MSM050/30

SPSEMI PPTC/MSM(1812) Series     Polyer Positive Temperature Coefficient MSM(1812) Series Features Surface Mount Devices Lead free device Size 4532mm/1812mils Surface Mount packaging for automated assembly Agency Approval:UL、ROHS Applications Almost anywhere there is a low voltage power supply, up to DC33V and a load to be protected, including: Computer mother board 、Modem、USB hub PDAs & Charger、Analog & digital line card Digital cameras、Disk drivers、CD-ROMs Dimensions(1812) Recommended Mounting Pad Layout C 1.78±0.1 1.78±0.1 3.2±0.1 A ZZZ B 3.2±0.1 E D Dimensions in millimerters Part Number C B A D E Min. Max. Min. Max. Min. Max. Min. Min. MSM010/60 4.37 4.73 3.07 3.41 0.5 1.0 0.3 0.25 MSM014 4.37 4.73 3.07 3.41 0.5 1.1 0.3 0.25 MSM020/60 4.37 4.73 3.07 3.41 0.5 1.0 0.3 0.25 MSM030 4.37 4.73 3.07 3.41 0.5 1.0 0.3 0.25 MSM050 4.37 4.73 3.07 3.41 0.4 0.9 0.3 0.25 MSM050/24/30 4.37 4.73 3.07 3.41 0.4 1.1 0.3 0.25 MSM075/16/24 4.37 4.73 3.07 3.41 0.4 0.9 0.3 0.25 MSM075/33 4.37 4.73 3.07 3.41 0.5 1.2 0.3 0.25 MSM110/16 4.37 4.73 3.07 3.41 0.4 0.9 0.3 0.25 MSM110/24 4.37 4.73 3.07 3.41 0.4 1.3 0.3 0.25 MSM110/33 4.37 4.73 3.07 3.41 0.6 1.5 0.3 0.25 MSM125 4.37 4.73 3.07 3.41 0.3 1.3 0.3 0.25 MSM150/16 4.37 4.73 3.07 3.41 0.3 1.2 0.3 0.25 MSM150/24 4.37 4.73 3.07 3.41 0.6 1.5 0.3 0.25 MSM160 4.37 4.73 3.07 3.41 0.3 0.8 0.3 0.25 MSM200 4.37 4.73 3.07 3.41 0.3 1.3 0.3 0.25 MSM200/12 4.37 4.73 3.07 3.41 0.6 1.4 0.3 0.25 MSM200/16 4.37 4.73 3.07 3.41 0.6 1.4 0.3 0.25 MSM260 4.37 4.73 3.07 3.41 0.6 1.6 0.3 0.25 MSM260/16 4.37 4.73 3.07 3.41 0.6 1.8 0.3 0.25 MSM300/6 4.37 4.73 3.07 3.41 0.5 1.5 0.3 0.25 REV . 2017 . 05 . 12 www.spsemi.cn Page 1 of 4 SPSEMI PPTC/MSM(1812) Series     Electrical Characteristics (25 ℃ ) Maximum Time To Trip Resistance R1max. Rmin (Ω) (Ω) I hold I trip V max. I max. P d typ. (A) (A) (Vdc) (A) (W) Current (A) Time (Sec.) MSM010 0.10 0.30 30 100 0.8 0.5 1.50 0.75 15.00 MSM010/60 0.10 0.30 60 40 0.8 0.5 1.50 0.75 15.00 MSM014 0.14 0.34 60 100 0.8 1.5 0.15 0.65 6.00 MSM020 0.20 0.40 30 100 0.8 8 0.02 0.35 5.00 MSM020/60 0.20 0.40 60 100 0.8 8 0.02 0.35 5.00 MSM030 0.30 0.60 30 100 0.8 8 0.10 0.25 3.00 MSM050 0.50 1.00 15 100 0.8 8 0.15 0.15 1.00 MSM050/24 0.50 1.00 24 100 0.8 8 0.15 0.15 1.00 MSM050/30 0.50 1.00 30 100 0.8 8 0.15 0.15 1.00 MSM075 0.75 1.50 13.2 100 0.8 8 0.20 0.09 0.45 MSM075/16 0.75 1.50 16 100 0.8 8 0.20 0.09 0.45 MSM075/24 0.75 1.50 24 100 0.8 8 0.20 0.09 0.45 MSM075/33 0.75 1.50 33 100 0.8 8 0.20 0.09 0.45 MSM110 1.10 2.20 8 100 0.8 8 0.30 0.05 0.25 