FEXL0770A-4R7M

深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD Introduction •Soft saturation. •High current，low DCR，high efficiency. •Very low acoustic noise and very low leakage flux noise. •High reliability. •100% Lead(Pb)-Free and RoHS compliant. •Operating temperature -55~+125℃(Including self - temperature rise) Applications • Note PC power system，incl. IMVP-6 • DC/DC converter Dimensions (Unit: mm) A C D E B F Code Dimensions(mm) A 7.8±0.25 B 7.6±0.25 C 6.7±0.3 D See Spec table E 1.75±0.3 F 3.15±0.3 H L G Recommend Land Pattern L 7.8ref H 6.7ref G 2.8ref Unit : mm 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD Marking Note：Using Ink for marking Marking： Example Nominal Value 0.18μH R18 1.2 μH 1R2 4.5 μH 4R5 Structure and Components NO Components Material 1 CORE Alloy Powder 2 WIRE Polyester Wire or equivalent. 3 Clip 100% Pb free solder 4 Ink Halogen-free ketone 5 paint Epoxy resin 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD Specification L0 DCR (mΩ) (μH)±20 % MAX FEXL0770A-3R3M 3.30 FEXL0770A-4R7M FEXL0770A-6R8M Part No. Isat （A） Irms (A)Typ D (mm) ±0.3 Max Typ 20℃ rise 40℃ rise 9.42 15.1 19.4 11.5 15.1 6.70 4.70 13.5 14.0 15.5 10.5 13.6 6.70 6.80 19.60 11.0 12.8 7.0 9.5 6.50 Notes： 1. Test frequency : L : 100KHz /0.1V; 2. All test in 25 °C temperature. 3.Testing Instrument:L:HP4285A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502, MICRO OHMMETER. 4.Heating Rating Current (Irms) will cause the coil temperature rise of 40℃ approximately (Δt)； 5.Saturation Current (Isat ) will cause L0 to drop 30% approximately. 6.The part temperature (ambient + temp rise) should not exceed 125℃ under the worst case operating condition. Circuit design, component, PCB trace size and thickness airflow and other cooling provisions all could affect the part temperature. Part temperature should be verified in the end application. 7.Special inquiries besides the above common used types can be met on your requirement. DCR Test 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD Mechanical Reliability Item Specification and Requirement 1. No case deformation or change in visual Solderability 2. New solder coverage Test Method 1.Preheat：155℃±5℃ ，60S±2S 2.Tin: lead-free. 3.Temperature:240℃±5℃，flux 3.0S±0.5S. More than 95% Mechanical 1. No case deformation 1. Acceleration： 100G or change in visual 2. Pulse time:：6ms shock 3. 3 times in each positive and negative direction of 3 2. △L/Lo≦±10% 1. No case deformation Mechanical or change in visual vibration 2. △L/Lo≦±10% mutual perpendicular directions 1. Reflow: 2times 2. Frequency: 10HZ～50HZ～10HZ，20 Min/Cycles 3. Amplitude: 1.52 mm±10% 4. Directions: X,Y,Z 5. Time: 12 cycle / direction Endurance Reliability Item Specification and Requirement Inductance change: Thermal Shock Within ± 10% Without distinct damage in visual Test Method 1. First -55℃ for 30 minutes，last 125℃ for 30 minutes as 1 cycle. Go through 1000 cycles. 2. Max transfer time is 3 minutes. 3. Measured at room temperature after placing for 24±2 hours Humidity Resistance Inductance change: 1.Reflow 2 times, Within ± 10% Without distinct damage 2.85℃±3℃,85%±3%RH,1000 hours in visual 3.Measured at room temperature after placing for 24±2 hours Low temperature storage High temperature storage Inductance change: 1. Temperature：-55 ± 2℃ Within ± 10% Without distinct damage 2. Time：1000 hours in visual 3. Measured at room temperature after placing for 24±2 hours Inductance change: Within ± 10% Without distinct damage in visual 1. Temperature：+125 ± 2℃ 2. Time：1000 hours 3. Measured at room temperature after placing for 24±2 hours 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD Recommended Soldering Technologies (1)Re-flowing Profile Preheat condition: 150 ~200℃/60~120sec. Allowed time above 217℃: 60~90sec. Peak temp: 260℃ Max time at Peak temp: 10 sec. Solder paste: Sn/3.0Ag/0.5Cu Allowed Reflow time: 2x max (2)Iron Soldering Profile Iron soldering power: Max. 30W Pre-heating: 150℃/60sec. 3sec. Max. 350℃ Soldering Tip temperature: 