HC9-330-R

Technical Data DS4312 Effective December 2015 Supersedes December 2007 HC9 High current power inductors Applications Product description • Surface mount inductors designed for higher speed switch mode applications requiring lower inductance, low voltage and high current • Design utilizes high temperature powder iron material with a non-organic binder to eliminate thermal aging • Inductance Range from 0.2μH to 47.0μH • Current Range from 3.65 amps to 95.0 amps • Frequency Range 1kHz to 500kHz • Multi-phase regulators • Voltage Regulator Modules (VRMs) • Distributed power systems DC-DC converters • Desktop and server VRMs and EVRDs • Point-of-Load (POL) modules • Field Programmable Gate Array (FPGA) DC-DC converters • Battery power systems • High current power supplies • Data networking and storage systems Environmental data • Storage temperature range (component): -40°C to +155°C • Operating temperature range: -40°C to +155°C (Ambient plus self-temperature rise) • Solder reflow temperature: J-STD-020D compliant Pb HC9 High current power inductors  Technical Data DS4312 Effective December 2015 Product specifications Part number6 OCL1 (μH) ±15% lrms2 (amps) lsat3 (amps) 20% rolloff lsat4 (amps) 30% rolloff DCR (mΩ) maximum @ 20°C Volt-μsec5 (V-μs) HC9-R20-R 0.218 46.7 65 95 0.50 2.87 HC9-R47-R 0.544 33.7 40 57 0.88 4.78 HC9-1R0-R 1.04 23.7 28 41 1.87 6.70 HC9-1R5-R 1.70 21.0 22 32 2.27 8.46 HC9-2R2-R 2.53 17.2 18 26 3.37 10.4 HC9-3R3-R 3.52 14.3 15 22 4.87 12.4 HC9-4R3-R 4.67 13.0 13.2 19.1 5.90 14.4 HC9-6R8-R 7.45 10.3 11.4 15.1 9.40 18.1 HC9-100-R 10.9 8.50 8.6 12.5 14.0 22.0 HC9-220-R 22.4 6.30 6.0 8.7 25.7 31.5 HC9-330-R 34.5 4.42 4.8 7.0 48.8 37.3 HC9-470-R 49.2 3.65 3.9 5.7 72.3 44.8 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, @ +25°C 2. Irms: DC current for an approximately ∆T of 40°C without core loss. Derating is necessary for AC currents. Pad layout, trace thickness and width, airflow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 155°C under worst case conditions verified in the end application. 3. Peak current for approximately 20% rolloff @20°C 4. Peak current for approximately 30% rolloff @20°C 5. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at operating frequency necessary to generate additional core loss which contributes to the 40°C temperature rise. De-rating of the Irms is required to prevent excessive temperature rise. The 100% Vμs rating is equivalent to a ripple current Ip-p of 20% of Isat (30% rolloff option). 6. Part number definition: HC9-xxx-R HC9= Product code and size xxx = Inductance in μH. R = decimal point. If no R is present last character equals number of zeros. -R suffix = RoHS compliant Dimensions–mm HC9-xxx-R Part marking: HC9= (Product code and size)-xxx=(inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros. wwlyly=date code, R=revision level Tolerances are ±0.2 millimeters unless stated otherwise Do not route traces or vias underneath the inductor Packaging information–mm Supplied in tape and reel packaging, 450 parts per reel, 13” diameter reel. HC9-xxx-R 2 www.eaton.com/elx HC9 High current power inductors Technical Data DS4312 Effective December 2015  Rolloff Core loss www.eaton.com/elx 3 HC9 High current power inductors  Technical Data DS4312 Effective December 2015 Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3