TMPC0603HV-330MG-D

TAI-TECH P1 SMD Power Inductor TMPC0603HV-Series(G)-D ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 17/09/17 新發行 羅宜春 梁周虎 卜文娟 備 注 TAI-TECH P2 SMD Power Inductor TMPC0603HV-Series(G)-D 1. Features 1. Carbonyl Powder. 2. Compact design. Halogen 3. High current，low DCR，high efficiency. 4. Very low acoustic noise and very low leakage flux noise. Halogen-free 5. High reliability. 6. 100% Lead(Pb)-Free and RoHS compliant. 7. High reliability -Reliability test complied to AEC-Q200. 8. Operating temperature -55~+125℃(Including self - temperature rise) 9. 2. Applications Note PC power system，incl. IMVP-6 DC/DC converter . 3. Dimensions D C A 　 8R2 1901 L H E B Recommend PC Board Pattern G A(mm) B(mm) C(mm) D(mm) E(mm) TMPC0603HV 7.3±0.3 Series 6.6±0.3 2.8±0.2 1.8±0.3 3.0±0.3 L(mm) 4. Part Numbering TMPC 0603 HV A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: Code - 8R2 MG D E - G(mm) H(mm) 8.4 2.5 3.5 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.15mm and above. D F BxC Carbonyl Powder, V:vehicle. 8R2=8.20uH M=±20% Marking: Black.8R2 and 1901(19 YY, 01 WW,follow production date). TAI-TECH P3 5. Specification Part Number Inductance L0 (uH)±20% I rms ( A ) Typ I sat ( A ) Typ DCR (mΩ) Typ. @25℃ DCR (mΩ) Max. @25℃ TMPC0603HV-R10YG-D TMPC0603HV-R13YG-D 0.10±30% 32.5 60.0 1.2 1.7 0.13±30% 27.6 50.0 1.3 1.8 TMPC0603HV-R15YG-D 0.15±30% 27.0 45.0 1.5 1.9 TMPC0603HV-R16YG-D 0.16±30% 27.0 45.0 1.5 1.9 TMPC0603HV-R18YG-D 0.18±30% 25.0 43.0 1.7 2.3 TMPC0603HV-R19YG-D 0.19±30% 24.0 41.0 1.8 2.5 TMPC0603HV-R20YG-D 0.20±30% 24.0 41.0 1.8 2.5 TMPC0603HV-R22YG-D 0.22±30% 23.0 40.0 2.1 2.8 TMPC0603HV-R25MG-D 0.25 21.0 39.0 3.3 3.5 TMPC0603HV-R30MG-D 0.30 21.0 35.0 3.2 3.8 TMPC0603HV-R33MG-D 0.33 20.0 32.0 3.5 3.9 TMPC0603HV-R36MG-D 0.36 19.0 32.0 3.6 4.2 TMPC0603HV-R40MG-D 0.40 18.0 27.5 3.71 4.1 TMPC0603HV-R47MG-D 0.47 17.5 26.0 4.0 4.2 TMPC0603HV-R56MG-D 0.56 16.5 25.5 4.7 5.0 TMPC0603HV-R60MG-D 0.60 16.0 25.5 4.7 5.2 TMPC0603HV-R68MG-D 0.68 15.5 25.0 4.8 5.5 TMPC0603HV-R75MG-D 0.75 14.5 24.5 5.5 6.6 TMPC0603HV-R82MG-D 0.82 13.0 24.0 6.7 8.0 TMPC0603HV-R90MG-D 0.90 11.0 22.0 8.3 10 TMPC0603HV-1R0MG-D 1.00 11.0 22.0 8.3 10 TMPC0603HV-1R2MG-D 1.20 10.0 20.0 10 12 TMPC0603HV-1R5MG-D 1.50 9.0 18.0 13 15 TMPC0603HV-1R8MG-D 1.80 8.5 16.0 14 17 TMPC0603HV-2R0MG-D 2.00 8.2 15.0 16 19 TMPC0603HV-2R2MG-D 2.20 8.0 14.0 18 20 TMPC0603HV-2R5MG-D 2.50 7.0 13.0 20 22 TMPC0603HV-2R7MG-D 2.70 7.0 13.0 24 27 TMPC0603HV-3R3MG-D 3.30 6.0 13.5 28 30 TMPC0603HV-4R7MG-D 4.70 5.5 10.0 37 40 TMPC0603HV-5R6MG-D 5.60 5.0 9.0 43 48 TMPC0603HV-6R8MG-D 6.80 4.5 8.0 54 60 TMPC0603HV-8R2MG-D 8.20 4.0 7.5 64 68 TMPC0603HV-100MG-D 10.0 3.5 6.0 75 85 TMPC0603HV-120MG-D 12.0 3.3 5.5 81 93 TMPC0603HV-150MG-D 15.0 3.0 4.0 107 123 TMPC0603HV-180MG-D 18.0 2.5 4.0 140 160 TMPC0603HV-220MG-D 22.0 2.0 3.5 165 190 TMPC0603HV-330MG-D 33.0 2.0 2.5 200 240 TMPC0603HV-470MG-D 47.0 1.75 2.0 302 363 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 6. Material List 4 5 3 1 2 NO Items Materials 1 Core Carbonyl Powder. 2 Wire Polyester Wire or equivalent. 