Form No: XXXXX-7-0000-TBM03-160500535
Specification for Approval
Date: 2016/05/24
Customer : 深圳臺慶
TMPC0503HV-Series(G)-D
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
pcs
REMARK:
Customer Approval Feedback
□ 西北臺慶科技股份有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
□ 東莞臺慶精密電子有限公司
DONGGUAN TAI-TECH ADVANCED ELECTRONICS CO., LTD
JITIGANG MANAGEMENT DISTRICT, HUANGJIANG, DONGGUAN,
GUANGDONG, CHINA
TEL: +86-769-3365488 FAX: +86-769-3366896
E-mail: sales@tai-tech.net
Office:
金亨國際有限公司
KAMHENG INTERNATIONAL LIMITED
TEL: +86-852-25772033
APPROVED
CHECKED
管哲頎
Eric Kuan
曾詩涵
Angela Tseng
FAX: +86-852-28817778
□ 臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
Office:
北欣國際有限公司
NORTH STAR INTERNATIONAL LIMITED
TEL: +86-512-57619396
Sales Dep.
FAX: +86-512-57619688
R&D Center
APPROVED
CHECKED
DRAWN
楊祥忠
Mike Yang
詹偉特
Jack Chan
何秦芝
Sharon Ho
■ 慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG ,
JIANGSU , CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
TA734003
TAI-TECH
P1
SMD Power Choke Coil
TMPC0503HV-Series(G)-D
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
16/05/24
新 發 行
楊祥忠
詹偉特
何秦芝
備
註
TAI-TECH
P2
SMD Power Choke Coil
TMPC0503HV-Series(G)-D
1. Features
1. Carbonyl powder inductor.
2. Compact design.
3. High current，low DCR，high efficiency.
Halogen
Pb
Halogen-free
Pb-free
4. Very low acoustic noise and very low leakage flux noise.
5. High reliability.
6. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
2. Applications
Note PC power system，incl. IMVP-6
DC/DC converter.
3. Dimensions
Recommend PC Board Pattern
Dr. MOS application
C
E
6R8
1R0
1151
1150
B
L
D
H
A
G
Series
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
TMPC0503HV
5.7±0.3
5.2±0.2
2.8±0.2
1.1±0.3
1.5±0.2
L(mm)
4. Part Numbering
TMPC
0503
HV
A
B
C
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: D/C
-
6R8
D
MG E
G(mm)
H(mm)
6.5
2.5
1.8
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.12mm and above.
D
F
BxC
Carbonyl powder V: Vehicle
6R8=6.8uH
M=±20%
印字:黑色；6R8 及 D/C 1150 (D/C 前二碼是年份,後二碼是週期,依實際生產週期而定)
TAI-TECH
P3
5. Specification
Part Number
Inductance
L0 (uH)±20% @ 0 A
I rms (A)
Typ.
I sat (A)
Typ.
DCR(mΩ)
Typ.@25℃
DCR(mΩ)
Max.@25℃
TMPC0503HV-R10YG-D
0.10±30%
23
27
2.5
3.0
TMPC0503HV-R20YG-D
0.20±30%
16
25
2.6
3.2
TMPC0503HV-R20MG-D
0.20
16
25
2.6
3.2
TMPC0503HV-R22MG-D
0.22
15.5
21
3.7
4.4
TMPC0503HV-R33MG-D
0.33
14
18
4.3
5.0
TMPC0503HV-R47MG-D
0.47
12
16
6.4
7.4
TMPC0503HV-R56MG-D
0.56
10
15
8.0
10
TMPC0503HV-R68MG-D
0.68
8.5
14
10
12
TMPC0503HV-1R0MG-D
1.00
7.0
11
13
14
TMPC0503HV-1R2MG-D
1.20
6.5
11
14
16
TMPC0503HV-1R5MG-D
1.50
6.0
10
16
25
TMPC0503HV-2R2MG-D
2.20
5.5
9.0
25
35
TMPC0503HV-3R3MG-D
3.30
5.0
8.0
32
38
TMPC0503HV-4R7MG-D
4.70
4.6
6.0
50
53
TMPC0503HV-5R6MG-D
5.60
4.25
4.50
55
63
TMPC0503HV-6R8MG-D
6.80
4.0
4.3
68
76.2
TMPC0503HV-100MG-D
10.0
2.75
3.50
110
128
TMPC0503HV-150MG-D
15.0
2.1
2.6
165
190
TMPC0503HV-180MG-D
18.0
2.0
2.3
195
230
TMPC0503HV-220MG-D
22.0
1.9
1.7
220
250
TMPC0503HV-330MG-D
33.0
1.6
1.6
380
440
Note:
1.
