PH1225AL,115

Application Guide Notebook Computing Introduction Your partner for notebook computing Designing notebooks isn’t getting any easier. The footprint continues to shrink, and consumers continue to demand more features, faster speeds, on our decades-long leadership in high-performance mixed-signal solutions, providing continuous innovation for each functional block. We specialize in and lower power consumption. There are always new protocols on the horizon, and even standard feature sets require smart connectivity and smart energy miniature packaging, and always make power efficiency a priority. management. In this guide, you’ll find details on our complete range of notebook offerings, including graphic interfaces, power management, audio systems, ESD protection, system control, memory interfaces, and more. NXP understands all this, and provides world-class solutions specifically created to help designers deliver exceptional notebook systems. We build Why NXP for notebooks? XTechnology and manufacturing expertise in high-performance, mixed-signal technologies (RF, interface, power management, security, digital processing, etc.) XLeadership in discrete and logic solutions XWorld-class process technology and manufacturing capabilities, with largely in-house assembly and test XTrusted supplier with a very broad portfolio 2 Introduction NXP enhances performance throughout the system From mains HDMI DVI HDMI, DP, DVI DisplayPort VGA AC-DC controllers and power discretes NFC CPU central processor unit SDRAM VGA, CVBS, YPbPr CVBS and L/R audio DDR termination regulator YPbPr MCH memory controller hub USB USB and LAN port Ethernet PCIe Graphics card (e)SATA interface HDD SD, MMC Memory cards From cable, satellite or terrestrial antenna RS232, UART interfaces ICH I/O controller hub Audio output functions Tuners, LNAs and IF RF remote control Speakers SPDIF, analog L/R audio Conditional access system interface IC card Headphone Temperature sensor Human interface and signalling Backlight LED drivers and panel/ backlight discretes MCU, I2C, SPI and RTC Discretes RF Power Sensor and Actuator Processing Interface Standard products LCD panel Glue logic brb669 3 Contents 1. High-speed graphics connectivity 1.1 High-bandwidth switches for DisplayPort and PCIe 1.2 HDMI/DVI level shifters 1.3 ESD protection for high-speed graphics interfaces 2. Power management 2.1 CPU/GPU, I/O, memory & power switches 2.2 AC/DC & PFC solutions 2.3 Discretes for power management 3. System management 3.1 Low-power ARM Cortex-M0™ microcontrollers 5 5 8 10 11 11 12 17 28 28 7. Logic 7.1 High- and low-voltage logic families 7.2 AUP, AVC, and LVC voltage translators 7.3 Combination and configurable logic 7.4 Logic packaging 8. Discretes 8.1 BISS transistors, load switches, and RETs 8.2 Matched-pair transistors 8.3 Constant current source 9. Memory solutions 9.1 Thermal sensors 4. Bus expansion 4.1 High-bandwidth switches and HDMI/DVI level shifters (see 1.1 and 1.2) 4.2 General application and low-bandwidth switches 4.3 ESD protection for high-speed interfaces 5. System control 5.1 I2C solutions 6. Audio control 6.1 Low-ohmic analog switches 30 30 30 32 34 34 10. Security 10.1 SmartCard interface 11. Display and camera interfaces 11.1 Display-specific EMI filters Additional resources 41 41 43 44 45 46 46 49 50 51 51 53 53 54 54 56 40 40 4 1. High-speed graphics connectivity  !"#$$%&&'          *+ .      % 1.1 High-bandwidth switches for DisplayPort and PCIe These devices maintain signal integrity by routing signals between single and multiple sources. They lower system power, and they reduce pin- ` Active-mode current 0.2 mA ` Temperature range: -40 to +85 oC ` ESD HBM 8 kV, MM 500 V, CDM 1.25 kV ` HWQFN56 package with two pin outs for easy PCB routing ` Compatible in form, fit, and function with Pericom PI3PCIE2612 count in the core chipset. They also help manage battery life, by letting the system switch between discrete graphics during high-performance operation powered by mains and integrated graphics when using the battery. They deliver excellent performance and are available in costeffective, industry-standard packages. Hex DisplayPort v1.1a and PCIe Gen 1/Gen 2 Muxes CBTL06121/22 Many chipsets use reconfigurable I/O to reduce the pin-count and support a variety of interfaces. The CBTL06121/22 lets the chipset use PCIe and DisplayPort interfaces using the same I/O. It has dedicated channels for Aux and Hot Plug Detect (HPD), and is extremely useful in notebook docking stations, where it can enable two DisplayPort connections to the chipset. The device can also be used to switch between discrete and integrated graphics, to save battery power. Features ` CBTL06121A/B: Gen1 PCIe @ 2.5 Gb/s, v1.1a DisplayPort @ 2.7 Gb/s ` CBTL06122A/B: Gen2 PCIe @ 5.0 Gb/s, v1.1a DisplayPort @ 2.7 Gb/s ` 1:2 switching/multiplexing of DisplayPort or PCIe signals ` 4 high-speed differential channels ` 1 channel for HPD ` 1 channel for differential AUX or single-ended DDC ` Selectable passive switching ` Power supply: 3.3 V ±10% 5 1. High-speed graphics connectivity Hex DisplayPort v1.1a/1.2 Mux CBTL06DP211/12 Designed using NXP’s proprietary high-bandwidth pass-gate technology, these devices perform 1:2 switching or 2:1 multiplexing of four highspeed differential AC-coupled DP channels. They support switching/ multiplexing of Hot Plug Detect (HPD) signals as well as Auxiliary (AUX) and Display Data Channel (DDC) signals, and can be used with GPUs/ CPUs that have dedicated AUX and DDC I/O. Features ` CBTL06DP211: v1.1a DisplayPort @ 2.7 Gb/s, Gen1 PCI3 @ 2.5 Gb/s ` CBTL06DP212: v1.2 DisplayPort @ 5.4 Gb/s, Gen2 PCI3 @ 5.0 Gb/s ` 1:2 switching or 2:1 multiplexing of DisplayPort or PCIe signals - 4 high-speed differential channels with 2:1 multiplexing for DisplayPort main link signals or PCIe signals - 1 channel with 2:1 multiplexing for single-ended HPD signals - 1 channel with 4:1 multiplexing for differential AUX or single-ended DDC ` Selectable passive switching ` Power supply: 3.3 V ±10% ` Active-mode current 0.2 mA ` Temperature range: -40 to +85 oC ` ESD HBM 8 kV, ESD CDM 1 kV ` TFBGA (5 x 5 mm, 0.5 mm pitch) and HWQFN56 (11 x 5 mm, 0.5 mm pitch) packages 6 High-speed graphics connectivity USB 3.0/LVDS/PCIe Gen2/DisplayPort switch CBTU04082 A high-speed, general-purpose mux/demux with 5.0 Gb/s bandwidth. Four different channels to support a number of interfaces, including $#&%##:#&%!#"! LVDS, USB 3.0, DisplayPort, and PCIe. Features ` 4 differential channel, 2:1 multiplexer/de-multiplexer ` USB 3.0/PCI Express Gen2 performance: 5.0 Gb/s ` Low intra-pair skew: 7 ps maximum (between positive and negative bits) ` Low crosstalk: -23 dB at 3 GHz ` Low off-isolation: -23 dB at 3 GHz ` VDD operating range: 1.8 V ±10% ` ESD tolerance: 6 kV HBM I/O; 1 kV CDM ` Low inter-pair skew: 35 ps maximum ` Compatible in fit, form, and function with PI2PCIE2412 ` HVQFN42 package (3.5 x 9 mm, 0.5 mm pitch)   .9  .9 01 04 51 54 61 64 71 74 81 84 01 04 51 54 61 64 71 74 81 84 *  1. 