3 Clip 100% Pb free solder(Ni+Sn---Plating) 4 paint Epoxy resin 5 Ink Halogen-free ketone TAI-TECH P4 7. Reliability and Test Condition Item Operating temperature Storage temperature and Humidity range Performance Test Condition -55~+125℃(Including self - temperature rise) 1. -10~+40℃,50~60%RH (Product with taping) 2. -55~+125℃(on board) Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Heat Rated Current (Irms) Approximately △L30% Saturation DC Current (Isat) will cause L0 to drop △L(%) Approximately △T40℃ Heat Rated Current (Irms) will cause the coil temperature rise △ T(℃). 1.Applied the allowed DC current 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Temperature：125±2℃(Inductor) Duration ：1000hrs Min. Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 30min Min.(Inductor) Step2：125±2℃ transition time 1min MAX. Step3：125±2℃ 30min Min. Step4：Low temp. transition time 1min MAX. Number of cycles： 1000 Measured at room temperature after placing for 24±2 hrs High Temperature Exposure(Storage) AEC-Q200 Temperature Cycling AEC-Q200 Moisture Resistance Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles 1.Baked at50 ℃ for 25hrs, measured at room temperature after Appearance：No damage. placing for 4 hrs. Impedance：within±15% of initial value 2.Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 Inductance：within±10% of initial value hours, cool down to 25℃ in 2.5hrs. Q：Shall not exceed the specification value. 3.Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 RDC ： within ± 15% of initial value and shall not exceed the hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2hrs then keep at specification value -10℃ for 3hrs 4.Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity ：85±3﹪R.H, Temperature：85℃±2℃ Duration : 1000hrs Min Measured at room temperature after placing for24±2hrs Biased Humidity (AEC-Q200) Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Temperature：125±2℃(Inductor) Duration ：1000hrs Min. with 100% rated current. Measured at room temperature after placing for24±2hrs High Temperature Operational Life (AEC-Q200) External Visual Physical Dimension Resistance to Solvents Mechanical Shock Appearance：No damage. Inspect device construction, marking and workmanship. Electrical Test not required. According to the product specification size measurement According to the product specification size measurement Appearance：No damage. Add aqueous wash chemical - OKEM clean or equivalent. Appearance：No damage. Peak value Normal Wave Velocity Type (g’s) duration (D) (ms) form change (Vi)ft/sec Impedance：within±15% of initial value Inductance：within±10% of initial value SMD 100 6 Half-sine 12.3 Q：Shall not exceed the specification value. RDC ： within ± 15% of initial value and shall not exceed the Lead 100 6 Half-sine 12.3 specification value shocks in each direction along 3 perpendicular axes. TAI-TECH P5 Item Performance Vibration Resistance to Soldering Heat Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC ： within ± 15% of initial value and shall not exceed the specification value Thermal shock (AEC-Q200) ESD Solderability Electrical Characterization Flammability Test Condition IPC/JEDEC J-STD-020DClassification Reflow Profiles Oscillation Frequency: 10～2K～10Hz for 20 minute Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Test condition ： Temperature(℃) Time(s) 260±5(solder temp) 10±1 Temperature Number of ramp/immersion heat cycles and emersion rate 25mm/s ±6 mm/s 1 Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 15±1min(Inductor) Step2：125±2℃ within 20Sec. Step3：125±2℃ 15±1min Number of cycles： 300 Measured at room fempraturc after placing fo24±2hrs Appearance：No damage. a. Method B, 4 hrs @155°C dry heat @235°C±5°C b. Method B @ 215°C±5°C category 3.