2.
3.
4.
5.
6.
Test frequency : L : 100KHz /1.0V;
All test data referenced to 25℃ ambient.
Testing Instrument : L: HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃
Saturation Current (Isat) will cause L0 to drop approximately 20%.
The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
P4
6. Material List
NO
Items
1
Core
Carbonyl Powder.
Materials
2
Wire
Polyester Wire or equivalent.
3
Clip
100% Pb free solder(Ni+Sn---Plating)
4
paint
Epoxy resin
5
Ink
Halogen-free ketone
7. Reliability and Test Condition
Item
Performance
Operating temperature
-55~+125℃(Including self - temperature rise)
Storage temperature and
Humidity range
1.-10~+40℃,50~60%RH (Product without taping)
2.-55~+125℃(on board)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation Current (Isat)
Approximately △L20%
Saturation DC Current (Isat) will cause L0
to drop △L(%).
Heat Rated Current (Irms)
Approximately △T40℃
Heat Rated Current (Irms) will cause the coil temperature rise △
T(℃) without core loss.
1.Applied the allowed DC current
2.Temperature measured by digital surface thermometer
Reliability Test
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Temperature：125±2℃(Inductor)
Duration ：1000hrs Min.
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Condition for 1 cycle
Step1：-55±2℃ 30min Min.(Inductor)
Step2：125±2℃ transition time 1min MAX.
Step3：125±2℃ 30min Min.
Step4：Low temp. transition time 1min MAX.
Number of cycles： 1000
Measured at room temperature after placing for 24±2 hrs
High Temperature
Exposure(Storage)
Temperature Cycling
Moisture Resistance
Biased Humidity
(AEC-Q200)
High Temperature
Operational Life
(AEC-Q200)
Appearance：No damage.
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature after
placing for 4 hrs.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3
hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3
hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency
of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification
Reflow Profiles
Humidity ：85±3﹪R.H,
Temperature：85℃±2℃
Duration : 1000hrs Min with 100% rated current.
Measured at room temperature after placing for24±2 hrs
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Temperature：125±2℃(Inductor)
Duration ：1000hrs Min. with 100% rated current.
Measured at room temperature after placing for24±2 hrs
TAI-TECH
P5
Item
Performance
Test Condition
Oscillation Frequency: 10～2K～10Hz for 20 minute
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
Vibration
Mechanical
Shock
Type
Peak
value
(g’s)
Normal
duration (D)
(ms)
Wave
form
Velocity
change
(Vi)ft/sec
SMD
100
6
Half-sine
12.3
Lead
100
6
Half-sine
12.3
shocks in each direction along 3 perpendicular axes.
Number of heat cycles: 1
Appearance：No damage.
Resistance to
Soldering Heat
Temperature(℃)
Time(s)
260±5(solder temp)
10±1
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Temperature
ramp/immersion
and emersion rate
25mm/s ±6 mm/s
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value
Thermal shock
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1：-55±2℃ 15±1min(Inductor)
Step2：125±2℃ within 20Sec.
Step3：125±2℃ 15±1min
Number of cycles： 300
Measured at room temperature after placing fo24±2hrs
Resistance to
Solvents
Add aqueous wash chemical - OKEM clean or equivalent.
Appearance：No damage.
ESD
Solderability
More than 95% of the terminal electrode
should be covered with solder。
Steam Aging: 8 hours ± 15 min
Preheat: 150℃,60sec.。
Solder: Sn96.5% Ag3% Cu0.5%
Temperature: 245±5℃。
Flux for lead free: Rosin. 9.5%。
Dip time: 4±1sec.
