页码: 3-2
地址(Add):深圳市龙华区观澜街道观光路美泰科技园1栋
1nd Bldg,Meitai Industrial Zone,Guanguang Road,
Guanlan,Longhua,Shenzhen,China
封装(package):
型号(Model):
最大电压(Vmax):
SMD 1206
020
24V
电话(Tel): 86-0755-29503668 29503690 29503691
最大电流(Imax):
20A
传真 (Fax) : 86-0755-29503998
邮箱(Email):sales@whptc.com
邮编(P.C.):518131
网址(http://):www.whptc.com
产 品 规 格 书
Specification Sheet
产品标识/Marking :
A
T02:产品型号标识/Part identification
产品外形尺寸
/Appearance
and size of
production
T02
B
焊点可焊性/Solderability:
D
符合EIA规定RS186-9E 和ANSI/J-STD-002
第3类标准/Meets EIA specification RS1869Eand ANSI/J-STD-002 Category 3
E
C
焊点材料/Terminal Pad Materials:
推荐焊盘设计
/Recommended
无铅镀锡的镀镍铜箔/Sn-plated nickle-copper, lead-free device.
pad layout
产品尺寸/ Dimensions:
B
A
UNIT
MIN
MAX
MIN
D
E
MAX
MIN
MIN
C
MAX
MIN
F
G
H
mm
3
3.5
1.5
1.8
0.4
0.9
0.15
0.1
1
2
1.9
inch
0.12
0.14
0.06
0.07
0.016
0.04
0.01
0.004
0.04
0.08
0.07
电气特性/Performance Specification:
Maximum
Resistance
Time To Trip
Model
Current Time Rimin R1max
(A)
(Sec) (Ω)
(Ω)
SMD020
24
20
0.20
0.40
0.6
8.0
0.08
0.70
4.00
Vmax:产品在规定电流下工作不被破坏的最大电压;
/Maximum voltage , device can withstand without damage at rated current;
Imax:产品在规定电压下工作不被破坏的最大电流;
/ Maximum fault current, device can withstand without damage at rated voltage;
Ihold:产品在25°C静止空气中30分钟不动作的最大工作电流;
/ Hold Current.,device will sustain for 30min without tripping in 25°C still air;
Itrip: 产品在25°C静止空气中动作的最小电流;
/ Minimum current at which the device will trip in 25°C still air;
Vmax
(Vdc)
Imax
(A)
Ihold
Itrip
@25℃ @25℃
(A)
(A)
Pd
Tpy.
(W)
Pd: 产品在25°C静止空气中保护状态中消耗的功率;
/ Power dissipated from device when in the tripped state in 25°C still air;
Rimin:满足功能要求的最小成品电阻值;
/Minimum resistance of device in initial (un-soldered) state;
R1max:焊接完1小时,产品在25°C静止空气中的最大电阻值。
/ Maximum resistance of device at 25°C measured one hour post reflow.
页码: 3-3
o
25 C时动作时间曲线图
/Average Time Current Curve at 25oC
电流折减与环境温度曲线图
/Average Time Current Curve
SMD1206-020
Derating Curves for SMD series
160
100
Average Time Current Curves
Time in Second(s)
140
Percentage of Derated
Current (%)
120
100
80
60
10
1
0.1
40
0.01
20
0
-40
-20
0
20
40
o
Temperature ( C)
60
80
1E-3
0.1
1
10
Current in Amperes(A)
回流焊接条件/Solder reflow conditions
注意:如果回流焊温度超过图表建议最高温度
(260oC), 元件可能损坏而达不到规范要求.
1、建议回流方法:红外线、蒸汽炉、热空气炉;
/Recommended reflow methods: IR, vapor phase oven, hot
air oven.
2、使用于波焊制程时,不可将元件置于电路板之背
面/底面; /Devices are not designed to be wave soldered
to the bottom side of the board.
3、建议焊锡膏涂抹厚度最大为0.25mm/0.010
inch;/Recommended maximum paste thickness is 0.25
mm (0.010 inch).
4、元件可使用一般业界标准程序和溶剂来实施清洁
。/Devices can be cleaned using standard method and
solvents.
/Note: If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
储存与放置/Storage and Handling
储存条件:低于30 oC,相对湿度小于60%.如果超出储存条件,元件可能达不到规范要求./Storage
conditions: 30°C max, 60% R.H.Devices may not meet specified performance if storage conditions are exceeded.
订购须知/Order Information
T02=产品标识 /Part identification,SMD1206=封装尺寸/ Packaging,020=产品型号 /Model
包装数量3500个/盘3500pcs/Reel
注意事项/ WARING:
1、超出额定范围或不正确地使用PPTC元件都可能导致产品的损坏,并可能导致电弧和火焰;/Use PPTC
exceed by the maximum rating and improper use may result in device damage and possible electrical arcing
and flame.
2、PPTC元件一般只用于偶然的过流或超温故障时的保护,切勿用于故障频繁发生或预期会发生长时间故障的
场合;/PPTC are designed for protection against over current or temperature fault conditions and should not
be used when repeated fault conditions or prolonged trip events are anticipated.
3、如果不按照建议安装、测试和使用产品,元件性能可能会受到不利影响;/Device performance can be
impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal,
and mechanical procedures for electronic components.
4、在电感强度大的电路中使用时,可能会产生超过PPTC元件的额定电压的回路电压;/Use PPTC with a large
inductance in circuit will generate a circuit voltage above the rated voltage of the PPTC.
5、PPTC元件应用时不能长期处于压力下,使其缺乏膨胀空间而影响其性能,如处于高压或安装在受限的狭小
空间里. /Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited
space.
6、由于上述原因造成的质量问题,我司概不负责。/If any quality problems caused by improper use mentioned
above,our company is not responsible.
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