CR0805J80R36G

低阻值厚膜贴片电阻承认书-CR 系列 Approval Specification for Thick Film Chip Resistors - Low Resistance CR 承认书 APPROVAL SHEET 厂商：丽智电子（昆山）有限公司 客户： : 丽智电子（南通）有限公司 Supplier: customer: 核准 Approved by 审核 Checked by 制作 Prepared by 地址：江苏省昆山市汉浦路 989 号 Address: No. 989, Hanpu Road Kunshan City Jiangsu Province Tel:0086-0512-57780531 Fax:0086-0512-57789581 地址: 江苏省南通市通州区康富路 789 号 Address: No. 789, Kang Fu Road Tongzhou District Nantong city Jiangsu province Tel: 0086-0513-68856666 Fax: 0086-0513-68383688 1 文件編號：613-00-002 版本:V26.0 低阻值厚膜贴片电阻承认书-CR 系列 Approval Specification for Thick Film Chip Resistors - Low Resistance CR 1. 范围（scope）： 1.1 适用于本公司所生产的无铅、无卤之低阻值厚膜贴片电阻 CR 系列 This specification applies to low resistance thick film chip resistors which meet requirements of Pb free and halogen free. 1.2 本公司的无铅产品指的贴片电阻端电极无铅，而存在于电阻层的玻璃中的符合 RoHS 豁免条款。 There no lead exists in terminal of resistor, and lead which exist in glass of resistor layer meets RoHS exemption. 2. 产品料号（part number）: 1206 1/4W 5% 100mΩ CR1206J40R10G CR 类型(Type) 1206 尺寸(Size) J 4 0R10 G 公差 额定功率 阻值 包装代码 Rated Power Resistance value Packing Code CR: 厚膜贴片 0402 Tolerance 电阻(thick film 0603 F=±1% 1= 1W ±5% : G= reel （卷装） chip resistors) 0805 J=±5% 2= 1/2W 10GΩ 缘阻抗。 Applied the dielectric withstanding voltage on the center of body for 60±5seconds. Then measure insulation resistance. 无击穿、飞弧及可见机 电阻本体上加载绝缘耐压 60±5 秒。 Applied the dielectric withstanding voltage on the 械性损伤 No evidence of center of body for60±5seconds. flashover, mechanical damage arcing or insulation breakdown 加载 2.5 倍的额定电压，时间 5 秒后测量试验 ±(2.0%+0.001Ω) Max 前后的阻值变化率。 Applied 2.5 times of rated voltage for 5 second. Measure the variation of resistance. R2-R1 *100------（%） R1 R1＝试验前阻值(resistance before test) R2＝试验后阻值(resistance after test) 沾助焊剂后浸入锡炉，锡炉温度 260±5℃，时 ±(1.0%+0.001Ω) Max 间 10±0.5 秒, 测量试验前后的阻值变化率。 Dip the terminal in a flux and then dip into a soldering bath at 260±5℃ for 10±0.5sec. Measure the variation of resistance. R2-R1 ΔR%= *100------（%） R1 R1＝试验前阻值(resistance before test) R2＝试 验后阻值(resistance after test) ΔR%= 抗焊锡热 Resist to soldering heat JIS C 5201 4.18 7 文件編號：613-00-002 版本:V26.0 低阻值厚膜贴片电阻承认书-CR 系列 Approval Specification for Thick Film Chip Resistors - Low Resistance CR 内容 Item 测试方法 Test Methods 端子弯曲 Terminal bending JIS C 5201 4.33 测试条件 Test Conditions 规格 Specification 电阻焊接在测试板上进行弯折,弯折保持时间 ±(2.0%+0.001Ω) Max 20±1 秒，1206(含) 以下的尺寸弯曲 5+0.2/0 mm; 1206 以上的尺寸弯曲 2+0.2/0 mm; 量测试验前后 阻值变化率 Specimen shall be mounted on test board, then bend the board and maintained for 20±1s. the distance of bending is 5+0.2/0 mm for resistors which size no larger than 1206 or 2+0.2/0 mm which size larger than 1206. Measure the variation of resistance. 