Depth: completely cover the termination
Electrical Test not required
V-0
or V-1 are acceptable
epoxy
V-0
or V-1 are acceptable
Flammability
TAI-TECH
Item
P6
Performance
Test Condition
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Place the 100mm X 40mm board into a fixture similar to the one
shown in below Figure with the
component facing down. The apparatus shall consist of mechanical
means to apply a force which will bend
the board (D) x = 2 mm minimum. The duration of the applied
forces shall be 60 (+ 5) sec. The force is to
be applied only once to the board.
Board Flex
Appearance：No damage.
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020D Classification Reflow Profiles
With the component mounted on a PCB with the device to be
tested, apply a 17.7 N (1.8 Kg) force to the
side of a device being tested. This force shall be applied for 60 +1
seconds. Also the force shall be applied
gradually as not to apply a shock to thecomponent being tested.
Terminal
Strength ( SMD )
Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours
of recovery under the standard condition.
TAI-TECH
P7
8. Soldering and Mounting
(1) Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. TAI-TECH terminations are suitable for
re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air
soldering tools.
(2) Solder re-flow:
Recommended temperature profiles for re-flow soldering in Figure 1.
(3) Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
‧Preheat circuit and products to 150℃
‧355℃ tip temperature (max)
‧Never contact the ceramic with the iron tip
‧1.0mm tip diameter (max)
‧Use a 20 watt soldering iron with tip diameter of 1.0mm
‧Limit soldering time to 4~5sec.
Reflow Soldering
Iron Soldering
PRE-HEATING
SOLDERING
NATURAL
COOLING
PRE-HEATING
217
60~150s
200
150
60~180s
TEMPERATURE(°C)
TEMPERATURE(°C)
tp(245° C / 20~40s.)
SOLDERING
within 4~5s
TP(260 ℃ / 10s max.)
350
150
Gradual cooling
Over 60s
480s max.
NATURAL
COOLING
25
TIME( sec.)
Reflow times: 3 times max.
Fig.1
TIME(sec.)
Iron Soldering times: 1 times max.
Fig.2
TAI-TECH
P8
9. Packaging Information
(1) Reel Dimension
COVER TAPE
C
B
D
2.0±0.5
A
Type
A(mm)
B(mm)
C(mm)
D(mm)
13”x12mm
12.4+2/-0
100±2
13+0.5/-0.2
330
EMBOSSED CARRIER
(2) Tape Dimension
Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) W(mm) F(mm)
TMPC
0503
6.2±0.1
5.6±0.1
3.3±0.1
8.0±0.1
12.0±0.3
5.5±0.1
t(mm)
D(mm)
0.35±0.05
1.5±0.1
(3) Packaging Quantity
TMPC
0503
Chip / Reel
2000
Inner box
4000
Carton
16000
(4) Tearing Off Force
F
Top cover tape
The force for tearing off cover tape is 10 to 130 grams in the arrow
direction under the following conditions(referenced
ANSI/EIA-481-C-2003 of 4.11 standard).
165° to180°
Base tape
Room Temp.
(℃)
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
mm/min
5~35
45~85
860~1060
300
Application Notice
‧Storage Conditions(component level)
To maintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1.
