WIP322512A-R68ML

WIP322512A L Series Specification Product Name Series Size Power Inductor WIP322512A L Series EIAJ 3225 RoHS Pb WIP322512A L Series Engineering Specification 1. Scope Feature  Low Profile: 3.2 mm × 2.5 mm × 1.2 mm.  Magnetically shielded structure to accomplish high resolution in EMC protection.  Halogen free, Lead Free, RoHS Compliance. Applications WIP322512A L series is generic applied in portable DC to DC converter line.  Smart phone, PAD   DC/DC converter Thin-type power supply module, 2. Explanation of Part Number W I P 3 2 2 5 1 2 A 6 R 8 W R w 2 3 4 5 W 1  W 1 : Series Name: Wire-wound type power inductor       M L 6 7 2 : Size Code: The first two digitals: length(mm), The last two digitals: width(mm) 3 : Thickness in mm 4：Type code 5：Initial inductance value: 6R8 = 6.8 H 6：Model code, Tolerance of Inductance ±20%. 7：Electrode type. WIP322512A L Series Engineer Specification Version: A3 Page 1 of 9  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 3. Construction & Dimensions 3.1. End termination: Ni/Sn 3.2. Construction & Dimension : L [mm] W [mm] W1 [mm] T [mm] E [mm] 3.2±0.2 2.5±0.2 2.3±0.2 1.1±0.1 0.6±0.2 3.3. Recommend Land Pattern Dimensions : B A A [mm] B [mm] C [mm] 2.5 typ. 1.7 typ. 3.2 typ. C 4. General specifications 4.1. Temperature Specifications Operating Temperature range Storage Temperature range : -40℃ to +125℃ : -50℃ to +125℃ * The detail operating temperature describing can refer to 5.1 (7). WIP322512A L Series Engineer Specification Version: A3 Page 2 of 9  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 5. Performance Characteristics 5.1. Specifications INPAQ Part Number Li [μH] Initial inductance RDC [mΩ] I-sat [A] I-rms [A] DC Resistance Saturation Current Heat Rating Current Typical Maximum Typical Maximum Typical Maximum WIP322512A-R47ML 0.47 15 19 7.7 7.0 5.8 5.2 WIP322512A-R68ML 0.68 16 20 6.2 5.8 5.3 4.7 WIP322512A-1R0ML 1.0 25 32 5.5 5.0 4.9 4.4 WIP322512A-2R2ML 2.2 60 72 4 3.5 3 2.7 WIP322512A-4R7ML 4.7 150 168 2.8 2.4 1.7 1.4 WIP322512A-6R8ML 6.8 190 210 2.4 2.1 1.5 1.2 Note 1: Customized design is available, please contact us. Note 2: All test referenced to 26℃ ambient. Note 3: Inductance tolerance +/- 20%. Note 4: Inductance is measured with Agilent® LCR meter 4285A (or equivalent) at 1MHz/1V. Note 5: DC resistance is measured with HIOKI® micro-ohm meter RM3542 or equivalent. Note 6: Isat means that DC current will cause a 30% inductance reduction from the lower limit value. Note 7: Irms means that DC current will cause part temp. rising 40℃ whichever is smaller. Note 8: Withstand voltage is 20V DC. WIP322512A L Series Engineer Specification Version: A3 Page 3 of 9  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 5.2. Current Characteristic WIP322512A L Series Engineer Specification Version: A3 Page 4 of 9  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com WIP322512A L Series Engineer Specification Version: A3 Page 5 of 9  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 5.3 Frequency Characteristic 5.3.1 Inductance & Q factor - Freq. Curve WIP322512A L Series Engineer Specification Version: A3 Page 6 of 9  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 6. Reliability and Test Condition Test item Test condition Criteria 1. More than 95 % of terminal electrode should be covered with new solder 1. Solder temperature : 260 ± 5℃ 2. No mechanical damage Resistance to Solder Heat 2. Flux : Rosin 3. DIP time : 10 ± 1 sec 3. Inductance value should be within ± 20 % of the initial value 1. Reflow temperature : 245℃ 1. No mechanical damage It shall be Soldered on the 2. Soldering the products on substrate applying direction Adhesive Test PCB after the pulling test parallel to the substrate force > 5 N 2. Apply force(F) : 5 N 3. Test time : 10 sec 1. Temperature : -50 ~ 125℃ For 30 minutes each 1. No mechanical damage 2. Cycle: 500 cycles 2. Inductance should be Temperature Cycle 3. Measurement: At ambient within ±20% of the initial temperature 24 hours after test value completion 1. Temperature : 85 ± 2℃ 2. Testing time : 500 hrs 1. No mechanical damage 3. Applied current: Full rated 2. Inductance should be Dry Heat Test current within ± 20% of the initial 4. Measurement: At ambient value temperature 24 hours after test completion 1. Temperature : 60 ± 2℃ 2. Humidity : 90-95 % RH 3. Applied current: Full rated 1. No mechanical damage current 2. Inductance should be Humidity Test 4. Testing time : 500 hrs within ±20% of the initial 5. Measurement : At ambient value temperature 24 hours after test completion WIP322512A L Series Engineer Specification Version: A3 Page 7 of 9  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 7. Taping Package and Label Marking 7.1Carrier tape dimensions 5.3. Taping reel dimensions 7.2 Taping reel dimensions PART SIZE (EIA SIZE) 3225 (1210) Qty.(pcs) 3,000 BOX 5 reels / inner box WIP322512A L Series Engineer Specification Version: A3 Page 8 of 9  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 7.3 Taping specifications There shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the head of taping. 7.4 Label Marking The label specified as follows shall be put on the side of reel. (1) Part No. (2) Quantity (3) Lot No. * Part No. And Quantity shall be marked on outer packaging. 7.5 Quantity of products in the taping package (1) Standard quantity：3000pcs/Reel (2) Shipping quantity is a multiple of standard quantity. 8. Precautions for Handling 8.1 Precaution for handling of substrate Do not exceed to bend the board after soldering this product extremely. (reference examples)  Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board.  Do not bend extremely the board, in mounting another components. If necessary, use back-up pin (support pin) to prevent from bending extremely.  Do not break the board by hand. We recommend to use the machine or the jig to break it. 8.2 Precaution for soldering Note that this product will be easily damaged by rapid heating, rapid cooling or local heating. Do not give heat shock over 100C in the process of soldering. We recommend to take preheating and gradual cooling. WIP322512A L Series Engineer Specification Version: A3 Page 9 of 9  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 8.3 Recommendable reflow soldering Reference IPC-020c-5-1 Profile Feature Average Ramp Rate (Ts max to Tp) Preheat - Temperature Min (Tsmin) - Temperature Min (Tsmax) - Time(tsmin to tsmin) Time maintained above: - Temperature (TL) - Time (tL) Pb free Assembly Peak Temperature (Tp) 260℃ +0/-5℃ Time within 5℃ of actual Peak Temperature (Tp) Ramp-Down Rate Time 25℃ to Peak Temperature 3℃/second max 150℃ 200℃ 60-180 seconds 217℃ 60-150 seconds 20-40 seconds 6℃/second max. 8 minutes max WIP322512A L Series Engineer Specification Version: A3 Page 10 of 9  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 8.4 Soldering gun procedure Note the follows, in case of using solder gun for replacement. (1) The tip temperature must be less than 280C for the period within 3 seconds by using soldering gun under 30 W. (2) The soldering gun tip shall not touch this product directly. 8.5 Soldering volume Note that excess of soldering volume will easily get crack the body of this product. 8.6 Taping Package Storage Condition Storage Temperature : 5 to 40 ℃ Relative Humidity: < 65%RH Storage Time : 12 months max WIP322512A L Series Engineer Specification Version: A3 Page 11 of 9  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com