350℃ Max. Power: max. 30W Soldering time: 3sec. Max. Diameter of Soldering Solder paste: Sn/3.0Ag/0.5Cu Max.1 times for iron soldering Soldering Iron Iron 1.0mm max. Tc ℃ 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD Packaging Information (1) Tape Packaging Dimensions（Unit：mm） Tape dimensions (mm) W P P0 P2 D0 D1 T A0 B0 K0 E F 16 ±0.3 12 ±0.1 4 ±0.1 2 ±0.1 1.5 ±0.1 1.5 ±0.1 0.35 ±0.05 8.2 ±0.1 8.0 ±0.1 7.3 ±0.1 1.75 ±0.1 7.5 ±0.1 Taping Drawings (UNIT:mm) 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD (2) Reel Dimensions（Unit：mm） B N C W A W N B C 330+2.0 16.8+0.2 97+0.5 2.2+0.5 13.2±0.2 (3) Packaging Quantity Standard Quantity Reel Inner box 700pcs / reel 3Reel / box (2100 pcs) (4) Peel force of top cover tape The peel speed shall be about 300mm/minute The peel force of top cover tape shall be between 0.1 to 1.3 N Carton box 4 Middle boxes, (8400 pcs) A 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD (5) Reel Label Label on the reel • Customer's part Number • Lot Number • Quantity • date code Shipping Label • Customer's part Number • Manufacturer's part Number • Quantity • date code (6) Inner Box (7) Carton A B C 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD Appearance criterion 1、PAD residual powder、inner wire exposed、imprinting The residual powder on both side of pad is norm and within following criteria are acceptable. 2、Defects Chip off is generated during molding and manufacturing process. Chip off acceptance limits subjected to the product size. Our current Defect limit is based on the IPC-A-610. Some chip off does not impact the product function, see the IPC standard 1 & 2. w T L Marking T ≤10% of the thickness Each surface can only accept W ≤10 % of the width one minor chip off，and more than 3 L ≤10 % of the length chip off problems are not allowed on the same product. Defects usually occur at the corners and edges of the product,There will be a slight defect black and rough, but not exposed copper, and does not affect the product performance and reliability. 3、Crack Production process of cracks appearing in the body is inevitable, some slight crack is caused because the molding, is not oxidized, crack on the product will not affect product performance. We have done a reliability test of crack products, even if cracks is more than 0.13mm also will not affect the electrical properties of the product, crack limits as follows： Products from a slight crack in the baking process due to thermal expansion, and it is not obvious by visual inspection (Must not exceed the blue square area). Cracks on the same side surface are not allowed to exceed 1/2 of the length of the side and the crack width cannot exceed 0.13mm, and only 1 crack is allowed on the same side. Bottom cracks are not allowed to exceed 1/2 of the length (or width) of the corresponding body nor the Non-manufacturability swelling, and the crack width cannot be exceed 0.13mm, and less than 2 cracks are allowed and judged as good products. Visible cracks and non-manufacturability bulging are not allowed on the front side. 4、oxidation(rust) the contains iron composite, although the resin has a protective effect of oxidation,but there will be small amount of product that may occur oxidation, The oxidation area of each surface is allowed to be about 25% (in the case of non-reliability test)，it is recommend that customer use this product in humidity controlled environment.The basic steps should be to protect the surface oxidation, including the sealed packages to PCB mount inductors. To avoid the adverse effects caused by oxidation, Oxidation occurs at the surface only allows the internal oxidation is not allowed, oxidized surface will not affect the reliability of the product. Marking 4sides slightly oxidized side: Acceptable Marking Top and bottom slightly oxidized side: Spray printing effect : can be accepted if recognizable Acceptable Visual inspection: Examination with the naked eye, to distinguish from more technical modes of analysis employing tools or apparatus.