MSM110/16 1.10 2.20 16 100 0.8 8 0.30 0.05 0.25 MSM110/24 1.10 2.20 24 100 0.8 8 0.30 0.05 0.25 MSM110/33 1.10 2.20 33 100 0.8 8 0.30 0.05 0.28 MSM125 1.25 2.50 16 100 0.8 8 0.40 0.05 0.16 MSM150/16 1.50 3.00 16 100 0.8 8 0.50 0.04 0.16 MSM150/24 1.50 3.00 24 100 0.8 8 0.50 0.04 0.16 MSM160 1.60 2.80 8 100 0.8 8 1.00 0.03 0.13 MSM200 2.00 4.00 8 100 0.8 8 2.00 0.02 0.10 MSM200/12 2.00 4.00 12 100 0.8 8 2.00 0.02 0.10 MSM200/16 2.00 4.00 16 100 0.8 8 2.00 0.02 0.10 MSM260 2.60 5.00 8 100 0.8 8 2.50 0.015 0.05 MSM260/16 2.60 5.00 16 100 0.8 8 2.50 0.015 0.06 MSM300/6 3.00 5.00 6 100 0.8 8 4.00 0.012 0.04 Part Number Notes : I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air. V max = Maximum operating voltage device can withstand without damage at rated current (Imax). I max = Maximum fault current device can withstand without damage at rated voltage (Vmax). P d = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. R min = Minimum device resistance prior to tripping at 25°C. R 1 max = Maximum device resistance is measured one hour post reflow. CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame. REV . 2017 . 05 . 12 www.spsemi.cn Page 2 of 4 SPSEMI PPTC/MSM(1812) Series     Thermal Derating Chart-I hold (A) Maximum ambient operating temperature (Tmao)vs.hold current (Ihold) Part Number -40 °C -20 °C 0 °C 25 °C 40 °C 50 °C 60 °C 70 °C 85 °C MSM010 0.16 0.14 0.12 0.1 0.08 0.07 0.06 0.05 0.03 MSM010/60 0.16 0.14 0.12 0.1 0.08 0.07 0.06 0.05 0.03 MSM014 0.23 0.19 0.17 0.14 0.12 0.1 0.09 0.08 0.06 MSM020 0.29 0.26 0.23 0.2 0.17 0.15 0.14 0.12 0.1 MSM020/60 0.29 0.26 0.23 0.2 0.17 0.15 0.14 0.12 0.1 MSM030 0.44 0.39 0.35 0.3 0.26 0.23 0.21 0.18 0.15 MSM050 0.59 0.57 0.55 0.5 0.45 0.43 0.35 0.3 0.23 MSM050/24 0.59 0.57 0.55 0.5 0.45 0.43 0.35 0.3 0.23 MSM050/30 0.59 0.57 0.55 0.5 0.45 0.43 0.35 0.3 0.23 MSM075 1.1 0.99 0.87 0.75 0.63 0.57 0.49 0.45 0.35 MSM075/16 1.1 0.99 0.87 0.75 0.63 0.57 0.49 0.45 0.35 MSM075/24 1.1 0.99 0.87 0.75 0.63 0.57 0.49 0.45 0.35 MSM075/33 1.1 0.99 0.87 0.75 0.63 0.57 0.49 0.45 0.35 MSM110 1.6 1.45 1.28 1.1 0.92 0.83 0.71 0.66 0.52 MSM110/16 1.6 1.45 1.28 1.1 0.92 0.83 0.71 0.66 0.52 MSM110/24 1.6 1.45 1.28 1.1 0.92 0.83 0.71 0.66 0.52 MSM110/33 1.6 1.45 1.28 1.1 0.92 0.83 0.71 0.66 0.52 MSM125 2 1.75 1.52 1.25 1 0.95 0.9 0.75 0.53 MSM150/16 2.3 2.05 1.77 1.5 1.23 1.09 0.95 0.82 0.61 MSM150/24 2.3 2.05 1.77 1.5 1.23 1.09 0.95 0.82 0.61 MSM160 2.45 2.15 1.89 1.6 1.34 1.25 1.15 0.96 0.79 MSM200 2.89 2.61 2.35 2 1.75 1.55 1.45 1.3 1.1 MSM200/12 2.89 2.61 2.35 2 1.75 1.55 1.45 1.3 1.1 MSM200/16 2.89 2.61 2.35 2 1.75 1.55 1.45 1.3 1.1 MSM260 3.8 3.61 3.12 2.6 2.28 2.1 1.85 1.61 1.29 MSM260/16 3.8 3.61 3.12 2.6 2.28 2.1 1.85 1.61 1.29 MSM300/6 4.43 3.99 3.49 3 2.65 2.34 2.12 1.85 1.45 Characteristic Curve Typical Time To Trip At 25 °C Thermal Derating Curve 100 ABC D K EFGH I J A : 0.10A B : 0.14A C : 0.20A D : 0 . 