测试板（test board） 压头（jig） R2-R1 *100------（%） R1 R1＝试验前阻值(resistance before test) R2＝试验后阻值(resistance after test) ΔR%= 温度循环 Temperature Cycling JIS C 5201 4.19 电阻放入温度循环机中，温度 155±2℃至-55± ±(2.0%+0.001Ω) Max 3℃，共 5 个循环。量测试验前后阻值变化率. Put specimen in a chamber which temperature can be changed to 155±2℃ or -55±3℃, repeated 5 times. Measure the variation of resistance. R2-R1 ΔR%= *100------（%） R1 R1＝试验前阻值(resistance before test) R2＝试验后阻值(resistance after test) 8 文件編號：613-00-002 版本:V26.0 低阻值厚膜贴片电阻承认书-CR 系列 Approval Specification for Thick Film Chip Resistors - Low Resistance CR 内容 Item 测试方法 Test Methods 测试条件 Test Conditions 耐湿特性 Humidity JIS C 5201 4.24 电阻放入恒温恒湿箱，温度 40±2℃，湿度 90~95 %RH;通电额定电压 1.5 小时，断电 0.5 小时；重复通断电至试验时间 1000 +48/-0 小时. 量测试验前后阻值变化率. Put the specimen in a chamber at 40±2℃ temperature and 90~95% relative humidity, then applied rated voltage for1.5H and rested for 0.5H repeatedly till total test time is 1000 +48/-0 .. Measure the variation of resistance. R2-R1 *100------（%） ΔR%= R1 R1＝试验前阻值(resistance before test) R2＝试验后阻值(resistance after test) 负荷寿命 Load life JIS C 5201 4.25.1 ±(3.0%+0.001Ω) Max 电阻放入恒温箱中，温度 70±2℃，ON TIME:1.5H，OFF TIME:0.5H，通电额定电压 1000 +24/-0 小时，量测试验前后阻值变化率. Put the specimen in a chamber at 70±2℃ temperature, ON TIME:1.5H，OFF TIME:0.5H， and applied rated voltage for 1000 +24/-0H. Measure the variation of resistance. R2-R1 ΔR%= *100------（%） R1 R1＝试验前阻值(resistance before test) R2＝试验后阻值(resistance after test) 温湿循环 Moisture resistance MIL-STD-202 METHOD 106 25 ° C~65 ° C,90~100%RH, 2.5 小 时 ; 65 ° C ±(2.0% +0.001Ω) Max 90~100%RH, 3小时; 65°C~25°C,80~100%RH,2.5 小时,10个循环,试验结束24±4小时后进行测 试. 25 ° C~65 ° C,90~100%RH, 2.5H; 65 ° C 90~100%RH, 3H; 65°C~25°C 80~100%RH, 2.5H, 10 cycles, Measurement at 24±4 hours after test conclusion. R2-R1 ΔR%= *100------（%） R1 R1＝试验前阻值(resistance before test) R2＝试验后阻值(resistance after test) 9 规格 Specification ±(2.0%+0.001Ω) Max 文件編號：613-00-002 版本:V26.0 低阻值厚膜贴片电阻承认书-CR 系列 Approval Specification for Thick Film Chip Resistors - Low Resistance CR 10. 