Case) RΘJ-C 0.7 Unit V V mV/°C °C/W Note for Table 6: 1. Forward Voltage typical value is for all four LED dice from the same color connected in series. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 4 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Average Lumen Maintenance Projections Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original light output remaining at a defined time period. Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen Maintenance at 65,000 hours of operation at a forward current of 700 mA. This projection is based on constant current operation with junction temperature maintained at or below 125°C. IPC/JEDEC Moisture Sensitivity Level Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 Unlimited ≤ 30°C/ 85% RH 168 +5/-0 85°C/ 85% RH n/a n/a Notes for Table 7: 1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor’s facility. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 5 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Mechanical Dimensions (mm) Pin Out Figure 1: Package Outline Drawing Pin Die Color Polarity 3 C Red Anode + 4 C Red Cathode - 9 E Red Anode + 10 E Red Cathode - 21 M Red Anode + 22 M Red Cathode - 15 P Red Anode + 16 P Red Cathode - 5 B Green Cathode - 6 B Green Anode + 23 H Green Cathode - 24 H Green Anode + 11 J Green Cathode - 12 J Green Anode + 17 Q Green Cathode - 18 Q Green Anode + 2 G Blue Anode + 7 G Blue na 7 F Blue na 13 F Blue na 13 K Blue na 19 K Blue na 19 L Blue na 20 L Blue Cathode - Note for Figure 1: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. Recommended Solder Pad Layout (mm) Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad. Note for Figure 2a: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 6 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Recommended Solder Mask Layout (mm) Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad. Note for Figure 2b: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. Reflow Soldering Profile Figure 3: Reflow soldering profile for lead free soldering. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 7 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Radiation Pattern 100 90 Relative Intensity (%) 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angular Displacement (Degrees) Figure 4: Typical representative spatial radiation pattern. Typical Relative Spectral Power Distribution 1 Relative Spectral Power 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 450 500 550 600 650 700 Wavelength (nm) Figure 5: Typical relative spectral power vs. wavelength @ T C = 25°C. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 8 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Dominant Wavelength Shift over Forward Current Relative Dominant Wavlength (nm) 4 3 2 1 0 -1 Red Green Blue -2 300 400 500 600 700 800 900 1000 1100 IF - Forward Current (mA) Figure 6: Typical dominant wavelength shift vs. forward current @ T C = 25°C. Dominant Wavelength Shift over Temperature Dominant Wavelength Shift (nm) 4 3.5 3 2.5 2 Red Green Blue 1.5 1 0.5 0 0 20 40 60 80 100 120 Case Temperature (ºC) Figure 7: Typical dominant wavelength shift vs. case temperature. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 9 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Relative Light Output 140 Relative Light Output (%) 120 100 80 60 40 Red Green Blue 20 0 0 200 400 600 800 1000 IF - Forward Current (mA) Figure 8: Typical relative light output vs. forward current @ T C = 25°C. Typical Relative Light Output over Temperature 120 Relative Light Output (%) 100 80 60 Red Green Blue 40 20 0 0 20 40 60 80 100 120 Case Temperature (ºC) Figure 9: Typical relative light output vs. case temperature. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 10 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Typical Forward Current Characteristics 1200 IF - Forward Current (mA) 1000 800 600 4 Red 4 Green 4 Blue 400 200 0 6 8 10 12 14 16 18 20 VF - Forward Voltage (V) Figure 10: Typical forward current vs. forward voltage @ T C = 25°C. Current De-rating IF - Maximum Current (mA) 1200 1000 800 700 (Rated) 600 400 RΘJ-A = 2.0°C/W RΘJ-A = 2.5°C/W RΘJ-A = 3.0°C/W 200 0 0 25 50 75 100 125 150 Maximum Ambient Temperature (°C) Figure 11: Maximum forward current vs. ambient temperature based on T J(MAX) = 150°C. Notes for Figure 11: 1. Maximum current assumes that all 12 LED dice are operating concurrently at the same current. 2. RΘJ-C [Junction to Case Thermal Resistance] for the LZC-03MC00 is typically 0.7°C/W. 3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance]. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 11 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Emitter Tape and Reel Specifications (mm) Figure 12: Emitter carrier tape specifications (mm). Figure 13: Emitter Reel specifications (mm). COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 12 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZC MCPCB Family Part number Type of MCPCB Diameter (mm) LZC-8xxxxx 3-channel 28.3 COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 13 Emitter + MCPCB Typical Vf Thermal Resistance (V) (°C /W) Typical If (mA) 0.7 + 0.6 = 1.3 700 9.4 – 16.8 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin LZC-8xxxxx 3-Channel MCPCB Mechanical Dimensions (mm) Pin Function with: LZC-00MC00 Pad Polarity 1 Cathode - 2 Anode + 3 Anode + 4 Cathode - 5 Cathode - 6 Anode + Function Ch. Blue 3 Red 1 Green 2 Note for Figure 1:  Unless otherwise noted, the tolerance = ± 0.20 mm.  