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P1
SMD Power Inductor
TMPV0603SV-Series(N)-D
1. Features
1. Low loss realized with low DCR.
2. High performance realized by metal dust core.
3. Ultra low buzz noise, due to composite construction.
Halogen
4. 100% Lead(Pb)-Free and RoHS compliant.
5. High reliability -Reliability test complied to AEC-Q200.
Halogen-free
2. Applications
Automotive applications.
3. Dimensions
Series
Recommend PC Board Pattern
A(mm) A1(mm) B(mm)
TMPV0603SV 7.1±0.3
6.6±0.2
6.6±0.2
C(mm)
D(mm) D1(mm) E(mm)
E1(mm)
2.8±0.2
1.6±0.3
4.3±0.3
1R0
M
N
D
E
F
1.8±0.3
3.0±0.2
4. Part Numbering
TMPV
0603
SV
A
B
C
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F、G: Code
-
-
L(mm)
G(mm)
H(mm)
8.4
2.7
3.4
Note: 1.PCB layout is referred to standard IPC-7351B
2. The above PCB layout reference only.
3. Recommend solder paste thickness at
0.15mm and above.
D
G
BxC
Standard.
1R0=1.0uh
K=±10%,L=±15%,M=±20%,N=±25%,Y=±30%
Marking direction cannot decide polarity.
Marking: Black.1R0 and 2019 (20:YY,19:WW, follow production date).
5. Specification
Part Number
Inductance
L0 A(uH)
±20%
TMPV0603SV-R47MN-D
0.47
TMPV0603SV-1R0MN-D
1.00
TMPV0603SV-1R5MN-D
Heat Rating
Current DC
※ Irms( A )
Saturation
Current DC
I sat ( A )
DCR
(mΩ)
Typ
DCR
(mΩ)
Max
19.0
19.0
3.4
3.74
14.0
14.0
6.0
6.6
1.50
11.5
13.0
10.6
11.7
TMPV0603SV-2R2MN-D
2.20
9.0
10.5
15.0
16.5
TMPV0603SV-3R3MN-D
3.30
7.8
9.5
22.0
24.2
TMPV0603SV-4R7MN-D
4.70
6.4
7.2
29.0
32.0
TMPV0603SV-6R8MN-D
6.80
5.2
6.1
42.0
46.2
TMPV0603SV-8R2MN-D
8.20
4.8
5.6
49.0
54.0
TMPV0603SV-100MN-D
10.0
4.2
4.7
63.0
69.3
TMPV0603SV-150MN-D
15.0
3.7
4.0
100.0
110.0
TMPV0603SV-220MN-D
22.0
2.9
3.0
150.0
165.0
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : Agilent 4284A,E4991A,4339B,KEYSIGHT E4980A/AL,chroma3302,3250,16502.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 165℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
※
7. Irms Testing : Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
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6. Typical Performance Curves
P2
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