FXC1350-100M

深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD FXC1350 Series Introduction • 100% Lead(Pb)-Free and RoHS compliant. • High current，low DCR，high efficiency. • 14.0× 12.9× 5.0mm maximum surface mount package . • Operating temperature -40℃~+125℃(Including self - temperature rise) . Applications • Note PC power system . • DC/DC converter . Product Identification FXC ① 1350 ② --1R5 M ③ ④ ① FXC ---------- Series name ② 1350 ---------- Dimension ③ 1R5 ----------- Inductance Value (1R5 = 1.5μH) ④ M -----------Inductance Tolerance ( M= ± 20% ) Dimensions (unit:mm) A C b E B c a D Recommend Land Pattern A B C D E a typ b typ c typ 13.5±0.5 12.6±0.3 4.7±0.3 2.0±0.5 See remark 8 14.2 5.0 Remarks E Dimensions 3.85±0.5 R33/R47/R56/R68/R821R0/1R5 4.7±0.5 2R2/3R3/4R7/6R8/8R2/100/150/220/330 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD Marking The inductor is marked with a 3-digit code Nominal Inductance Example Nominal Value 1R0 1.0 μH 100 10 μH 101 100 μH Note：Using Ink for marking 1R0 Structure and Components Symbol Components Material a MARKING Ink(black) b CORE Carbonyl Powder c WIRE Polyester Wire or equivalent. d Terminal Copper plated with Sn 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD Saturation Heating Rating Current Current DCR (mΩ) Isat (A) Irms (A) ±20 %, 100 kHz, 1V MAX. TYP. TYP. FXC1350-R33M 0.33 0.9 80 42 FXC1350-R47M 0.47 1.1 65 38 FXC1350-R56M 0.56 1.5 55 36 FXC1350-R68M 0.68 1.7 54 34 FXC1350-R82M 0.82 2.1 52 31 FXC1350-1R0M 1.0 2.5 50 29 FXC1350-1R5M 1.5 3.3 48 27 FXC1350-2R2M 2.2 5.5 32 20 FXC1350-3R3M 3.3 9.2 32 15 FXC1350-4R7M 4.7 15 27 12 FXC1350-5R6M 5.6 16.5 22 11.5 FXC1350-6R8M 6.8 18.5 21 11 FXC1350-8R2M 8.2 22.5 18 9.5 FXC1350-100M 10 25.5 16 9 FXC1350-150M 15 38 13 8.2 FXC1350-220M 22 58 10 6.5 FXC1350-330M 33 88 8 5 Part No. Inductance DC Resistance L0 (μH) Notes 1. All test data is referenced to 25 °C ambient 2. Irms (A):DC current (A) that will cause an approximate ΔT of 40 °C(reference ambient temperature is 25 °C) 3. Isat(A):DC current (A) that will cause L0 to drop approximately 30 % 4. The part temperature (ambient + temp rise) should not exceed 125 °C under worst case operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD Mechanical Reliability Item Specification and Requirement 1. No case deformation or change in apperarance Solderability 2. New solder coverage Test Method 1.Preheat：155℃±5℃ ，60S±2S 2.Tin: lead-free. 3.Temperature:240℃±5℃，flux 3.0S±0.5S. More than 95% Mechanical 1. No case deformation 1. Acceleration： 100G or change in apperarance 2. Pulse time:：6ms shock 3. 3 times in each positive and negative direction of 3 2. △L/Lo≦±10% 1. No case deformation Mechanical or change in apperarance vibration 2. △L/Lo≦±10% mutual perpendicular directions 1. Reflow: 2times 2. Frequency: 10HZ～55HZ～10HZ，20 Min/Cycles 3. Amplitude: 1.52 mm 4. Directions: X,Y,Z 5. Time: 12 cycle / direction Endurance Reliability Item Specification and Requirement Inductance change: Thermal Shock Within ± 10% Without distinct damage in appearance Test Method 1. First -40℃ for 30 minutes，last 125℃ for 30 minutes as 1 cycle. Go through 1000 cycles. 2. Max transfer time is 3 minutes. 3. Measured at room temperature after placing for 24±2 hours Humidity Resistance Inductance change: 1.Reflow 2 times, Within ± 10% Without distinct damage 2.85℃,85%RH,1000 hours in appearance 3.Measured at room temperature after placing for 24±2 hours Low temperature storage High temperature storage Inductance change: 1. Temperature：-40 ± 2℃ Within ± 10% Without distinct damage 2. Time：1000 hours in appearance 3. Measured at room temperature after placing for 24±2 hours Inductance change: Within ± 10% Without distinct damage in appearance 1. Temperature：+125 ± 2℃ 2. Time：1000 hours 3. Measured at room temperature after placing for 24±2 hours 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD Recommended Soldering Technologies (1)Re-flowing Profile Preheat condition: 150 ~200℃/60~180sec. Allowed time above 217℃: 80~120sec. Max temp: 260℃ Max time at max temp: 10 sec. Solder paste: Sn/3.0Ag/0.5Cu Allowed Reflow time: 2x max (2)Iron Soldering Profile Iron soldering power: Max. 30W Pre-heating: 150℃/60sec. 3sec. Max. 350℃ Soldering Tip temperature: 350℃ Max. Power: max. 30W Soldering time: 3sec. Max. Diameter of Soldering Solder paste: Sn/3.0Ag/0.5Cu Max.1 times for iron soldering Soldering Iron Iron 1.0mm max. Tc ℃ 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD Packaging Information (1) Tape Packaging Dimensions（Unit：mm） Tape dimensions (mm) W P P0 P2 D0 D1 T A0 B0 K0 E F 24 ±0.3 16 ±0.1 4.0 ±0.1 2.0 ±0.1 1.5 ±0.1 1.5 ±0.1 0.5 ±0.05 13.1 ±0.1 14 ±0.1 5.4 ±0.1 1.75 ±0.1 11.5 ±0.1 Taping Drawings (UNIT:mm) 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD (2) Reel Dimensions（Unit：mm） B N D C W A W N B C D 330+2.0 24±0.5 97±0.5 2.2+0.5 13.0±0.2 10.75±0.25 (3) Packaging Quantity(PCS) Standard Quantity Type FXC1350 Reel Inner box 500 pcs / reel 2Reel / box (1000 pcs) (4) Peel force of top cover tape The peel speed shall be about 300mm/minute The peel force of top cover tape shall be between 0.1 to 1.3 N Carton box 4 Middle boxes, (4000 pcs) A 深圳市长江微电科技有限公司 SZ CJIANG TECHNOLOGY CO.,LTD (5) Reel Label Label on the reel • Customer's part Number • Lot Number • Quantity • date code Shipping Label • Customer's part Number • Manufacturer's part Number • Quantity • date code (6) Inner Box (7) Carton