TMPA1265SP-680MN-D

TAI-TECH SMD Power Inductor TMPA1265SP-Series(N)-D ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 18/06/20 新發行 羅宜春 梁周虎 許靜 備 注 TAI-TECH SMD Power Inductor TMPA1265SP-Series(N)-D 1. Features 1. Shielded construction. 2. Capable of corresponding high frequency . 3. Low loss realized with low DCR. 4. High performance (Isat) realized by metal dust core. 5. Ultra low buzz noise, due to composite construction. Halogen Pb Halogen-free Pb-free 6. 100% Lead(Pb)-Free and RoHS compliant. 2. Applications 1. DC/DC converters in distributed power systems. 2. DC/DC converter for Field Programmable Gate Array(FPGA). 3. Battery powered devices. 4. Thin type on-board power supply module for exchanger. 5. VRM for server. 6. High current, low profile POL converters. 7. PDA/notebook/desktop/server and battery powered devices. 3. Dimensions C A A` E B 100 1536 D leadframe C A A` L H E R22 1536 B Recommend PC Board Pattern D G non-leadframe Series A A` B C D E TMPA1265 13.5±0.5 12.6±0.3 12.6±0.2 6.2±0.3 2.3±0.3 Inductance 4.0±0.3 0.68~1.50uH among 4.7±0.3 0.33uH and below 1.80uH and above Unit:mm 4. Part Numbering TMPA 1265 SP A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: Code - 100 MN D E - D F BxC. Standard. R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh. K=±10%，L=±15%，M=±20%，N=±25%，Y=±30% Marking: Black.100 and 1536(15 YY, 36 WW,follow production date). L(mm) G(mm) H(mm) 14.5 8.0 5.0 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.15mm and above. TAI-TECH 5. Specification Heat Rating Current DC ( A ) Irms. Saturation Current DC (A)I sat Part Number Inductance L0 A(uH) ±20% DCR (mΩ) Typ DCR (mΩ) Max Type Typ Max Typ Max TMPA1265SP-R10YN-D 0.10±30% 65 60 120 115 0.2 0.25 non-leadframe TMPA1265SP-R22MN-D 0.22 53 42 TMPA1265SP-R33MN-D 0.33 46 36 112 105 0.4 0.46 non-leadframe 75 65 0.6 0.7 non-leadframe TMPA1265SP-R68MN-D 0.68 36.5 TMPA1265SP-1R0MN-D 1.00 33 33 55 46 1.25 1.5 non-leadframe 29 45 36 1.5 1.8 TMPA1265SP-1R5MN-D 1.50 non-leadframe 29 25 35 30 2.2 2.53 non-leadframe TMPA1265SP-1R8MN-D TMPA1265SP-2R2MN-D 1.80 27 23 31 27 3.2 3.6 leadframe 2.20 25 21 28.5 24 3.7 4.2 leadframe TMPA1265SP-2R7MN-D 2.70 24 20 27.5 23 4.2 5.0 leadframe TMPA1265SP-3R3MN-D 3.30 22 19 27 22.5 5.3 6.2 leadframe TMPA1265SP-4R7MN-D 4.70 20 17 25 21 6.8 8.0 leadframe TMPA1265SP-5R6MN-D 5.60 18 15 23 19.5 8.3 9.8 leadframe TMPA1265SP-6R8MN-D 6.80 16.5 14 21 18 9.8 11.3 leadframe TMPA1265SP-8R2MN-D 8.20 15 12.5 19 17 12 13.8 leadframe TMPA1265SP-100MN-D 10.0 13 11 17 15 13 15.8 leadframe TMPA1265SP-150MN-D 15.0 11 9.5 13.5 12 22 26 leadframe TMPA1265SP-220MN-D 22.0 10 8 10 9 31 35 leadframe TMPA1265SP-270MN-D 27.0 9.5 7.2 9.0 8.0 36 45 leadframe TMPA1265SP-330MN-D 33.0 9.0 6.5 9.0 8.0 46 55 leadframe TMPA1265SP-470MN-D 47.0 8.0 5.7 7.6 6.8 58 67 leadframe TMPA1265SP-680MN-D 68.0 5.8 4.8 6.0 5.0 82 100 leadframe TMPA1265SP-820MN-D 82.0 5.0 4.0 5.0 4.2 110 132 leadframe TMPA1265SP-101MN-D 100 5.0 3.8 5.0 4.0 140 161 leadframe Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH 6. Material List 4 3 2 1 NO Items NO Items 1 Core Alloy Powder . Materials 1 Core Alloy Powder . Wire Polyester Wire or equivalent. 2 Wire Polyester Wire or equivalent. 2 3 Clip 100% Pb free solder(Ni+Sn---Plating) 3 4 Ink Halogen-free ketone 4 Materials Solder 100% Pb free solder Ink Halogen-free ketone 7. Reliability and Test Condition Item Performance Test Condition -40~+125℃ (Including self - temperature rise) 1. -10~+40℃,50~60%RH (Product with taping) 2. -40~+125℃(on board) Operating temperature Storage temperature Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Approximately △L30%. Saturation DC Current (Isat) will cause L0 to drop △L(%) Heat Rated Current (Irms) Approximately △T40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃). 1.Applied the allowed DC current 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Temperature： 125±2℃(Inductor) Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs. Life Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Humidity：85±2﹪R.H, Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs. Load Humidity Moisture Resistance Thermal shock Vibration Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65 ± 2 ℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65 ± 2 ℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25 ℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Condition for 1 cycle Step1：-40±2℃ 30±5min Step2：25±2℃ ≦0.5min Step3：125±2℃ 30±5minNumber of cycles： 500 Measured at room fempraturc after placing for 24±2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Oscillation Frequency: 10～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 TAI-TECH Item Performance Bending Shock Solder ability Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value More than 95% of the terminal electrode should be covered with solder。 Test Condition Shall be mounted on a FR4 substrate of the following dimensions: >=0805 inch(2012mm):40x100x1.2mm =0805 inch(2012mm):1.2mm 0805:1kg ,