SD53-2R0-R

Technical Data 4149 Effective November 2015 Supersedes March 2007 SD53 Low profile shielded power inductors Applications • Desktop computers • Notebook and laptop regulators • LED and White LED drivers • Digital cameras, media devices • Battery power systems Environmental Data Product description • Octagonal shape utilizes board space • Shielded drum core • Inductance range from 1.1 uH to 100 uH • Current range from 0.44 A to 4.8 A • 5.7 mm x 5.2 mm footprint surface mount package in a 3.0 mm height • Ferrite core material • Halogen free, lead free, RoHS compliant • Storage temperature range (component): -40 °C to +125 °C • Operating temperature range: -40 °C to +125 °C (Ambient plus self temperature rise) • Solder reflow temperature: J-STD-020D compliant HALOGEN Pb HF FREE SD53 Low profile shielded power inductors  Technical Data 4149 Effective November 2015 Product Specifications Part Number5 OCL1 (μH) ±20% Part marking Irms2 (A) Isat3 (A) DCR (Ω) typical @ 20 °C DCR (Ω) maximum @ 20 °C K-factor4 0.017 0.020 48 SD53-1R1-R 1.10 A 3.25 4.80 SD53-2R0-R 2.00 B 2.64 3.30 0.023 0.027 35 SD53-3R3-R 3.30 C 2.26 2.60 0.029 0.034 28 SD53-4R7-R 4.70 D 2.01 2.10 0.039 0.045 21 SD53-6R8-R 6.80 E 1.65 1.85 0.059 0.068 20 SD53-100-R 10.0 F 1.41 1.40 0.077 0.090 15 SD53-150-R 15.0 G 1.10 1.10 0.122 0.142 12 SD53-220-R 22.0 H 0.81 0.94 0.179 0.208 10 SD53-330-R 33.0 I 0.75 0.76 0.221 0.257 8 SD53-470-R 47.0 J 0.64 0.64 0.303 0.352 7 SD53-680-R 68.0 K 0.52 0.58 0.452 0.525 6 SD53-101-R 100 L 0.44 0.45 0.689 0.801 5 1. 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc. 2. Irms: DC current for an approximate ∆T of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125 °C under worst case operating conditions verified in the end application 3. lsat: Peak current for approximately 30% rolloff @ 25 °C. 4. K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L*∆I, B p-p(mT), K: (K factor from table), L: (Inductance in uH), ∆I (Peak to peak ripple current in Amps). 5. Part Number Definition: SD53-xxx-R SD53 = Product code and size; -xxx = Inductance value in uH; R = decimal point; If no R is present then third character equals the number of zeros. -R suffix = RoHS compliant. 53 Dimensions (mm) Part Marking: Line 1: (1st digit= inductance value per Part Marking Designator); (2nd digit= Bi-weekly production date code); (3rd digit= Last digit of the year produced), (4th digit= Internal manufacturing code). Line 2: 53=product size code) Do not route traces or vias underneath the inductor Packaging information (mm) Parts packaged on 13” diameter reel, 2,600 parts per reel. 2 www.eaton.com/elx SD53 Low profile shielded power inductors Technical Data 4149 Effective November 2015  Core loss vs. Bp-p 10 1 1MH z Core Loss (W) 0.1 500kH z 300kH z 200kH z 100kH z 0.01 0.001 0.0001 0.00001 0.000001 1 10 Bp-p (mT) 100 1000 Temperature rise vs. total loss Inductance characteristics www.eaton.com/elx 3 SD53 Low profile shielded power inductors  Technical Data 4149 Effective November 2015 Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3