Slots in MCPCB are for M3 or #4 mounting screws.  LED Engin recommends using plastic washers to electrically insulate screws from solder pads and electrical traces.  LED Engin recommends using thermally conductive tape or adhesives when attaching MCPCB to a heat sink.  The thermal resistance of the MCPCB is: RΘC-B 0.6°C/W Components used MCPCB: ESD chips: HT04503 BZX585-C30 COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. (Bergquist) (NPX, for 4 LED dies in series) 14 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Application Guidelines MCPCB Assembly Recommendations A good thermal design requires an efficient heat transfer from the MCPCB to the heat sink. In order to minimize air gaps in between the MCPCB and the heat sink, it is common practice to use thermal interface materials such as thermal pastes, thermal pads, phase change materials and thermal epoxies. Each material has its pros and cons depending on the design. Thermal interface materials are most efficient when the mating surfaces of the MCPCB and the heat sink are flat and smooth. Rough and uneven surfaces may cause gaps with higher thermal resistances, increasing the overall thermal resistance of this interface. It is critical that the thermal resistance of the interface is low, allowing for an efficient heat transfer to the heat sink and keeping MCPCB temperatures low. When optimizing the thermal performance, attention must also be paid to the amount of stress that is applied on the MCPCB. Too much stress can cause the ceramic emitter to crack. To relax some of the stress, it is advisable to use plastic washers between the screw head and the MCPCB and to follow the torque range listed below. For o applications where the heat sink temperature can be above 50 C, it is recommended to use high temperature and rigid plastic washers, such as polycarbonate or glass-filled nylon. LED Engin recommends the use of the following thermal interface materials: 1. Bergquist’s Gap Pad 5000S35, 0.020in thick  Part Number: Gap Pad® 5000S35 0.020in/0.508mm  Thickness: 0.020in/0.508mm  Thermal conductivity: 5 W/m-K  Continuous use max temperature: 200°C  Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m) 2. 3M’s Acrylic Interface Pad 5590H  Part number: 5590H @ 0.5mm  Thickness: 0.020in/0.508mm  Thermal conductivity: 3 W/m-K  Continuous use max temperature: 100°C  Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m) Mechanical Mounting Considerations The mounting of MCPCB assembly is a critical process step. Excessive mechanical stress build up in the MCPCB can cause the MCPCB to warp which can lead to emitter substrate cracking and subsequent cracking of the LED dies LED Engin recommends the following steps to avoid mechanical stress build up in the MCPCB: o Inspect MCPCB and heat sink for flatness and smoothness. o Select appropriate torque for mounting screws. Screw torque depends on the MCPCB mounting method (thermal interface materials, screws, and washer). o Always use three M3 or #4-40 screws with #4 washers. o When fastening the three screws, it is recommended to tighten the screws in multiple small steps. This method avoids building stress by tilting the MCPCB when one screw is tightened in a single step. o Always use plastic washers in combinations with the three screws. This avoids high point contact stress on the screw head to MCPCB interface, in case the screw is not seated perpendicular. o In designs with non-tapped holes using self-tapping screws, it is common practice to follow a method of three turns tapping a hole clockwise, followed by half a turn anti-clockwise, until the appropriate torque is reached. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 15 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin Wire Soldering   To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601) COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 16 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin About LED Engin LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and light engines to create uncompromised lighting experiences for a wide range of TM entertainment, architectural, general lighting and specialty applications. LuxiGen multi-die emitter and secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented TM compact ceramic package. Our LuxiTune series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required. LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions; and reserves the right to make changes to improve performance without notice. For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200. COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. 17 LZC-03MC00 (5.5 - 11/14/2018) LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin