WIP252010P-R33ML

INPAQ Global RF/Component Solutions WIP252010P L Series Specification Product Name Series Size Power Inductor WIP252010P L Series EIAJ 2520 INPAQ Global RF/Component Solutions WIP252010P L Series Engineering Specification 1. Scope Feature  High saturation current realized by material properties and structure design  Low DC resistance to achieve high conversion efficiency and lower temperature rising  Low Profile: 2.5 mm × 2.0 mm × 1.0 mm.  Magnetically shielded structure to accomplish high resolution in EMC protection.  Halogen free, Lead Free, RoHS Compliance. Applications WIP252010P L series is generic applied in portable DC to DC converter line.  Smart phone, PAD  DC/DC converter  Thin-type power supply module, 2. Explanation of Part Number W I P 2 5 2 0 1 0 P 2 R 2 M L 1 2 3 4 5 6 7        1 : Series Name: Wire-wound type power inductor 2 : Size Code: The first two digitals: length(mm), The last two digitals: width(mm) 3 : Thickness in mm 4：Material code: Iron powder 5：Initial inductance value: 2R2 = 2.2 H 6：Model code, Tolerance of Inductance ±20%. 7：Electrode type. WIP252010P L Series Engineer Specification Version: A7 Page 1 of 8  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 3. Construction & Dimensions 3.1. End termination: Ni/Sn 3.2. Construction & Dimension : L [mm] W [mm] T [mm] E [mm] 2.5±0.2 2.0±0.2 1.0 max. 0.6±0.3 3.3. Recommend Land Pattern Dimensions : B A A [mm] B [mm] C [mm] 2.0 1.2 2.8. C 4. General specifications 4.1. Temperature Specifications Operating Temperature range Storage Temperature range : -40℃ to +125℃ : -50℃ to +125℃ * The detail operating temperature describing can refer to 5.1 (7). WIP252010P L Series Engineer Specification Version: A7 Page 2 of 8  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 5. Performance Characteristics 5.1. Specifications INPAQ Part Number WIP252010P-R22ML WIP252010P-R24ML WIP252010P-R33ML WIP252010P-R47ML WIP252010P-R68ML WIP252010P-1R0ML WIP252010P-1R5ML WIP252010P-2R2ML WIP252010P-4R7ML Li [μH] Initial inductance @1mA 0.22 0.24 0.33 0.47 0.68 1.0 1.5 2.2 4.7 RDC [mΩ] DC Resistance Typical 9 9 21 27 37 45 76 99 220 Maximum 12.5 14 26 32 44 54 91 119 262 Isat [A] Saturation Current Typical 7.9 7.7 6.6 5 4.3 3.5 2.6 2.4 1.8 Maximum 7.2 7 6 4.50 3.87 3.15 2.34 2.16 1.62 Irms [A] Heat Rating Current Typical 5.9 5.3 4.4 3.9 3.4 3.0 2.5 2.3 1.36 Maximum 5.3 4.8 4.0 3.51 3.06 2.70 2.25 2.07 1.22 Note 1: Customized design is available, please contact us. Note 2: All test referenced to 26℃ ambient Note 3: Inductance tolerance +/- 20% Note 4: Inductance is measured with Agilent® LCR meter 4285A. Test frequency at 1MHz. Note 5: DC resistance is measured with HIOKI® micro-ohm meter RM3542-01. Note 6: Isat means that DC current will cause a 30% inductance reduction form initial value. Note 7: Irms means that DC current will cause coil temp. rising to 40℃ whichever is smaller. WIP252010P L Series Engineer Specification Version: A7 Page 3 of 8  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 6. Reliability and Test Condition Test item Test condition Criteria 1. More than 95 % of terminal electrode should be covered 1. Solder temperature : 260 ± 5℃ with new solder Resistance to Solder Heat 2. Flux : Rosin 2. No mechanical damage 3. DIP time : 10 ± 1 sec 3. Inductance value should be within ± 20 % of the initial value 1. Reflow temperature : 245℃ It 1. No mechanical damage shall be Soldered on the 2. Soldering the products on substrate applying direction Adhesive Test PCB after the pulling test parallel to the substrate force > 5 N 2. Apply force(F) : 5 N 3. Test time : 10 sec 1. Temperature:-50 ~ 125℃ For 30 minutes each 1. No mechanical damage 2. Cycle: 500 cycles 2. Inductance should be Temperature Cycle 3. Measurement: At ambient within ±20% of the initial temperature 24 hours after test value completion 1. Temperature: 85 ± 2℃ 2. Testing time: 500 hrs 1. No mechanical damage 3. Applied current: Full rated 2. Inductance should be Dry Heat Test current within ± 20% of the initial 4. Measurement: At ambient value temperature 24 hours after test completion 1. Temperature: 60 ± 2℃ 2. Humidity: 90-95 % RH 1. No mechanical damage 3. Applied current: Full rated 2. Inductance should be current within ±20% of the initial Humidity Test 4. Testing time: 500 hrs value 5. Measurement: At ambient temperature 24 hours after test completion WIP252010P L Series Engineer Specification Version: A7 Page 4 of 8  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 7. Taping Package and Label Marking 7.1. Carrier tape dimensions A0 mm 2.25±0.05 B0 K0 t 2.80±0.1 1.35±0.1 0.22±0.05 7.2. Taping reel dimensions PART SIZE (EIA SIZE) 2520 (1008) Qty.(pcs) 3,000 BOX 5 reels / inner box WIP252010P L Series Engineer Specification Version: A7 Page 5 of 8  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 7.3. Taping specifications There shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the head of taping. 7.4. Label Marking The label specified as follows shall be put on the side of reel. (1) Part No. (2) Quantity (3) Lot No. * Part No. And Quantity shall be marked on outer packaging. 7.5. Quantity of products in the taping package (1) Standard quantity：3000pcs/Reel (2) Shipping quantity is a multiple of standard quantity. 8. Precautions for Handling 8.1. Precaution for handling of substrate Do not exceed to bend the board after soldering this product extremely. (reference examples)  Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board.  Do not bend extremely the board, in mounting another components. If necessary, use back-up pin (support pin) to prevent from bending extremely.  Do not break the board by hand. We recommend to use the machine or the jig to break it. 8.2. Precaution for soldering Note that this product will be easily damaged by rapid heating, rapid cooling or local heating. Do not give heat shock over 100C in the process of soldering. We recommend to take preheating and gradual cooling. WIP252010P L Series Engineer Specification Version: A7 Page 6 of 8  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 8.3. Recommendable reflow soldering Reference IPC-020c-5-1 Profile Feature Average Ramp Rate (Ts max to Tp) Preheat - Temperature Min (Tsmin) - Temperature Min (Tsmax) - Time(tsmin to tsmin) Time maintained above: - Temperature (TL) - Time (tL) Pb free Assembly 3 ℃/second max Peak Temperature (Tp) 260℃ +0/-5 ℃ Time within 5 ℃ of actual Peak Temperature (Tp) Ramp-Down Rate Time 25℃ to Peak Temperature 20-40 seconds 150℃ 200℃ 60-180 seconds 217℃ 60-150 seconds 6 ℃/second max. 8 minutes max WIP252010P L Series Engineer Specification Version: A7 Page 7 of 8  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 8.4. Soldering gun procedure Note the follows, in case of using solder gun for replacement. (1) The tip temperature must be less than 280C for the period within 3 seconds by using soldering gun under 30 W. (2) The soldering gun tip shall not touch this product directly. 8.5. Soldering volume Note that excess of soldering volume will easily get crack the body of this product. 8.6. Taping Package Storage Condition Storage Temperature : 5 to 40 ℃ Relative Humidity: < 65%RH Storage Time : 12 months max WIP252010P L Series Engineer Specification Version: A7 Page 8 of 8  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com