MP2-150-R

Technical Data 4108 Effective October 2017 Supersedes March 2007 MP2 MICRO-PAC™ Low profile toroid power inductors Applications • • • PC cards, mobile phones Disk drives GPS systems il t n u r o 6 A 1 2 0 P 2 , M 5 2 w e t i y e l v e Ju e re h s e a ts. iv leas t t a c d e .P n f f e 8 E 1 m d SD , e e d t c e e nd a l l u p p n i e e t a r d n ) s e o 2 i t c 1 a y s i 1 r n 4 lter o D t ( n t e hee a v s n i a s ) a 1 dat -431 (PM • Environmental data SMD Device • • Product features • • • • High performance, ferrite-based, low profile,surface mount inductors Small footprint and closed magnetic field construction allow for low EMI Low DCR and high efficiency Ferrite core material • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant  Technical Data 4108 Effective October 2017 Product specifications Part Number MP2-R47-R MP2-1R0-R MP2-1R5-R MP2-2R2-R MP2-3R3-R MP2-4R7-R MP2-6R8-R MP2-100-R MP2-150-R MP2-220-R MP2-330-R MP2-470-R Inductance µH OCL (1) µH ± 20% 0.47 1.0 1.5 2.2 3.3 4.7 6.8 10.0 15.0 22.0 33.0 47.0 0.40 1.02 1.59 2.29 3.58 4.60 7.02 9.95 15.30 21.80 33.70 46.40 Irms (2) Amperes (Typ.) 2.02 1.67 1.51 1.39 1.25 1.18 1.06 0.98 0.88 0.80 0.64 0.52 Isat (3) Amperes (Typ.) 3.40 2.10 1.70 1.40 1.10 1.00 0.80 0.68 0.54 0.45 0.37 0.31 DCR (4) Ohms (Max.) 0.075 0.103 0.118 0.130 0.156 0.180 0.202 0.240 0.300 0.360 0.556 0.833 Q (5) (Typ.) 10 20 25 32 42 46 46 55 65 65 65 65 SRF MHz (Typ.) 300 160 155 150 140 130 110 100 60 45 35 28 il t n u r o 6 A 1 2 0 P 2 , M 5 2 w e t i y e l v e Ju e re h s e a ts. iv leas t t a c d e .P n f f e 8 E 1 m d SD , e e d t c yww exxx ple nd a l u p n i e e t a r d n ) s e o 2 i t c 1 a y s i 1 r n 4 lter o D t ( n t e hee a v s n i a s ) a 1 dat -431 (PM 4) Values @ 20° C 5) Measured @ 300KHz 1) Open Circuit Inductance Test Parameters: 100kHz, 0.250 Vrms, 0.0 Adc 2) RMS current, delta temp. of 40° C ambient temperature of 85° C 3) Peak current for approximately 30% roll-off Dimensions- mm 1.05 5.2 max. 5.88 7.50 max 1.8 max. 5.40 7.50 2.00 yww = Date Code xxx = Inductance value per family chart Do not route traces or vias underneath the inductor Inductance characteristics OCL vs. Isat 120 % of (OCL) 100 80 60 40 20 0 0 40 80 % of Isat 2 www.eaton.com/electronics 1 MP2 MICRO-PAC™ Low profile toroid power inductors Technical Data 4108 Effective October 2017 Solder Reflow Profile TP tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t TC -5°C Table 1 - Standard SnPb Solder (Tc) Volume mm3 220°C 220°C il t n u r o 6 A 1 2 0 P 2 , M 5 2 w e t i y e l v e Ju e re h s e a ts. iv leas t t a c d e .P n f f e 8 E 1 m d SD , e e d t c e e nd a l l u p p n i e e t a r d n ) s e o 2 i t c 1 a y s i 1 r n 4 lter o D t ( n t e hee a v s n i a s ) a 1 dat -431 (PM 25°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin ts Package Thickness 2.5mm Time 25°C to Peak Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4108 October 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.