(8hours ± 15 min) c. Method D category 3. (8hours ± 15 min)@ 260°C±°C Preheat: 150℃,60sec. More than 95% of the terminal electrode should be covered with Solder: Sn96.5% Ag3% Cu0. 5% solder。 Temperature: 245±5℃。 Flux for lead free: Rosin. 9.5%。 Dip time: 4±1sec. Depth: completely cover the termination Refer Specification for Approval Summary to show Min, Max, Mean and Standard deviation . Electrical Test not required. V-0 or V-1 are acceptable. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Place the 100mm X 40mm board into a fixture similar to the one shown in below Figure with the component facing down. The apparatus shall consist of mechanical means to apply a force which will bend the board (D) x = 2 mm minimum. The duration of the applied forces shall be 60 (+ 5) sec. The force is to be applied only once to the board. Board Flex Appearance：No damage Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles With the component mounted on a PCB with the device to be tested, apply a 17.7 N (1.8 Kg) force to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to apply a shock to the component being tested. Terminal Strength(SMD) Appearance：No damage Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours of recovery under the standard condition. TAI-TECH P6 8. Soldering and Mounting (1) Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. TAI-TECH terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. (2) Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. (3) Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧ Preheat circuit and products to 150℃ ‧ 355℃ tip temperature (max) ‧ Never contact the ceramic with the iron tip ‧ 1.0mm tip diameter (max) ‧ Use a 20 watt soldering iron with tip diameter of 1.0mm ‧ Limit soldering time to 4~5sec. Reflow Soldering PRE-HEATING SOLDERING Iron Soldering NATURAL COOLING PRE-HEATING 217 200 150 60~150s 60~180s TEMPERATURE(¢X C) TEMPERATURE(¢X C) tp(245¢X C / 20~40s.) SOLDERING within 4~5s TP(260 ℃ / 10s max.) 350 150 Gradual cooling Over 60s 480s max. NATURAL COOLING 25 TIME( sec.) Reflow times: 3 times max. Fig.1 TIM E(sec.) Iron Soldering times: 1 times max. Fig.2 TAI-TECH P7 9. Packaging Information (1) Reel Dimension COVER TAPE Type A(mm) B(mm) C(mm) D(mm) 13”x16mm 16.4+2/-0 100±2 13+0.5/-0.2 330 C B D 2.0∮0.5 A EMBOSSED CARRIER (2) Tape Dimension Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) W(mm) F(mm) TMPC 0603 7.7±0.1 7.0±0.1 3.3±0.1 12.0±0.1 16±0.3 7.5±0.1 t(mm) D(mm) 0.35±0.05 1.5±0.1 (3) Packaging Quantity TMPC 0603 Chip / Reel 1000 Inner box 2000 Carton 8000 (4) Tearing Off Force F Top cover tape The force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions(referenced ANSI/EIA-481-D-2008 of 4.11 stadnard). 165¢Xto180¢X Base tape Room Temp. (℃) Room Humidity (%) Room atm (hPa) Tearing Speed mm/min 5~35 45~85 860~1060 300 Application Notice ‧ Storage Conditions To maintain the solderability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧ Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. TAI-TECH 10. Typical Performance Curves P8 TAI-TECH P9 TAI-TECH P 10