HCB1608KF-600T30

TAI-TECH TBM01-130900389 High Current Ferrite Chip Bead(Lead Free) HCB1608KF-600T30 ECN HISTORY LIST REV 1.0 DATE DESCRIPTION APPROVED CHECKED DRAWN 楊祥忠 羅培君 張嘉玲 13/06/06 變更可靠度條件 備 註 www.tai-tech.com.tw P1. TAI-TECH TBM01-130900389 High Current Ferrite Chip Bead(Lead Free) P2. HCB1608KF-600T30 1.Features 1. Monolithic inorganic material construction. 2. Closed magnetic circuit avoids crosstalk. 3. Suitable for reflow soldering. 4. Shapes and dimensions follow E.I.A. spec. 5. Available in various sizes. Halogen Pb Halogen-free Pb-free 6. Excellent solder ability and heat resistance. 7. High reliability. 8. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 9. Low DC resistance structure of electrode to prevent wasteful electric power consumption. 2.Dimensions Chip Size A 1.60±0.15 B 0.80±0.15 C 0.80±0.15 D 0.30±0.20 Units: mm 3.Part Numbering HCB 1608 KF A B C A: Series B: Dimension C: Material D: Impedance E: Packaging F: Rated Current - 600 T 30 D E F LxW Lead Free Material 600=60Ω T=Taping and Reel, B=Bulk(Bags) 30=3000mA 4.Specification Tai-Tech Part Number Impedance (Ω) Test Frequency (Hz) DC Resistance (Ω) max. Rated Current (mA) max. HCB1608KF-600T30 60±25% 60mV/100M 0.04 3000 „ HCB1608KF-600T30 160 IMPEDANCE(Ohm) Impedance-Frequency Characteristics 120 Z 80 40 X R 0 1 10 100 FREQUENCY(MHz) www.tai-tech.com.tw 1000 TAI-TECH TBM01-130900389 P3. 5. Reliability and Test Condition Item Series No. Operating Temperature Performance FCB FCM HCI -- -40~+125℃ (Including self-temperature rise) -40~+105℃ (Including self-temperature rise) -- -40~+125℃ -40~+105℃ Transportation Storage Temperature HCB GHB FCA FCI Test Condition FHI FCH For long storage conditions, please see the Application Notice Agilent4291 Impedance (Z) Agilent E4991 Inductance (Ls) Agilent4287 Q Factor Refer to standard electrical characteristics list Agilent16192 DC Resistance Agilent 4338 Rated Current DC Power Supply Over Rated Current requirements, there will be some risk 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Rated Current < 1A ∆T 20℃Max Temperature Rise Test Resistance to Soldering Heat Rated Current ≧ 1A ∆T 40℃Max Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preheat: 150℃,60sec. Solder: Sn99.5%-Cu0.5% Solder tamperature: 260±5℃ Flux for lead free: Rosin. 9.5% Temperature ramp/immersion and immersion rate: 25±6 mm/s Dip time: 10±1sec. Depth: completely cover the termination. Preheating Dipping Natural cooling 260° C 150° C 60 second Preheating Dipping Natural cooling More than 95% of the terminal Solderability 245° C electrode should be covered with solder. 150° C 60 second 4±1 second 10±1.0 second Preheat: 150℃,60sec. Solder: Sn99.5%-Cu0.5% Solder tamperature: 245±5℃ Flux for lead free: Rosin. 9.5% Depth: completely cover the termination. Dip time: 4±1sec. Terminal strength Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Component mounted on a PCB apply a force (>0805:1kg =0805:40x100x1.2mm =0805:1.2mm 1GΩ Derating **Derating Curve Derated Current(A) 6 For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85℃, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. 5 4 3 2 1 6A 5A 4A 3A 2A 1.5A 1A 0 85 125 Environment Temperature+△Temperature(°C) 6.Soldering and Mounting 6-1. Recommended PC Board Pattern Land Patterns For Reflow Soldering Chip Size 0.6±0.03 0.30±0.03 0.30±0.03 0.15±0.05 0.80 0.30 0.30 1005 1.0±0.10 0.50±0.10 0.50±0.10 0.25±0.10 1.50 0.40 0.55 1608 1.6±0.15 0.80±0.15 0.80±0.15 0.30±0.20 2.60 0.60 0.80 2.0±0.20 1.25±0.20 0.85±0.20 0.50±0.30 GHB FCI 2.0±0.20 1.25±0.20 1.25±0.20 0.50±0.30 3.00 1.00 1.00 FHI 3216 3.2±0.20 1.60±0.20 1.10±0.20 0.50±0.30 4.40 2.20 1.40 3225 3.2±0.20 2.50±0.20 1.30±0.20 0.50±0.30 4.40 2.20 FCH 3.40 4516 4.5±0.20 1.60±0.20 1.60±0.20 0.50±0.30 5.70 2.70 HCI 1.40 4532 4.5±0.20 3.20±0.20 1.50±0.20 0.50±0.30 5.90 2.57 4.22 2012 Land Solder Resist 2.8 0.8 0603 HCB FCA3216 A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm) 2.2-2.6 FCB FCM Type 0.8 Pitch 0.4 L PC board should be designed so that products can prevent damage from mechanical stress when warping the board. H Series G www.tai-tech.com.tw TAI-TECH TBM01-130900389 P5. 