SD52-101-R

Technical Data 4311 Effective November 2015 Supersedes March 2007 SD52 High power density, low profile shielded power inductors Applications • Desktop computers • Notebook and laptop regulators • Graphics cards • Digital cameras, media devices Environmental Data • Storage temperature range: -40 °C to +125 °C • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise). • Solder reflow temperature: J-STD-020D compliant Product description • Octagonal shape shielded drum core • Inductance range from 1.2 uH to 150 uH • Current range from 0.28 A to 3.14 A • 5.6 mm x 5.2 mm footprint surface mount package in a 2.0 mm height • Ferrite core material • Halogen free, lead free, RoHS compliant HALOGEN Pb HF FREE SD52 High power density, low profile shielded power inductors  Technical Data 4311 Effective November 2015 Product Specifications Part Number6 OCL1 (μH) ±20% Part marking Irms2 (A) Isat3 (A) DCR4 (Ω) typ. (V us) typ. SD52-1R2-R 1.20 A 2.33 3.14 0.0279 1.49 SD52-2R2-R 2.20 B 1.98 2.30 0.0385 2.03 SD52-3R5-R 3.50 C 1.73 1.82 0.0503 2.57 SD52-4R7-R 4.70 D 1.63 1.64 0.0568 2.84 SD52-6R8-R 6.80 E 1.39 1.28 0.0777 3.65 SD52-100-R 10.0 F 1.11 1.11 0.1215 4.19 SD52-150-R 15.0 G 0.97 0.88 0.1618 5.27 SD52-220-R 22.0 H 0.86 0.73 0.2042 6.35 SD52-270-R 27.0 J 0.73 0.65 0.2864 7.16 SD52-330-R 33.0 K 0.70 0.61 0.3074 7.70 SD52-470-R 47.0 L 0.58 0.50 0.4465 9.32 SD52-680-R 68.0 M 0.47 0.42 0.6829 11.21 SD52-101-R 100 N 0.39 0.35 1.0000 13.37 SD52-151-R 150 O 0.31 0.28 1.6100 17.00 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc. 2. Irms: DC current for an approximate ∆T of 40 °C without core loss. De-rating is necessary for AC currents. Temperature rise is dependent upon several factors, including the PCB pad layout, trace thickness and width, air-flow and proximity to other heat generating components. It is recommended the part temperature not exceed 125 °C under worst case operating conditions and therefore, the temperature rise should be verified in the end use application. 3. Isat: Peak current for approximately 30% rolloff at +20 °C. 4. DCR limits @ 20°C. 5. Applied Volt-Time product (V-us) across the inductor at 100 kHz necessary to generate a core loss equal to 10% of the total losses for 40 °C temperature rise. 6. Part number definition: SD52-xxx-R SD52= Product code and size -xxx=Inductance value in µH, R= decimal point - If no R is present, then last character equals the number of zeros Dimensions (mm) 1 SCHEMATIC RECOMMENDED PCB LAYOUT Pin #1 indicator 5.2 max xxxx 52 5.6 m max Part marking 0.65 ±0.10 1 2.0 2 plcs 2 5.2 max m 1.3 2 plcs 2 6.0 2.0 max m Part Marking: 1st digit= the inductance value per part marking designator, 2nd digit = bi-weekly production date code, 3rd digit = last digit of the year produced, 4th digit= internal manufacturing code. 52 = the product size code. Do not route traces or vias underneath the inductor. Packaging information (mm) Parts packaged on 13” Diameter reel, 3,500 parts per reel. 4.00 2.00 ± 0.05 1.5 Dia min. 1.5 Dia. +0.1/-0.0 A 3.0 Ao=5.72mm Bo=5.72mm Ko=2.30mm Ko SECTION A-A B Bo 5.50 A Ao A 80 8.0 Direction of feed 2 www.eaton.com/elx 1.75 10.2 0 12.0 +/-0.3 0 SD52 High power density, low profile shielded power inductors Technical Data 4311 Effective November 2015  DC current vs.temperature SD52-1R2 90.0 80.0 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0.0 0.0 0.5 1.0 1.5 2.0 IDC (A) SD52-101 100.0 Temperature Rise (Deg. C) Temperature Rise (Deg. C) 100.0 2.5 3.0 3.5 90.0 80.0 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0.0 0.00 4.0 0.10 0.20 0.30 0.40 IDC (A) 0.50 0.60 0.70 Inductance characteristics OCL vs Isat SD52 100 90 80 OCL (%) 70 60 50 40 30 20 10 0 0 10 20 30 40 50 60 70 80 % of Isat 90 100 110 120 130 140 Core loss % of Losses from Irms (maximum) Irms DERATING WITH CORE LOSS % of applied V us www.eaton.com/elx 3 SD52 High power density, low profile shielded power inductors  Technical Data 4311 Effective November 2015 Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3