7 1. High-speed graphics connectivity 1.2 HDMI/DVI level shifters These devices provide HDMI and DVI connectivity on the motherboard. To support various platforms, there are options for inverting and non- ` Active power 35 mA typical ` ESD 8 kV HBM ` HVQFN48 package (7 x 7 mm) inverting Hot Plug Detect (HPD). Enhanced performance DisplayPort to HDMI/DVI level shifters PTN3360A/B These devices can communicate directly with the graphics chipset via the DisplayPort interface, so the system can have HDMI or DVI outputs. The PTN3360A has an inverting Hot Plug Detect (HPD) level-shifter and is suitable for use with Intel’s Montevina platform. The PTN3360B has a non-inverting level-shifting HPD for use with platforms such as the Intel Calpella and later platforms. Features ` PTN3360A: Inverting 1.1 V level-shifting HPD ` PTN3360B: Non-inverting 1.1 V level-shifting HPD ` Inputs - 4 pairs of low-swing AC-coupled differential for TX from display source to sink with integrated 50-ohm termination resistors and bias voltage - 1 HPD from display HPD_Sink to GMCH HPD_Source - 1 pair for DDC (I2C clock and data) ` Outputs - 4 pairs of TMDS outputs: up to 2.5 Gb/s per lane - 1 pair for DDC level shifter - Power supply: 3.3 V ±10% 8 1. High-speed graphics connectivity Enhanced performance DisplayPort level shifter with HDMI/DVI deep color support PTN3360D This device can interface directly with the graphics chipset via the DisplayPort interface, and allows the system to have an HDMI output with support for “deep color”. Features ` Inputs - 4 pairs of low-swing AC-coupled differential for TX from display source to sink with integrated 50 Ω termination resistors and bias voltage - 1 HPD from display HPD_Sink to GMCH HPD_Source - 1 pair for DDC (I2C SCL and SDA) ` Outputs - 4 pairs of TMDS outputs - up to 2.5 Gb/s per lane - Supports 36-bit HDMI deep color mode - 1 pair for DDC level shifter / buffer ` Programmable equalizer ` Non-inverting level-shifting HPD ` Power supply: 3.3 V ±10% ` Active power 35 mA typical ` ESD 6 kV HBM ` HVQFN48 package (7 x 7 mm) 9 1. High-speed graphics connectivity 1.3 ESD protection for high-speed graphics interfaces ESD pulses are a major cause of damage and malfunction. NXP offers a variety of devices that deliver outstanding protection against ESD and other voltage-induced transient pulses. Part number Description IP4283 ESD protection for ultra-high-speed interfaces, including HDMI, DVI, DisplayPort, eSata, and LVDS IP4776 Fully integrated DVI and HDMI host-interface protection, with level shifting for DDS channels and backdrive protection for HDMI, plus high-level ESD protection diodes for TMDS signal lines IP4777/78 Fully integrated DVI and HDMI host-interface protection, with DDC buffering and decoupling, hot-plug detect, backdrive protection, CEC slew-rate control, and high-level ESD protection diodes for TDMS lines IP4786 A signal-conditioning and ESD protection device designed to enhance the stability of HDMI transmission and minimize the  trace impedance of the TMDS lines PESD5V0X1B An ultra-low-capacitance, bidirectional ESD protection diode for use with one signal line. Supports DisplayPort HDMI, DVI IP4776 IP4777/78 IP4283 IP4786 Display port IP4283 PESD5VOX1B 10 #ŝŶĚŝĐĂƚŽƌ For notebook system control, our I2C and SMBus portfolio includes an industry-leading selection of peripherals that enable a variety of - Push-pull or open-drain outputs - True bidirectional operation functions. There are general-purpose I/O (GPIO) for bus expansion, bus buffers for support of extra devices, level translators for bus-voltage ` Outputs can drive LEDs directly translation, temperature sensors for thermal management, LED drivers for LED control, and ADC/DACs for analog and audio control. - 100 mA (max) capacity per 8-bit register ` Active low open-drain interrupt output activates when input changes state ` Low standby current: IDD K'/ Logic 7. ŝƐĐƌĞƚĞƐ Features and functions Features and functions Increasing speed LV LVC AUP ALVC LVT ALVT ` 9 ns performance ` 4 ns performance ` 4 ns performance ` 2 ns performance ` 2 ns performance ` 1.5 ns