6-2. Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk 6-2.1 Lead Free Solder re-flow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C) 6-2.2 Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. •Preheat circuit and products to 150℃ •350℃ tip temperature (max) •Never contact the ceramic with the iron tip •1.0mm tip diameter (max) Iron Soldering Reflow Soldering PRE-HEATING SOLDERING within 4~5s 217 TEMPERATURE(° C) TP(260° C / 40s max.) 60~150s 200 150 NATURAL COOLING SOLDERING PRE-HEATING NATURAL COOLING 20~40s TEMPERATURE(° C) •Use a 20 watt soldering iron with tip diameter of 1.0mm •Limit soldering time to 4~5sec. 60~180s 350 150 Gradual cooling Over 60s 480s max. 25 TIME(sec.) TIME( sec.) Reflow times: 3 times max Fig.1 Iron Soldering times：1 times max Fig.2 6-2.3 Solder Volume: Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side: Minimum fillet height = soldering thickness + 25% product height Upper limit Recommendable t 7.Packaging Information 7-1. Reel Dimension A ±0 . .5 13 C B 7"x8mm 0 R1 .5 B(mm) C(mm) D(mm) 7”x8mm 9.0±0.5 60±2 13.5±0.5 178±2 7”x12mm 13.5±0.5 60±2 13.5±0.5 178±2 R0.5 120° 7"x12mm 7-2.1 Tape Dimension / 8mm ■Material of taping is paper .0 -0 .1 +0 .5 1 D: F:3.5±0.05 B0 t Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) 0.50max 2.0±0.05 0.50max Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) 100505 1.12±0.03 0.62±0.03 0.60±0.03 2.0±0.10 0.60±0.03 160808 1.85±0.05 1.05±0.05 0.95±0.05 4.0±0.10 0.95±0.05 201209 2.30±0.05 1.50±0.05 0.95±0.05 4.0±0.10 0.95±0.05 060303 P P0:4±0.1 05 0. 10. + 56 1. D: t B0 P 0.68±0.05 0.38±0.05 Ko A0 A0 W:8.0±0.1 P2:2±0.1 F:3.5±0.1 W:8.0±0.3 E:1.75±0.1 P0:4±0.1 E:1.75±0.1 D R1 .9 A(mm) 5 Type 2±0.5 Ko www.tai-tech.com.tw TAI-TECH TBM01-130900389 P6. ■Material of taping is plastic Po:4±0.1 1 0. 5+ 1. : D t A P ± :1 D1 F:3.5±0.05 A Bo W:8.0±0.1 E:1.75±0.1 P2:2±0.05 Ko 1 0. Ao SECTION A-A Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 160808 1.95±0.10 1.05±0.10 1.05±0.10 4.0±0.10 0.23±0.05 none 201209 2.25±0.10 1.42±0.10 1.04±0.10 4.0±0.10 0.22±0.05 1.0±0.10 201212 2.35±0.10 1.50±0.10 1.45±0.10 4.0±0.10 0.22±0.05 1.0±0.10 321611 3.50±0.10 1.88±0.10 1.27±0.10 4.0±0.10 0.22±0.05 1.0±0.10 322513 3.42±0.10 2.77±0.10 1.55±0.10 4.0±0.10 0.22±0.05 1.0±0.10 321609 3.40±0.10 1.77±0.10 1.04±0.10 4.0±0.10 0.22±0.05 1.0±0.10 Size Bo(mm) Ao(mm) Ko(mm) P(mm) 7-2.2 Tape Dimension / 12mm 1.75±0.1 Po:4±0.1 P2:2.0±0.05 t D1:1.5±0.1 Bo W:12.0±0.1 5.5±0.05 D:1.5+0.1 t(mm) D1(mm) 451616 4.95±0.1 1.93±0.1 1.93±0.1 4.0±0.1 0.24±0.05 1.5±0.1 453215 4.95±0.1 3.66±0.1 1.85±0.1 8.0±0.1 0.24±0.05 1.5±0.1 Ko P Ao 7-3. Packaging Quantity Chip Size 453215 451616 322513 321611 321609 201212 201209 160808 100505 060303 Chip / Reel 1000 2000 2500 3000 3000 2000 4000 4000 10000 15000 Inner box 4000 8000 12500 15000 15000 10000 20000 20000 50000 75000 Middle box 20000 40000 62500 75000 75000 50000 100000 100000 250000 375000 Carton 40000 80000 125000 150000 150000 100000 200000 200000 500000 750000 7-4. Tearing Off Force F Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice •Storage Conditions To maintain the solder ability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months from the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. •Transportation 1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw