Technical Data 10295
Effective September 2017
Supersedes August 2014
HCM1707
High current power inductors
Applications
•
•
•
•
•
•
•
Voltage Regulator Module (VRM)
Multi-phase regulators
Point-of-load modules
Desktop and server VRMs and EVRDs
Data networking and storage systems
Base station equipment
Battery power systems
Environmental Data
Product features
•
•
•
•
•
•
•
High current carrying capacity
Magnetically shielded, low EMI
Frequency range up to 1 MHz
Inductance range from 1.5 µH to 68 µH
Current range from 5.2 A to 40 A
17.5 mm x17.2 mm footprint surface mount
package in a 7.0 mm height
Iron powder core material
•
Storage temperature range (Component):
-40 °C to +125 °C
•
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
•
Solder reflow temperature:
J-STD-020 (latest revision) compliant
Pb HF
FREE
HALOGEN
HCM1707
High current power inductors
Technical Data 10295
Effective September 2017
Product Specifications
Part Number6
OCL1
±20%
(µH)
FLL min.2
(µH)
Irms3
(A)
Isat4
(A)
DCR (mΩ)
@ +20 °C
(typical)
K-factor5
HCM1707-1R5-R
1.5
0.96
40
40
1.85
2.15
124
HCM1707-2R2-R
2.2
1.41
37
34
2.15
2.50
103
HCM1707-4R7-R
4.7
3.01
27
24
4.12
4.72
76
HCM1707-6R8-R
6.8
4.35
20
22
6.55
7.55
60
HCM1707-8R2-R
8.2
5.25
16
20
8.10
8.70
55
HCM1707-100-R
10
6.40
14
18
9.30
10
47
HCM1707-150-R
15
9.60
12
13
14.5
15.5
43
HCM1707-220-R
22
14.1
9.5
11
21
23
37
HCM1707-330-R
33
21.1
9.0
10
35
37
28
HCM1707-470-R
47
30.1
6.8
7.5
41
47
25
HCM1707-680-R
68
43.5
5.2
6.5
74
85
20
1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc,
+25 °C.
2. Full Load Inductance (FLL): Test parameters: 100 kHz, 0.25 Vrms, Isat, +25 °C.
3. Irms: DC current for an approximate temperature rise of 40 °C without core
loss. Derating is necessary for AC currents. PCB layout, trace thickness and
width, air-flow, and proximity of other heat generating components will affect
the temperature rise. It is recommended that the temperature of the part not
exceed +125 °C under worst case operating conditions verified in the end
application.
4..
5. K-factor: Used to determine B p-p for core loss (see graph). Bp-p = K * L * ∆I.
Bp-p :(Gauss), K: (K-factor from table), L: (Inductance in μH), ∆I (Peak to peak
ripple current in amps).
6. Part Number Definition: HCM1707-yyy-R
- HCM1707 = Product code and siz
yyy= Inductance value in uH, R = decimal point
if no R is present then third character = number of zeros.
- “-R” suffix = RoHS compliant
: Peak current for approximately 20% rolloff at +25 °C.
sat
Dimensions - mm
a
b
DCR measured between point “a” and point “b”
2
DCR (mΩ)
@ +20 °C
(maximum)
www.eaton.com/electronics
All soldering surfaces coplanar within 0.10 millimeters.
Part marking: HCM1707; XXX = initial inductance in µH, R = decimal point;
if no R is present, last digit equals number of zeros.
wwllyy = date code, R = revision level
Color: Grey.
Do not route traces or vias underneath the inductor
HCM1707
High current power inductors
Technical Data 10295
Effective September 2017
Packaging information - mm
Supplied in tape and reel packaging, 350 parts per 13” diameter reel.
Temperature rise vs. total loss
50
Temperature Rise (˚C)
40
30
20
10
0
0.0
0.5
1.0
1.5
Total Loss ( W)
2.0
2.5
www.eaton.com/electronics
3
HCM1707
High current power inductors
Technical Data 10295
Effective September 2017
Core loss vs. Bp-p
10000.0
500K
300K
200K
100K
50K
25K
Core Loss (mW)
1000.0
100.0
10.0
1.0
100
10000
1000
Bp-p (Gauss)
Inductance characteristics
HCM1707-2R2-R
110%
110%
100%
100%
90%
90%
% of OCL
% of OCL
HCM1707-1R5-R
80%
70%
60%
70%
60%
50%
50%
40%
0
10
20
30
Idc (A)
4
80%
www.eaton.com/electronics
40
50
60
70
40%
0
10
20
30
Idc (A)
40
50
60
70
HCM1707
High current power inductors
Technical Data 10295
Effective September 2017
Inductance characteristics
HCM1707-6R8-R
110%
110%
100%
100%
90%
90%
% of OCL
% of OCL
HCM1707-4R7-R
80%
70%
80%
70%
60%
60%
50%
50%
40%
40%
0
5
10
15
20
25
30
0
35
5
10
Idc (A)
110%
110%
100%
100%
90%
90%
% of OCL
% of OCL
20
25
30
20
25
30
HCM1707-100-R
HCM1707-8R2-R
80%
70%
80%
70%
60%
60%
50%
50%
40%
40%
0
5
10
15
20
25
0
30
5
10
HCM1707-220-R
HCM1707-150-R
110%
100%
100%
90%
90%
% of OCL
110%
80%
70%
80%
70%
60%
60%
50%
50%
40%
0
2
4
6
40%
8
10
Idc (A)
15
Idc (A)
Idc (A)
% of OCL
15
Idc (A)
12
14
16
18
20
0
2
4
6
8
10
12
14
16
18
20
Idc (A)
www.eaton.com/electronics
5
HCM1707
High current power inductors
Technical Data 10295
Effective September 2017
Inductance characteristics
HCM1707-470-R
110%
110%
100%
100%
90%
90%
% of OCL
% of OCL
HCM1707-330-R
80%
70%
60%
50%
50%
0
6
4
2
8
40%
10
12
14
16
18
HCM1707-680-R
110%
100%
90%
80%
70%
60%
50%
40%
0
2
4
6
Idc (A)
www.eaton.com/electronics
0
2
4
6
Idc (A)
Idc (A)
% of OCL
70%
60%
40%
6
80%
8
10
12
14
8
10
12
14
Technical Data 10295
HCM1707
High current power inductors
Effective September 2017
Solder Reflow Profile
TP
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Temperature
TL
25°C
Preheat
A
T smax
t
TC -5°C
Table 1 - Standard SnPb Solder (T c)
Volume
mm3
220°C
220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Tsmin
ts
Package
Thickness
2.5mm
Time 25°C to Peak
Volume
mm3
2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020
Profile Feature
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
150°C
200°C
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 10295 BU-SB14600
September 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
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