SD6030-220-R

Technical Data 4314 Effective August 2017 Supersedes November 2011 SD6030 Low profile shielded drum core power inductors Applications • • • • • • Product features • • • • • • 6.0 mm x 6.0 mm x 3.0 mm surface mount package Ferrite core material Shielded drum core reduces EMI Inductance range from 2.7 µH to 660 µH Current range from 0.16 A to 4.08 A Frequency range up to 1 MHz • • • Notebook, laptop computers Digital cameras LED Drivers TFT LCD Bias supplies Wireless handsets Handheld instruments Gaming consoles GPS devices Battery backup/power Environmental data • • • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HF FREE HALOGEN  Technical Data 4314 Effective August 2017 Product specifications Part Number5 SD6030-2R7-R SD6030-3R3-R SD6030-4R2-R SD6030-5R0-R SD6030-5R8-R SD6030-7R8-R SD6030-100-R SD6030-120-R SD6030-150-R SD6030-180-R SD6030-220-R SD6030-270-R SD6030-330-R SD6030-360-R SD6030-440-R SD6030-520-R SD6030-680-R SD6030-820-R SD6030-101-R SD6030-121-R SD6030-151-R SD6030-181-R SD6030-221-R SD6030-271-R SD6030-331-R SD6030-391-R SD6030-471-R SD6030-561-R SD6030-681-R OCL1 µH ± 30% 2.7 3.3 4.1 4.9 5.8 7.8 9.3 11.3 14.1 17.1 20.4 26.0 32.4 34.4 44.0 52.0 65.6 81.6 94.4 110.1 144.5 175.7 210.9 264.2 313.5 373.7 460.0 546.2 659.4 Irms2 (A) 4.08 3.54 3.11 2.81 2.58 2.38 2.15 1.99 1.71 1.65 1.57 1.31 1.26 1.19 1.10 0.99 0.92 0.80 0.76 0.70 0.64 0.55 0.50 0.44 0.38 0.35 0.33 0.30 0.27 Isat3.(A) 2.60 2.40 2.20 1.90 1.80 1.60 1.30 1.20 1.10 1.00 0.90 0.85 0.75 0.70 0.62 0.58 0.52 0.46 0.42 0.40 0.35 0.32 0.30 0.27 0.25 0.22 0.20 0.18 0.16 1) Open Circuit Inductance Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc. 2 Irms: DC current for an approximate DT of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. Typ. DCR mW@ +20 °C 13 18 23 28 33 39 48 56 76 82 90 130 140 157 185 226 263 343 385 517 608 817 1000 1300 1733 2083 2250 2767 3458 Max DCR mW @ +20 °C 18 24 31 38 45 53 65 76 103 110 122 175 189 212 250 305 355 463 520 620 730 980 1200 1560 2080 2500 2700 3320 4150 K-factor4 34 30 27 24 22 19 17 16 14 13 12 11 9.3 8.7 7.9 7.2 6.5 5.9 5.6 5.6 5.0 4.5 4.0 3.6 3.3 3.0 2.8 2.5 2.3 4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K*L*DI, Bp-p (mT), K: (K factor from table), L: (Inductance in mH), DI (Peak to peak ripple current in Amps). 5 Part Number Definition: SD6030-xxx-R SD6030 = Product code and size; -xxx = Inductance value in mH; R = decimal point; If no R is present, third character equals number of zeros. -R suffix = RoHS compliant 3 Isat Amps peak for 35% rolloff (@ +25 °C) Dimensions-mm Part Marking: xxx = Inductance value in uH. R = decimal point. If no R is present third character = # of zeros, wwlly or wwllyy = Date code, R = Revision level. Do not route traces or vias underneath the inductor Packaging information-mm Parts packaged on 13" diameter reel, 2000 parts per reel. 2 www.eaton.com/electronics SD6030 Low profile shielded drum core power inductors Technical Data 4314 Effective August 2017 Core loss vs Bp-p 500kHz 1MHz 300kHz 1 200kHz 100kHz C ore Lo ss (W) 0.1 0.01 0.001 0.0001 1 10 100 1000 Bp-p ( mT) Temperature rise vs total loss Inductance characteristics -40°C +25°C +85°C www.eaton.com/electronics 3 SD6030 Low profile shielded drum core power inductors Technical Data 4314 Effective August 2017 Solder Reflow Profile TP tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL 25°C Preheat A T smax t TC -5°C Table 1 - Standard SnPb Solder (Tc) Volume mm3 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin ts Package Thickness 2.5mm Time 25°C to Peak Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4314 BU-SB111167 August 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.