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FP3-2R0-R

FP3-2R0-R

  • 厂商:

    EATON(伊顿)

  • 封装:

    SMD

  • 描述:

    FIXED IND 2UH 5.4A 15 MOHM SMD

  • 数据手册
  • 价格&库存
FP3-2R0-R 数据手册
Technical Data 4118 Effective October 2015 Supersedes April 2013 FP3 High current, low profile inductors Applications Product description • Low profile high current inductors • Inductance range 0.1μh to 15μh • Design utilizes high temperature iron powder alloy material with a non-organic binder to eliminate thermal aging • 7.25 x 6.7mm footprint surface mount package in a 3.0mm height • Magnetically shielded, low EMI • Current rating up to 34.7Adc (Higher peak cur­ rents may be attained with a greater rolloff, see rolloff curve) • Frequency range up to 2MHz • Voltage Regulator Modules (VRMs) • Multi-phase regulators • Desktop and server VRMs and EVRDs • Notebook and laptop regulators • Battery power systems • Graphics cards • Point-of-load modules Environmental data • Storage temperature range (component): -40°C to +155°C • Operating temperature range: -40°C to +155°C (ambient plus self temperature rise) • Solder reflow temperature: J-STD-020D Pb FP3 High current, low profile inductors  Technical Data 4118 Effective October 2015 Product specifications Part number6 OCL (uH) ± 15% lrms2 amps lsat3 amps 10% lsat4 amps 15% DCR mOhms @ 20°C typ DCR mOhms @ 20°C max K-factor5 FP3-R10-R 0.10 19.0 27 34.7 1.00 1.21 803 FP3-R20-R 0.22 15.3 16 20.8 1.54 1.88 482 FP3-R47-R 0.44 10.9 11.6 14.9 3.05 3.67 344 FP3-R68-R 0.72 9.72 9.0 11.6 3.85 4.63 268 FP3-1R0-R 1.10 6.26 7.4 9.5 9.40 11.2 219 FP3-1R5-R 1.50 5.78 6.2 8.0 10.0 13.1 185 FP3-2R0-R 2.00 5.40 5.4 6.9 11.5 15.0 161 FP3-3R3-R 3.20 3.63 4.3 5.5 24.5 30.0 127 FP3-4R7-R 4.70 3.23 3.5 4.2 34.9 40.0 105 FP3-8R2-R 8.5 2.91 2.6 3.4 61.6 74.0 78 FP3-100-R 10.9 2.30 2.3 3.0 84.2 101 69 FP3-150-R 14.9 2.22 2.0 2.5 106.0 127 59 5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p =K*L*ΔI. Bpp: (Gauss), K: (K factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps). 6. Part number definition: FP3 = product code and size xxx = inductance value in μH R = decimal point (if no “R” is present, then last character equals the number of zeros) “-R” suffix = RoHS complaint 1. OCL (Open Circuit Inductance) Test parameters: 100kHz, 0.1Vrms, 0.0Adc 2. Irms DC current for an approximate ΔT of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 155°C under worst case operating conditions verified in the end application. 3. Isat Amps Peak for approximately 10% rolloff @ 20°C 4. Isat Amps Peak for approximately 15% rolloff @ 20°C Dimensions–mm RECOMMENDED PAD LAYOUT 2.80 ±0.25 FP3 XXX YWWL 3.00 Max SCHEMATIC 1 (2x) 2.80 ±0.25 1.0 min. (2x) 1 7.25 Max 7.50 2.50 (2x) 2 6.70 Max (2x) 2 4.50 (2x) Part marking: FP3 (Product code and size), xxx=(inductance value in µH), R=decimal point (if no “R” is present, then last character equals the number of zeroes, YWW=Date code, L=Location code Packaging information (mm) Supplied in tape and reel packaging, 1700 parts per 13” diameter reel 1.5 Dia 1.5 Dia 4.0 2.0 1.75 A 1 FP3 XXX YWWL 7.5 2 A 6.9 3.2 SECTION A-A 2 www.eaton.com/elx 12.0 Direction of Feed 7.5 16.0 +/-0.3 FP3 High current, low profile inductors Technical Data 4118 Effective October 2015  Inductance characteristics OCL vs. Isat 100 90 % of OCL 80 70 60 50 40 30 20 10 0 0 20 40 60 80 100 120 140 160 180 200 % of Isat Core Loss (W) Core loss 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 250 Frequency (kHz) 200 300 400 500 600 700 800 500 750 900 1000 1250 1500 1750 2000 2250 1000 B p-p (Gauss) Temperature Rise (°C) Temperature rise vs. total loss 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 0.12 0.24 0.36 0.48 0.61 0.73 0.85 0.97 1.09 1.21 1.33 1.45 1.57 Total Loss (W) www.eaton.com/elx 3 FP3 High current, low profile inductors  Technical Data 4118 Effective October 2015 Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3
FP3-2R0-R 价格&库存

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