2. Temperature and humidity conditions: Less than 40℃ and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
TAI-TECH
P9
10. Typical Performance Curves
TMPC0503HV-R10
TMPC0503H-R10
TMPC0503HV-R20
80
TMPC0503HV-R22
TMPC0503H-R20
0.4
70
40
0.08
30
50
0.24
40
0.16
30
20
0
20
16.2
21.6
0
27
0
5
10
DC CURRENT(A)
15
20
80
TMPC0503H-R47
0.8
50
0.3
40
30
0.15
20
0.6
60
50
0.4
40
30
0.2
0
0
15
0
20
0
0
80
4
8
12
0.6
60
0.4
40
0.2
20
0
0
0
3
6
50
0.6
40
30
0.3
80
1.5
60
50
1
40
30
0.5
80
70
1.5
60
50
1
40
30
0.5
20
10
0
0
14
10
0
0
2.75
DC CURRENT(A)
5.5
8.25
0
11
0
0
3
DC CURRENT(A)
TMPC0503HV-1R5
TMPC0503H-1R5
15
TMPC0503HV-1R2
TMPC0503H-1R2
2
20
10
10.5
12
70
20
0
9
DC CURRENT(A)
TMPC0503HV-1R0
TMPC0503H-1R0
2
TEMP. RISE(oC)
INDUCTANCE (uH)
60
3
80
16
70
0.9
100
0.8
DC CURRENT(A)
TMPC0503HV-R68
TMPC0503H-R68
7
TMPC0503HV-R56
TMPC0503H-R56
10
DC CURRENT(A)
3.5
21
20
10
0
16.8
TEMP. RISE(oC)
60
1.2
12.6
70
TEMP. RISE(oC)
INDUCTANCE (uH)
0.45
10
8.4
1
80
70
5
4.2
TMPC0503HV-R47
TMPC0503H-R33
0
0
0
25
DC CURRENT(A)
TMPC0503HV-R33
0.6
10
0
0
TEMP. RISE(oC)
INDUCTANCE (uH)
10.8
30
0.07
TEMP. RISE(oC)
INDUCTANCE (uH)
5.4
40
0.14
10
0
0
50
0.21
20
0.08
10
INDUCTANCE (uH)
60
60
TEMP. RISE(oC)
50
TEMP. RISE(oC)
INDUCTANCE (uH)
INDUCTANCE (uH)
0.28
0.32
60
0.04
INDUCTANCE (uH)
70
70
0.16
0.12
80
0.35
80
6
9
12
DC CURRENT(A)
TMPC0503HV-2R2
TMPC0503H-2R2
4
80
TEMP. RISE(oC)
0.2
80
TMPC0503HV-3R3
TMPC0503H-3R3
6
80
70
70
70
1.8
40
1.2
30
50
2
40
30
1
20
20
4.5
60
50
3
40
30
1.5
TEMP. RISE(oC)
50
60
3
TEMP. RISE(oC)
INDUCTANCE (uH)
60
TEMP. RISE(oC)
INDUCTANCE (uH)
INDUCTANCE (uH)
2.4
20
0.6
10
10
0
0
0
2
4
6
8
0
0
10
2.25
DC CURRENT(A)
4.5
6.75
9
0
0
2
TMPC0503HV-5R6
TMPC0503H-4R7
80
6
8
TMPC0503HV-6R8
TMPC0503H-5R6
10
4
DC CURRENT(A)
DC CURRENT(A)
TMPC0503HV-4R7
8
10
0
0
80
70
TMPC0503H-6R8
12
80
70
70
4
40
30
2
50
6
40
4
30
20
20
9
60
50
6
40
30
3
20
2
10
0
0
0
1.5
3
DC CURRENT(A)
4.5
6
10
0
0
0
0.9
1.8
2.7
DC CURRENT(A)
3.6
4.5
10
0
0
0
1
2
3
DC CURRENT(A)
4
5
TEMP. RISE(oC)
50
60
TEMP. RISE(oC)
INDUCTANCE (uH)
60
TEMP. RISE(oC)
INDUCTANCE (uH)
INDUCTANCE (uH)
8
6
TAI-TECH
P1
TMPC0503HV-150
TMPC0503HV-100
TMPC0503H-100
20
TMPC0503H-150
28
80
TMPC0503HV-180
TMPC0503H-180
28
60
80
50
10
40
30
5
45
16.8
30
11.2
TEMP. RISE(oC)
INDUCTANCE (uH)
60
TEMP. RISE(oC)
INDUCTANCE (uH)
INDUCTANCE (uH)
22.4
15
22.4
64
16.8
48
11.2
32
5.6
16
15
20
5.6
10
0
0
0.7
1.4
2.1
2.8
0
0.52
TMPC0503H-220
1.56
2.08
2.6
TMPC0503HV-330
TMPC0503H-330
32
48
56
36
42
24
28
8
12
14
0
0
24
20
16
70
10
0
0
0.38
0.76
1.14
DC CURRENT(A)
1.52
1.9
0
0
0.4
0.8
1.2
DC CURRENT(A)
0.64
1.28
1.92
DC CURRENT(A)
60
30
0
0
40
TEMP. RISE(oC)
INDUCTANCE (uH)
INDUCTANCE (uH)
1.04
DC CURRENT(A)
TMPC0503HV-220
40
0
0
0
3.5
DC CURRENT(A)
1.6
2
TEMP. RISE(oC)
0
2.56
3.2
TEMP. RISE(oC)
70
