RLSD92A051C

TVS/ESD Arrays RLSD92A051C Features l l l l l l Working voltages: 5V Low Leakage Current Low operating and clamping voltages Lead Free/RoHS compliant Solid-state state silicon avalanche technology Provides ESD protection to IEC61000 IEC61000-4-2(ESD): ±15kV (air discharge), ±8kV 8kV (contact discharge) Electrical symbol Applications l l l l l l Cell Phone Handsets and Accessories Microprocessor based equipment Personal Digital Assistants (PDA’s) Notebooks, Desktops, and Servers Portable Instrumentation Pagers Peripherals 1O O2 Part Number Code R L S D 9 Package LOGO SOD D-923 2 A 0 5 Straight foot overhanging 1 C Protects 1 Lines V= Unidirectional VRWM:5V C= Bidirectional Absolute Maximum Rating Rating Symbol Value Units ESD Voltage (Contact) VESD ±8 kV ESD Voltage (Air) VESD ±15 kV Lead Soldering Temperature TL 260 (10 sec.) °C Maximum junction temperature TJ 150 °C TSTG -55 to 150 °C PD 150 mW Storage Temperature Power Dissipation Electrical Characteristics (@ 25°C Unless Otherwise Specified) Reverse Stand-Off Voltage Minimum Breakdown Voltage Peak Pulse Voltage @8/20μS Reverse Leakage @VRWM Typical Capacitance VRWM VBR @1mA VC@7A (max.) @IPP IR@VRWM DC=0V CJ@ 1 MHz V V V V A μA pF 5 6.0 9 9 7 1.0 13.5 VC @8/20μS Type Number RLSD92A051C Specifications are subject to change without notice. Please refer to http://www.ruilon.com.cn for current information. Revised: 2021-02-18 Page:1 TVS/ESD Arrays RLSD92A051C Electrical Parameters (T=25°C) Symbol Parameter Ipp IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR IT IR VC VBR VRWM Working Peak Reverse Voltage IR IT Maximum Reverse Leakage Current @ VRWM VBR I I VRWM VBR VC V Breakdown Voltage @ IT IT Ipp Test Current Characteristic Curves 8/20μs Pulse Waveform Fig2.ESD 2.ESD Pulse Waveform (according to IEC61000-4-2) IEC61000 120 Test Waveform Parameters tr=8μS td=20μS Peak Value Ipp tr 100 80 Percent of Peak Pulse Current% Ipp-Peak Pulse Current-%of Ipp Fig 1. 60 40 td=t Ipp/2 20 0 100% 90% 10% 0.7~1ns Time(ns) 0 5 10 15 20 25 30 t-Time(μS) Fig 3. Power Derating Curve Figure 4.ESD Clamping(8KV Contact per IEC61000-4-2) Tek Run:5.00GS/s Sample we05s 100 90 % of Rated Power 80 70 60 50 40 30 20 R1 10 0 0 20 40 60 80 100 120 140 160 180 200 Ch1 10.00V M50.0ns Ch1 14.6V Ambient Temperature-TA(°C) Specifications are subject to change without notice. Please refer to http://www.ruilon.com.cn for current information. Revised: 2021-02-18 Page:2 RLSD92A051C TVS/ESD Arrays Dimensions & Recommended ecommended soldering footprint(mm) Millimeters Inches DIM Min Max Min Max A 0.34 0.40 0.013 0.016 B 0.15 0.25 0.006 0.010 C 0.07 0.17 0.003 0.007 D 0.75 0.85 0.030 0.033 E 0.55 0.65 0.022 0.026 F 0.95 1.05 0.037 0.041 G 0.05 0.15 0.002 0.006 Part Number Component package Quantity Reel Size Molding compound flammability rating Lead Finish RLSD92A051C SOD-923 8000 7 inch UL 94V-0 Matte tin（RoHS Compliant） Soldering Parameters - Reflow Soldering (Surface Mount Devices) Reflow Condition TP Ramp-up Critical Zone TL to TP TL Pre Heat Temperature TS(max) Ramp-down TS(min) Preheat Time to peak temperature (t 25℃ to peak) 150°C -Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 -180 Seconds 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Time Specifications are subject to change without notice. Please refer to http://www.ruilon.com.cn for current information. -Temperature Temperature Min (Ts(min)) Average ramp up rate ( Liquids Liquid Temp TL) to peak Reflo w 25 Pb - Free assembly - Temperature (TL) (Liquids) 217°C - Time (min to max) (ts) 60 -150 Seconds Peak Temperature (TP) 260 +0/-5°C Time within 5°C of actual peak Temperature (tp) 20 - 40 Seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max Do not exceed 280°C Revised: 2021-02-18 Page:3