包装规格（Tapping Specification） 10.1 卷盘尺寸（reel dimension） 尺寸 Dimensions CR0402 CR0603 CR0805 CR1206 CR1210 CR2010 CR2512 ※ A B C F W mm 178±2.0 60.0±1.0 13.5±0.5 11.4±0.1 9.00±0.3 Inch 7.008±0.079 2.362±0.039 0.531±0.020 0.449±0.039 0.354±0.012 mm 178±2.0 60.0±1.0 13.5±0.5 15.4±1.0 13.0±0.3 Inch 7.008±0.079 2.362±0.039 0.531±0.020 0.606±0.039 0.512±0.012 备注（Remark）: (1) 0402 每卷 10,000 pcs 0402 Quantity per Reel 10,000 pcs/Reel (2) 2010/2512 每卷 4,000 pcs 2010/2512 Quantity per Reel 4,000 pcs/Reel (3) 0603/0805/1206/1210 每卷 5,000pcs 0603/0805/1206/1210 Quantity per Reel 5,000 pcs/Reel 10 文件編號：613-00-002 版本:V26.0 低阻值厚膜贴片电阻承认书-CR 系列 Approval Specification for Thick Film Chip Resistors - Low Resistance CR 10.2 包装尺寸（packing dimension） Unit: mm Dimensions A B D F P0 P1 P2 W T CR0402 0.65±0.10 1.15±0.10 1.50± 00..10 3.50±0.05 4.00±0.10 2.00±0.10 2.00±0.05 8.00±0.20 0.42±0.07 CR0603 1.10±0.10 1.90±0.10 1.50± 00..10 3.50±0.05 4.00±0.10 4.00±0.10 2.00±0.05 8.00±0.20 0.60±0.07 CR0805 1.65±0.20 2.40±0.20 1.50± 00..10 3.50±0.05 4.00±0.10 4.00±0.10 2.00±0.05 8.00±0.20 0.75±0.07 CR1206 2.00±0.20 3.60±0.20 1.50± 00..10 3.50±0.05 4.00±0.10 4.00±0.10 2.00±0.05 8.00±0.20 0.75±0.07 CR1210 2.80±0.20 3.50±0.20 1.50± 00..10 3.50±0.05 4.00±0.10 4.00±0.10 2.00±0.05 8.00±0.20 0.75±0.07 CR2010 2.90±0.10 5.30±0.10 1.50± 00..10 5.50±0.05 4.00±0.10 4.00±0.10 2.00±0.05 12.0±0.10 1.0±0.07 CR2512 3.40±0.10 6.60±0.10 1.50± 00..10 5.50±0.05 4.00±0.10 4.00±0.10 2.00±0.05 12.0±0.10 1.0±0.07 11 文件編號：613-00-002 版本:V26.0 低阻值厚膜贴片电阻承认书-CR 系列 Approval Specification for Thick Film Chip Resistors - Low Resistance CR 11.上胶带剥离力测试（Peel force of top cover tape） 上胶带以 200mm/分钟的速度，沿 165〜180 度角的方向进行剥离，如下图所示。纸带的剥离 力范围为 10g〜70g; 载带的剥离力范围为 15〜80g. The top cover tape is pulled at a speed of 200 mm/min with the angle between the tape during peel and the direction of unreeling maintained at 165 to 180 degree as following picture. The peel force of paper carrier tape shall be 0.1N to 0.7N (10 to 70 g), the peel force of plastic carrier tape shall be 0.15N to 0.80N (15 to 80 g) 12.焊盘尺寸( Recommended land patterns): Dimensions（mm） b 1.4~1.6 2.0~2.2 3.2~3.8 4.4~5.0 4.4~5.0 5.7~6.5 7.6~8.6 Land pattern Type CR0402 CR0603 CR0805 CR1206 CR1210 CR2010 CR2512 a 0.5~0.6 0.7~0.9 1.0~1.4 2.0~2.4 2.0~2.4 3.3~3.7 3.6~4.0 12 c 0.4~0.6 0.8~1.0 0.9~1.4 1.2~1.8 2.3~3.5 2.3~3.5 2.3~3.5 文件編號：613-00-002 版本:V26.0 低阻值厚膜贴片电阻承认书-CR 系列 Approval Specification for Thick Film Chip Resistors - Low Resistance CR 13. 焊接 （soldering） 13.1 建议回流焊曲线（Recommend reflow soldering profile） 13.2 建议波峰焊曲线（Recommend wave soldering profile） 13.3 手工焊温度（hand soldering temperature） 烙鐵温度 350±10℃ 3 秒之內，避免烙铁接触电阻本体 The iron temperature is 350±10℃, hand soldering time less than 3S. Avoid solder iron tip direct touch the components body 13 文件編號：613-00-002 版本:V26.0