SS32A THRU SS320A
3.0 A Surface Mount Schottky Barrier
Rectifiers - 20V-200V
Features
Package outline
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Metal silicon junction,majority carrier conduction
Low power loss,high efficiency
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
250 C/10 seconds at terminals
Compliant to RoHS Directive 2011/65/EU
SMA/DO-214AC
0.108(2.75)
0.096(2.45)
0.067 (1.70)
0.051 (1.30)
0.177(4.50)
0.157(3.99)
0.012(0.305)
0.006(0.152)
Mechanical data
0.096(2.42)
0.078(1.98)
Case: JEDEC DO-214AC molded plastic body
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
0.060(1.52)
0.030(0.76)
0.008(0.203)MAX.
0.208(5.28)
0.188(4.80)
Dimensions in inches and (millimeters)
Maximum ratings and Electrical Characteristics (AT
T A=25 oC unless otherwise noted)
SYMBOLS SS32A SS33A SS34A SS35A SS36A SS38A SS310A SS315A SS320A UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at TL(see fig.1)
Peak forward surge current
8.3ms single half sine-wave superimposed on
rated load
Maximum instantaneous forward voltage at 3.0A
Maximum DC reverse current
TA=25 C
at rated DC blocking voltage
TA=100 C
Typical junction capacitance (NOTE 1)
Typical thermal resistance (NOTE 2)
Operating junction temperature range
Storage temperature range
VRRM
VRMS
VDC
20
14
20
30
21
30
40
28
40
50
35
50
60
42
60
80
56
80
100
70
100
150
200
105
150
140
200
V
V
V
I(AV)
3.0
A
IFSM
80.0
A
VF
0.85
0.95
0.1
0.5
10.0
IR
CJ
RθJA
TJ,
TSTG
0.70
0.55
5.0
450
70
-55 to +125
-55 to +150
-55 to +150
2.0
V
mA
pF
C/W
C
C
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.P.C.B. mounted with 2.0x2.0”(5.0x5.0cm) copper pad areas
www.fuxinsemi.com
Page 1
Ver2.1
SS32A THRU SS320A
3.0 A Surface Mount Schottky Barrier
Rectifiers - 20V-200V
FIG. 1- FORWARD CURRENT DERATING CURVE
3.0
2.4
Single Phase
Half Wave 60Hz
Resistive or
inductive Load
1.8
P.C.B mounted on
0.2*0.2"(5.0*5.0mm)
copper pad areas
1.2
SS32A-SS345A
SS35A-SS320A
0.6
0
0
25
50
75
100
125
150
FIG. 2-MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
PEAK FORWARD SURGE CURRENT,
AMPERES
AVERAGE FORWARD RECTIFIED CURRENT,
AMPERES
Rating and characteristic curves
100
80
60
40
20
175
0
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
1
10
LEAD TEMPERATURE, C
NUMBER OF CYCLES AT 60 Hz
50
INSTANTANEOUS FORWARD
CURRENT,AMPERES
TJ=25 C
10.0
1
SS32A-SS345A
SS35A-SS36A
SS38A-SS310A
SS315A-SS320A
FIG. 4-TYPICAL REVERSE CHARACTERISTICS
INSTANTANEOUS REVERSE CURRENT,
MILLIAMPERES
FIG. 3-TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
0.1
100
10
TJ=100 C
1
TJ=75 C
0.1
0.01
TJ=25 C
0.001
0.2
0.4
0.6
0.8
1.0
1.2
1.4
20
40
60
80
100
1.6
INSTANTANEOUS FORWARD VOLEAGE,
VOLTS
FIG. 5-TYPICAL JUNCTION CAPACITANCE
JUNCTION CAPACITANCE, pF
0
PERCENT OF PEAK REVERSE VOLTAGE,%
0
2000
1000
TJ=25 C
100
SS32A-SS345A
SS35A-SS320A
TRANSIENT THERMAL IMPEDANCE,
C/W
0.01
100
FIG. 6-TYPICAL TRANSIENT THERMAL IMPEDANCE
100
10
1
0.1
0.01
0.1
1
10
100
10
0.1
1.0
10
100
REVERSE VOLTAGE,VOLTS
www.fuxinsemi.com
t,PULSE DURATION,sec.
Page 2
Ver2.1
SS32A THRU SS320A
3.0 A Surface Mount Schottky Barrier
Rectifiers - 20V-200V
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Marking
Type number
Marking code
Example
SS32
SS34
SS345
SS35
SS36
SS38
SS310
SS315
SS320
SS34
SS32A
SS34A
SS345A
SS35A
SS36A
SS38A
SS310A
SS315A
SS320A
Marking code
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
www.fuxinsemi.com
PACKAGE
A
B
C
SMA
0.110 (2.80)
0.063 (1.60)
0.087 (2.20)
Page 3
Ver2.1
SS32A THRU SS320A
3.0 A Surface Mount Schottky Barrier
Rectifiers - 20V-200V
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
o
t25 C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
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