X161232MKB4SI

CRYSTAL UNIT YSX1612SL Small Size Applications Features ‧SmartWearable TWS IOT Communication. ‧Dimensions:1.60 x 1.20 x 0.35 mm. ‧High precision and high frequency stability. ‧Standard Frequency:24~60MHz ‧Excellent heat resistance and environmental characteristics. Specifications Standard Frequency 24~60 MHz Vibration Mode AT Fundamental Load Capacitance 8pF,9pF,12pF,or specify Frequency Tolerance (at 25 ) ±10ppm,±20ppm,or specify Frequency Versus Temperature Characteristics ±20ppm,or specify -20~+70℃， -40~+85℃，or specify Operating Temperature -40~+85℃， or specify Storage Temperature Shunt Capacitance 3 pF Max. Level of Drive 100 μWMax. Aging (at 25 ℃ ) ±2ppm/year Max. Equivalent Series Resistance(ESR) Fundamental 32 ~ 40 MHz 41 ~ 60 MHz 150 Ω Max. 100 Ω Max. Dimensions and Patterns [unit:mm] Package Size – Dimensions (Unit: mm) 1.60±0.10 Marking To p V i e w 2 0 . 7 5 0.30 0. 75 0.60 0.30 0.20 2 Bo t t o m Vi e w 2 0.60 0.50 4 1 To p Vi e w C r y st a l C o n n e c t i o n S i de Vi ew 1 3 GND 0.3 5 ± 0 . 05 1 4 GND 1. 2 ± 0. 10 3 4 3 To p Vi e w S u g g e s t e d L a y o u t www.yxc.hk 第1页共2页 CRYSTAL UNIT YSX1612SL Small Size Reflow Soldering Profile Temperature Pre Heating Temperature Tp1 ~ Tp2 = + 170 °C Heating Temperature TMlt = + 220 °C Peek Temperature TMax. = + 260 °C +260℃ TMax. +220℃ Tmlt Point of measuring In case of Solder ability Terminal. In case of Resistance to soldering heat Surface. Tp2 Tp1 35s 100s t(time) Taping Specification(Unit: mm) Size A B C D E F G H SMD-1612 180±2.0 8.0±0.3 1.85±0.1 1.90±0.1 4.0±0.1 0.45±0.1 61.0±1.0 8.0±1.0 3000 pcs per reel www.yxc.hk 第2页共2页