performance ` 8 mA drive ` -24/24 mA drive ` -4/4 mA static drive ` -24/24 mA drive ` -32/64 mA drive ` -32/64 mA drive ` 20 μA standby current ` 20 μA standby current ` 0.9 μA standby current ` 40 μA standby current ` 120-190 μA standby current ` 90 μA standby current ` VCC: 1-3.6 V* ` VCC: 1.2-3.6 V ` Cpd 4.5 pF ` VCC: 1.2-3.6 V ` VCC: 2.7-3.6 V ` VCC: 2.3-3.6 V ` Gate, MSI, buffer functions ` 5 V tolerant I/O’s ` Gate, bus interface functions ` 5 V tolerant I/O’s** ` 5 V tolerant I/O’s ` 5 V tolerant I/O’s ` SO, SSOP, TSSOP ` Live insertion ` Optimized for 1.8 V ` Bus hold option ` Live insertion ` Live insertion ` Multi-sourced ` Bus hold option ` VCC: 0.8-3.6 V ` Termination resistor option ` Built-in Bus hold ` Built-in Bus hold ` Termination resistor option ` 3.6 V tolerant I/O’s ` Bus interface functions ` Termination resistor option ` Termination resistor option ` Gates, MSI, bus interface func- ` PicoGate and MicroPak ` Multi-sourced ` Gates, bus interface functions ` Bus interface functions tions ` Multi-sourced ` SO, VSSOP, TSSOP, BGA, DQFN ` SO, SSOP, BGA, TSSOP, DQFN ` SSOP, TSSOP, BGA ` Multi-sourced ` Replaced ULP ` Replaces VCX ` Multi-sourced ` Multi-sourced Function available = 57 Function available = 54 Function available = 44 Function available = 23 ` SO, TSSOP, PicoGate, DQFN ` MicroPak ` Replaces LCX Function available = 46 Function available = 137 * LV: some functions can operate up to 5.5 V ** ALVC: only non-bus hold types are 5 V input tolerant 42 7. Logic 7.2 AUP, AVC, and LVC voltage translators These devices are ideally suited for use in bus-interface circuits. Features ` Wide operating voltage (0.8 to 5.5 V) ` High speed (2 ns typical) ` High output current capability (up to 50 mA) ` Over-voltage (> VCC) tolerant inputs and outputs ` Lowest power consumption ` Live insertion ` Bus hold ` Standby / suspend mode ` TTL-compatible inputs ` Configurable logic functions ` Pb-free, RoHS and Dark Green compliant ` TSSOP, PicoGate and MicroPak packages 43 7. Logic 7.3 Combination and configurable logic For greater design flexibility and simpler inventory management, we offer configurable logic functions, which let a single device perform many different operations, and combination logic, which combines several logic functions into a single package. The 74AUP1T58, for example, provides low-power, low-voltage configurable logic gate functions. Its output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XOR, inverter or buffer, and all inputs can be connected to VCC or Ground. Features ` Very low dynamic power dissipation (CPD) ` Wide VCC range (0.8 to 3.6 V) ` Schmitt-trigger inputs provide high noise immunity ` Superior ESD protection ` Wide operating temperature range (-40 to +125 °C) ` Tpd of 3.2 ns and IOL of 2.2 mA at 1.8 V VCC ` Available in single- and dual-gate formats ` Picogate and MicroPak packaging 44 7. Logic 7.4 Logic packaging Features ` Optimized to address critical design issues: - Miniaturization, for board-space savings Our MicroPak and MicroPak II packages are the world’s smallest packages for single-, dual- and triple-gate logic. They are 65 to 74% smaller than their PicoGate equivalents, and offer a larger pad size that provides a more rugged and more reliable bond between the device and the PC board. Logic products housed in these packages make it simple to implement last-minute changes while minimizing the impact on board layouts. With an ASIC design, for example, the designer can fine-tune performance without re-spinning silicon, since it’s easy to add discrete logic functions like gates or inverters. & > &   #  - ASIC fixes and glue logic, for faster time-to-market - Simpler PCB routing, for more cost-effective designs - ASIC output drive, for reduced ASIC chip size - Voltage translation, for interfacing between 1.2 and 3.3 V GV 2.8 x 2.9 x 1.0 GW 2.0 x 2.0 x 1.0 GF 1.0 x 1.0 x 0.5 GM 1.0 x 1.5 x 0.5 GS 1.0 x 1.0 x 0.35 GN 1.0 x 0.9 x 0.35 *     $!!"   @JKQW !!" ?=$  #        '( * 1(: %&'(  )      >   >    45 8. >K'/ Discretes ŝƐĐƌĞƚĞƐ Our notebook portfolio includes discretes in complex package options for common functions, such as load switching, current sourcing, and optimized BISS transistors for improved thermal performance. 8.1 BISS transistors, load switches & RETs NXP’s Breakthrough in Small Signal (BISS) technology optimizes transistor and load-switch performance. BISS transistors PBSSxxxxx These transistors use an innovative mesh-emitter technology to improve upon the well-known bipolar device structure. This allows for an improvement in saturation voltage loss and an up-to-65% reduction in heat compared to standard transistors. Features ` Very low collector-emitter saturation voltage VCE(sat) ` Benchmark for reduced on-state resistance in small-signal SMD packages ` Highest collector current capability IC ` AECQ-101 qualified ` Exceptionally low losses when switching loads ` Very high current gain ` Space-saving solutions through integration of RETs and low-VCE(sat) transistor ` Low “threshold” voltage (  %%$&  51 9. Memory solutions Local and remote I2C/SMBus temperature sensor SA56004 This device is optimized for system thermal management and for monitoring die temperature. Features ` On-chip local thermal diode or remote transistor diode connected ` Temperature sensing within ±1 ˚C ` Offset register available for adjusting the remote temperature accuracy ` Programmable under/over temperature alarms: ALERT and T_CRIT ` SMBus 2.0 compatible interface, supports TIMEOUT and 100 / 400 kHz I2C-bus interface ` Can support up to 8 devices on the same I2C-bus ` 11-bit ADC temperature resolution of 0.125 ˚C ` Power supply range from 3.0 to 5.5 V ` Temperature range from -40 to +125 ˚C ` The SA56004-ED/EDH is address compatible with National LM86, MAX6657/8 and ADM1032 ` Small 8-pin package types: SO8, TSSOP8, and HVSON8 52 %!&' ^ĞĐƵƌŝƚLJ 10. Security ^ SmartCards that implement pre-booth authentication add an extra layer of protection, making it tougher for unauthorized users to gain ` Three protected half-duplex bidirectional buffered I/O lines (C4, C7, access to the system. Before the operating system loads, the user must have a pre-formatted SmartCard, in addition to a power-on ` Thermal and short-circuit protection for all card contacts password, to use the computer. This level of protection is useful in a range of applications, including logical access control, eGovernment, circuit, card take-off, overheating, falling VDD, VDD(INTF), or VDDP ` Enhanced card-side ESD protection of >6 kV ` External clock input up to 26 MHz connected to pin XTAL1 ` Non-inverted control of pin RST using pin RSTIN ` Compatible with ISO 7816, NDS, and EMV 4.2 payment systems ` Built-in debouncing on card presence contacts (typically 8 ms) on-line banking, eCommerce, and systems that use easy pairing for configuration. 10.1 SmartCard interface TDA8034HN and C8) ` Automatic activation/deactivation sequences triggered by a short- The TDA8034HN is a cost-effective analog interface for asynchronous and synchronous SmartCards operating at 5, 3, or 1.8 V. Using few external components, the TDA8034HN provides all supply, protection, and control functions between a SmartCard and the microcontroller. Features ` HVQFN24 package ` 5, 3, or 1.8 V smart card supply ` Very low power consumption in Deep Shutdown mode   . $QDORJ )URQW(QG  7'$ 53 %!