Technical Data 4342
Effective June 2017
Supersedes August 2009
FP1107
High frequency, high current power inductors
Applications
•
•
•
•
•
•
•
SMD Device
Environmental data
•
Product features
•
•
•
•
•
•
•
7.2 x 11.0 x 7.5mm surface mount package
Ferrite core material
High current carrying capacity, low core losses
Controlled DCR tolerance for sensing circuits
Inductance range from 70nH to 510nH
Current range from 18 amps to 140 amps
Frequency range up to 2MHz
Multi-phase regulators
Voltage Regulator Module (VRM)
Desktop and server VRMs and EVRDs
Data networking and storage systems
Graphics cards and battery power systems
Point-of-load modules
DCR sensing
•
•
Storage temperature range (component):
-40 °C to +125 °C
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
Solder reflow temperature:
J-STD-020 (latest revision) compliant
Pb HF
FREE
HALOGEN
Technical Data 4342
Effective June 2017
Product Specifications
Part Number7
R1 Version
FP1107R1-R07-R
FP1107R1-R12-R
FP1107R1-R15-R
FP1107R1-R23-R
FP1107R1-R30-R
FP1107R1-R40-R
FP1107R1-R51-R
R2 Version
FP1107R2-R07-R
FP1107R2-R12-R
FP1107R2-R15-R
FP1107R2-R23-R
FP1107R2-R30-R
FP1107R2-R40-R
FP1107R2-R51-R
OCL1 ± 10% (nH) FLL2 Min. (nH) Irms3 (Amps)Isat14 @ 25°C (Amps) Isat25 @ 125°C (Amps) DCR (mΩ) @ 20°C
70
120
150
230
300
400
510
50
86
108
166
217
288
364
70
120
150
230
300
400
510
50
86
108
166
217
288
364
55
140
90
70
45
35
25
18
123
72
56
36
28
20
14.5
42
140
90
70
45
35
25
18
123
72
56
36
28
20
14.5
K-factor6
0.29 ± 8%
361.1
361.1
361.1
361.1
361.1
361.1
361.1
0.47 ± 6.4%
363.3
363.3
363.3
363.3
363.3
363.3
363.3
4 Isat1: Peak current for approximately 20% rolloff at +25°C. 5 Isat2:
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
5 Peak current for approximately 20% rolloff at +125°C.
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat
generating components will affect the temperature rise. It is recommended the part temperature not exceed
125°C under worst case operating conditions verified in the end application.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss),
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP1107Rx-Rxx-R
• Rx is the DCR indicator
• FP1107 = Product code and size
• Rxx= Inductance value in μH, R = decimal point
• “-R” suffix = RoHS compliant
Dimensions- mm
T op V iew
B ottom V iew
S ide V iew
FP1107R 1-R = 7.50 max
FP1107R 2-R = 7.20 max
7.2 m ax
1
b
1.90
+/-0.15
R ecom m ended P ad Layout
S chem atic
2.1
1
3.1
1
1107R x
R xx
11.0
m ax
5.0
5.8 typ
2
w w llyy R
C
2
2
a
The nominal DCR is measured from point “a” to point”b.”
Part Marking:
1107Rx (Rx = DCR Indicator)
Rxx = Inductance value in μH. (R = Decimal point)
wwllyy = Date code
R = Revision level
Packaging information - mm
1.5 dia.
4.0
2.0
1.75
1
11.5
11.1
24
+/-0.3
1107Rx
Rxx
wwllyy R
2
7.6
1.5 dia.
12.0
Section A-A
User direction of feed
Supplied in tape-and-reel packaging, 640 parts per reel, 13” diameter reel.
2
www.eaton.com/electronics
Section B-B
7.4
FP1107
High frequency, high current power inductor
Technical Data 4342
Effective June 2017
Temperature rise vs total loss
T e m p e ra tu re R is e (°C )
80
60
40
20
F P 1107R 1
F P 1107R 2
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
T o ta l L o s s (W )
Core loss vs Bp-p
1MHz
10
500kHz
300kHz
200kHz
1
Co re L o ss (W )
100kHz
0 .1
0 .0 1
0 .0 0 1
100
1000
10000
B p - p (G a u ss)
Inductance characteristics
% o f O C L v s % o f I sa t1
100%
-40°C
% of OCL
80%
+ 25°C
60%
40%
+ 125°C
20%
0%
0%
20%
40%
60%
80%
100%
120%
140%
% o f I sa t1
www.eaton.com/electronics
3
FP1107
High frequency, high current power inductor
Technical Data 4342
Effective June 2017
Solder Reflow Profile
TP
TC -5°C
Temperature
TL
25°C
Preheat
A
T smax
Table 1 - Standard SnPb Solder (Tc)
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
t
Volume
mm3
220°C
220°C
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
Package
Thickness
2.5mm
ts
Time 25°C to Peak
Volume
mm3
2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020
Profile Feature
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
150°C
200°C
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 4342
June 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
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