30A E : 0 . 50A F : 0.75A G : 1 . 10A H:1.25A I:1.50A J:2.00A K:2.60A 140 10 120 Time In Seconds Percent of Derated Current-% 160 100 80 60 40 1 0.1 0.01 20 0 -40 -20 0 20 40 60 80 0.001 0.1 Temerature-℃ REV . 2017 . 05 . 12 1 10 100 Current In Amperes www.spsemi.cn Page 3 of 4 SPSEMI PPTC/MSM(1812) Series     Environmental Specifications Test Resistance Change Conditions Passive aging +85°C, 1000 hrs. ±5% typical Humidity aging +85°C, 85% R.H. , 168 hours ±5% typical Thermal shock +85°C to -40°C, 20 times ±33% typical Resistance to solvent MIL-STD-202,Method 215 No change Vibration MIL-STD-202,Method 201 No change Ambient operating conditions : - 40 °C to +85 °C Maximum surface temperature of the device in the tripped state is 125 °C Termination Pad Characteristics Terminal pad materials Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper Terminal pad solderability Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Recommended Soldering Conditions Recommended Conditions Reflow Soldering Pb-Free assembly Profile Feature tP TP +150℃ -Temperature Max(T s(max) ) +200℃ -Time(Min to Max)(t s ) 60-180seconds Average ramp up rate (T s(max) to T p ) Time maintained above: Critical Zone T L to T P Ramp-up TL 3℃/second Max. -Temperature(T L ) +217℃ -Time(t L ) 60-150seconds Peak Temp(T P ) +260(+0/-5)℃ Time within 5℃ of actual Peak Temp(t p ) Ramp-down Rate 20-40seconds Time 25℃ to Peak Temp(T P ) 8 minutes Max. tL Temperature Pre Heat -Temperature Min(T s(min) ) T s (max) Ramp-down Preheat T s (min) ts 25 6℃/second Max. time to peak temperature (t 25℃ to peak) Time Recommended reflow methods: I R , vapor phase oven, hot air oven, N 2 environment for lead-free. Devices are not designed to be wave soldered to the bottom side of the board. Recommended maximum paste thickness is 0.25mm (0.010inch). Devices can be cleaned using standard industry methods and solvents. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Packageing Information Part Number Packaging Option Quantity MSM010 - 030,MSM075/33, MSM110/24-150/24,MSM200-300/6 Reel 1500pcs/reel MSM050 ～ 075/24,MSM110~110/16,MSM160 Reel 2000pcs/reel REV . 2017 . 05 . 12 www.spsemi.cn Page 4 of 4