TAI-TECH
SMD Power Inductor
TMPA1004S-Series(N)-D
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
18/04/17
新發行
羅宜春
梁周虎
卜文娟
備
注
TAI-TECH
SMD Power Inductor
TMPA1004S-Series(N)-D
1. Features
1. Shielded construction.
2. Capable of corresponding high frequency .
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
Halogen
Pb
Halogen-free
Pb-free
6. 100% Lead(Pb)-Free and RoHS compliant.
2. Applications
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
3. Dimensions
C
2R2
1537
D
E
B
A
A`
T
leadframe
Pattern
D
1R0
1537
H
L
E
B
Customer Recommend PC Board
C
A
A`
G
T
non-leadframe
Series
A
A`
B
C
D
T
E
TMPA1004 11.0±0.3 10.0±0.3 10.0±0.3 3.8±0.2 2.0±0.3 0~0.2
Inductance
2.5±0.3 0.56~1.50uH among
3.0±0.3 0.47uH and below
1.80uH and above
Unit:mm
4. Part Numbering
TMPA
1004
S
A
B
C
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: Code
-
1R0
MN
D
E
-
D
F
BxC
Standard.
R10=0.1uh,1R0=1.0uh,100=10uh,101=100uh,102=1000uh.
K=±10%,L=±15%,M=±20%,N=±25%,Y=±30%
Marking: Black.1R0 and 1537(15 YY, 37 WW,follow production date).
L(mm)
G(mm)
H(mm)
12.5
5.4
3.5
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
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5. Specification
Heat Rating
Current DC
I rms.(A)
Saturation
Current DC
I sat. (A)
Part Number
Inductance
L0 A(uH)
±20%
Typ
Max
Typ
Max
TMPA1004S-R15YN-D
0.15±30%
44.0
38.0
82.0
75.0
TMPA1004S-R22MN-D
0.22
36.0
33.0
70.0
60.0
TMPA1004S-R36MN-D
0.36
33.0
29.0
51.0
45.0
TMPA1004S-R42MN-D
0.42
32.5
28.5
50.0
TMPA1004S-R47MN-D
0.47
32.0
28.0
46.0
TMPA1004S-R56MN-D
0.56
25.0
23.0
TMPA1004S-R68MN-D
0.68
23.0
20.0
TMPA1004S-1R0MN-D
1.00
20.0
TMPA1004S-1R5MN-D
1.50
17.5
TMPA1004S-1R8MN-D
1.80
TMPA1004S-2R0MN-D
2.00
TMPA1004S-2R2MN-D
TMPA1004S-3R3MN-D
DCR
(mΩ)Typ
DCR
(mΩ)Max
Type
0.5
0.6
non-leadframe
0.72
0.83
non-leadframe
1.05
1.18
non-leadframe
42.0
1.15
1.3
non-leadframe
40.0
1.3
1.5
non-leadframe
34.0
29.0
1.6
1.8
non-leadframe
31.0
28.0
1.9
2.2
non-leadframe
18.0
29.0
26.0
2.9
3.25
non-leadframe
16.0
26.0
22.0
3.7
4.2
non-leadframe
16.5
15.0
23.0
20.5
5.1
5.7
leadframe
16.0
14.5
21.0
18.0
5.3
6.1
leadframe
2.20
15.0
13.0
20.0
16.0
5.8
6.7
leadframe
3.30
11.0
10.0
17.5
14.0
10.5
11.8
leadframe
TMPA1004S-4R7MN-D
4.70
8.8
8.0
15.2
13.0
15.8
19
leadframe
TMPA1004S-5R6MN-D
5.60
8.0
7.2
14.1
11.5
19
22.8
leadframe
TMPA1004S-6R8MN-D
6.80
7.8
6.8
12.2
11.0
22
24.5
leadframe
TMPA1004S-8R2MN-D
8.20
7.6
6.5
9.5
8.5
25
28
leadframe
TMPA1004S-100MN-D
10.0
7.5
6.1
8.6
7.5
27
30
leadframe
TMPA1004S-150MN-D
15.0
6.25
5.0
7.0
6.0
41
45
leadframe
TMPA1004S-220MN-D
22.0
5.0
4.1
6.2
5.5
58
66
leadframe
TMPA1004S-330MN-D
33.0
4.4
3.5
5.5
5.0
84
91
leadframe
TMPA1004S-470MN-D
47.0
3.5
3.0
4.0
3.7
125
143
leadframe
TMPA1004S-680MN-D
68.0
2.6
2.4
3.2
3.0
184
210
leadframe
TMPA1004S-820MN-D
82.0
2.3
2.1
3.0
2.8
240
270
leadframe
TMPA1004S-101MN-D
100
2.0
1.8
2.7
2.4
270
310
leadframe
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
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6. Material List
4
3
2
1
NO
Items
NO
Items
1
Core
Alloy Powder .
Materials
1
Core
Alloy Powder .
Wire
Polyester Wire or equivalent.
2
Wire
Polyester Wire or equivalent.
2
3
Clip
100% Pb free solder(Ni+Sn---Plating)
3
4
Ink
Halogen-free ketone
4
Materials
Solder 100% Pb free solder
Ink
Halogen-free ketone
7. Reliability and Test Condition
Item
Performance
Operating temperature
-40~+125℃ (Including self - temperature rise)
Storage temperature
1. -10~+40℃,50~60%RH (Product without taping)
2. -40~+125℃(on board)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation Current (Isat)
Approximately △L30%.
Saturation DC Current (Isat) will cause L0
to drop △L(%)
Heat Rated Current (Irms)
Approximately △T40℃
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃).
1.Applied the allowed DC current
2.Temperature measured by digital surface thermometer
Reliability Test
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Temperature: 125±2℃(Inductor)
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs.
Life Test
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Humidity:85±2﹪R.H,
Temperature:85℃±2℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs.
Load Humidity
Moisture Resistance
Thermal shock
Vibration
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
1. Baked at50℃ for 25hrs, measured at room temperature after
placing for 4 hrs.
2. Raise temperature to 65 ± 2 ℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65 ± 2 ℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25 ℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Condition for 1 cycle
Step1:-40±2℃ 30±5min
Step2:25±2℃ ≦0.5min
Step3:125±2℃ 30±5minNumber of cycles: 500
Measured at room fempraturc after placing for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Oscillation Frequency: 10~2K~10Hz for 20 minutes
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
TAI-TECH
Item
Performance
Bending
Shock
Solder ability
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
More than 95% of the terminal electrode should
be covered with solder。
Test Condition
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805 inch(2012mm):40x100x1.2mm
=0805 inch(2012mm):1.2mm
0805:1kg ,
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