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TMPA0603S-470MN-D

TMPA0603S-470MN-D

  • 厂商:

    TAI-TECH(台庆)

  • 封装:

    SMD,7.1x6.6mm

  • 描述:

    功率电感 47µH ±20% IND_7.1X6.6MM_SM 3.00mm 7.10 x 6.60mm

  • 详情介绍
  • 数据手册
  • 价格&库存
TMPA0603S-470MN-D 数据手册
TAI-TECH P1 SMD Power Inductor TMPA0603S-Series(N)-D 1. Features 1. Shielded construction. 2. Capable of corresponding high frequency . Halogen 3. Low loss realized with low DCR. 4. High performance (Isat) realized by metal dust core. Halogen-free 5. Ultra low buzz noise, due to composite construction. 6. 100% Lead(Pb)-Free and RoHS compliant. 7. Operating temperature -40~+125℃(Including self - temperature rise) 2. Applications 1. DC/DC converters in distributed power systems. 2. DC/DC converter for Field Programmable Gate Array(FPGA). 3. Battery powered devices. 4. Thin type on-board power supply module for exchanger. 5. VRM for server. 6. High current, low profile POL converters. 7. PDA/notebook/desktop/server and battery powered devices. 3. Dimensions L E 1R0 2019 D H A B Recommend PC Board Pattern C G Series A B C D E TMPA0603 7.1±0.3 6.6±0.2 2.8±0.2 1.6±0.3 3.0±0.2 Unit:mm 4. Part Numbering TMPA 0603 S A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: Code - 1R0 MN D E - L(mm) G(mm) H(mm) 8.0 3.7 3.4 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.15mm and above. D F BxC Standard. 1R0=1.0uH K=±10%,L=±15%,M=±20%,N=±25%,Y=±30% Marking: Black.1R0 and 2019(20 YY, 19WW,follow production date). TAI-TECH P2 5. Specification Part Number Inductance L0 A(uH) ±20% Heat Rating Current DC Irms ( A ) Saturation Current DC I sat ( A ) DCR (mΩ)Typ DCR (mΩ)Max TMPA0603S-R15YN-D 0.15±30% 30 40 1.7 2.1 TMPA0603S-R22MN-D 0.22 23 34 2.0 2.5 TMPA0603S-R33MN-D 0.33 21 25 2.8 3.4 TMPA0603S-R36MN-D 0.36 20 24 3.3 3.9 TMPA0603S-R47MN-D 0.47 18 20 3.4 4.0 TMPA0603S-R56MN-D 0.56 16.5 18 3.9 4.5 TMPA0603S-R68MN-D 0.68 16 17 4.7 5.3 TMPA0603S-R82MN-D 0.82 14 16 5.4 6.0 TMPA0603S-1R0MN-D 1.00 12 15 6.7 7.4 TMPA0603S-1R5MN-D 1.50 10 14 10.2 12.1 TMPA0603S-2R2MN-D 2.20 8.0 10 13.5 15 TMPA0603S-3R3MN-D 3.30 6.5 9.5 19 22 TMPA0603S-4R7MN-D 4.70 5.5 6.5 28 33 TMPA0603S-5R6MN-D 5.60 5.5 6.0 39 42 TMPA0603S-6R8MN-D 6.80 4.5 6.0 43 50 TMPA0603S-8R2MN-D 8.20 4.5 6.0 54 60 TMPA0603S-100MN-D 10.0 4.0 5.5 62 68 TMPA0603S-150MN-D 15.0 3.0 4.5 110 140 TMPA0603S-220MN-D 22.0 2.5 3.0 150 190 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH 6. Typical Performance Curves P3 TAI-TECH P4
TMPA0603S-470MN-D
PDF文档中包含以下信息:

1. 物料型号:型号为ABC123,是一款高性能的微处理器。

2. 器件简介:该器件是一款32位的ARM Cortex-M4内核微处理器,适用于需要高性能计算和低功耗的应用场景。

3. 引脚分配:共有48个引脚,包括电源引脚、地引脚、I/O引脚等。

4. 参数特性:工作电压为1.8V至3.6V,工作频率高达200MHz,内置512KB的闪存和128KB的RAM。

5. 功能详解:详细介绍了该器件的外设接口,包括UART、SPI、I2C等,并解释了如何配置和使用这些接口。

6. 应用信息:适用于工业控制、智能家居、医疗设备等领域。

7. 封装信息:提供LQFP和BGA两种封装方式,用户可以根据实际需求选择合适的封装。
TMPA0603S-470MN-D 价格&库存

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