&' ^ĞĐƵƌŝƚLJ 11. Display and camera interfaces ^ Our display-specific EMI filters support all the relevant 2G, 3G, WLAN, and Bluetooth frequencies. Available as cost-efficient RC filters or optimized LC filters for interfaces with high clock rates, these products deliver superior filter performance and robust ESD protection at the lowest clamping voltages, and are housed in space-saving leadless and CSP packages. NXP’s robust ESD solutions protect all kinds of portable applications over their full lifetimes, and are backed by a complete in-house production flow for added supply reliability. For applications that use 18- or 24-bit screens to display video data, our video serializer/deserializer (serdes) solutions are an elegant, low-power way to save space, reduce power, and simplify design-in. Used to replace a cumbersome parallel link, these devices transfer data via serial differential signals. The result is 24-bit color rendering on an 18-bit display, with fewer wires and lower EMI. 11.1 Display-specific EMI filters Features ` Up to 30 dB insertion loss at mobile-phone frequencies of 800 MHz to 3 GHz ` High ESD protection exceeding IEC 61000-4-2 level 4 ` Low ESD clamping voltage ` Available in 1-, 2-, 4-, 6- or 8-channel formats ` Ultra-thin dark green leadless package in 0.4 mm pitch Benefits ` Reduced component count ` Reduced board space ` Easy routing 1.35 x 2.5 x 0.45 mm 6-channel 1.35 x 1.7 x 0.45 mm 4-channel 1.35 x 3.3 x 0.45 mm 8-channel Read more www.nxp.com/acrobat_download2/literature/9397/75016798.pdf Example of the extremely low ESD clamping voltage (ESD pulse of ±8 V IEC 61000-4-2. level 4) RC-based EMI filters IP425xCZx family for cost-efficient protection These 30 dB EMI filters offer up to 30 kV IEC contact ESD protection in leadless packages. Their RC structure assures excellent ESD pulse transient response and protects sensitive system chips. 54 11. Display and camera interfaces EMI filters in plastic packages Package Number of channels IP4251CZ16-8 /CZ12-6/CZ8-4 IP4252CZ16-8 /CZ12-6/CZ8-4 IP4253CZ16-8 /CZ12-6/CZ8-4 IP4254CZ16-8 /CZ12-6/CZ8-4 UTLP SOT983/984/985 UTLP SOT983/984/985 UTLP SOT983/984/985 UTLP SOT983/984/985 IP4256CZ3-M IP4256CZ5-W IP4256CZ6-F SOT883 SOT665 SOT886 4, 6, 8 4, 6, 8 4, 6, 8 4, 6, 8 1 2 2 Width (mm) 1.35 1.35 1.35 1.35 0.6 1.2 1 Length (mm) 1.7, 2.5, 3.3 1.7, 2.5, 3.3 1.7, 2.5, 3.3 1.7, 2.5, 3.3 1 1.6 1.45 Maximum height (mm) 0.5 0.5 0.5 0.5 0.5 0.6 0.5 Channel resistance (Ω, typ) 100 40 200 100 100 100 100 Line capacitance (pF @ 0.0 V, typ) 15 18 45 45 30 30 30 Line capacitance (pF @ 2.5 V, typ) 10 12 30 30 19 19 19 ESD IEC61000-4-2 (kV contact, typ) 15 15 30 30 25 25 25 Robustness at ESD level 4 (1000 shots, IEC61000-4-2) yes yes yes yes yes yes yes 55 Additional resources The listed web pages provide access to additional information about NXP and its product lines. Application notes www.nxp.com/all_appnotes Datasheets (all released products and product families) www.nxp.com/all_datasheets Interactive selection guides www.nxp.com/selectionguides/all-selectionguides.html Sales literature (product leaflets, brochures) www.nxp.com/all_literature X-reference tool (search tool for NXP website, for use offline) www.nxp.com/search/advanced NXP Chinese website (simplified characters) www.cn.nxp.com NXP Chinese website (traditional characters) www.tw.nxp.com 56 57 www.nxp.com © 2011 NXP Semiconductors N.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document Date of release: September 2011 does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the Document order number: 9397 750 17134 publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in the Netherlands Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Nexperia: PH1730AL,115 PH5030AL,115 PH9030AL,115