SIT1602BI-23-33N-66.000000

SiT1602B Low Power, Standard Frequency Oscillator Features ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ Applications 52 standard frequencies between 3.57 MHz and 77.76 MHz 100% pin-to-pin drop-in replacement to quartz-based XO Excellent total frequency stability as low as ±20 ppm Operating temperature from -40°C to 85°C. For 125°C and/or -55°C options, refer to SiT1618, SiT8918, SiT8920 Low power consumption of 3.5 mA typical at 1.8 V Qualify just one device with 1.62 V to 3.63 V continuous supply voltage Standby mode for longer battery life Fast startup time of 5 ms LVCMOS/HCMOS compatible output Industry-standard packages: 2.0 x 1.6, 2.5 x 2.0, 3.2 x 2.5, 5.0 x 3.2, 7.0 x 5.0 mm x mm Instant samples with Time Machine II and Field Programmable Oscillators RoHS and REACH compliant, Pb-free, Halogen-free and Antimony-free For AEC-Q100 oscillators, refer to SiT8924 and SiT8925 Ideal for DSC, DVC, DVR, IP CAM, Tablets, e-Books, SSD, GPON, EPON, etc Ideal for high-speed serial protocols such as: USB, SATA, SAS, Firewire, 100M/1G/10G Ethernet, etc. ◼ ◼ Electrical Characteristics All Min and Max limits are specified over temperature and rated operating voltage with 15 pF output load unless otherwise stated. Typical values are at 25°C and nominal supply voltage. Table 1. Electrical Characteristics Parameters Output Frequency Range Symbol f Min. Typ. Max. Condition Unit Frequency Range 52 standard frequencies between MHz 3.57 MHz and 77.76 MHz Refer to Table 13 for the exact list of supported frequencies Frequency Stability and Aging Frequency Stability F_stab -20 – +20 ppm -25 – +25 ppm – +50 ppm -50 Inclusive of initial tolerance at 25°C, 1st year aging at 25°C, and variations over operating temperature, rated power supply voltage and load. Operating Temperature Range Operating Temperature Range T_use -20 – +70 °C Extended Commercial -40 – +85 °C Industrial Supply Voltage and Current Consumption Supply Voltage Options Current Consumption 1.62 1.8 1.98 V Vdd_2.5 2.25 2.5 2.75 V Vdd_2.8 2.52 2.8 3.08 V Vdd_3.0 2.7 3.0 3.3 V Vdd_3.3 2.97 3.3 3.63 V Vdd_XX 2.25 – 3.63 V Vdd_YY 1.62 – 3.63 V Idd – 3.8 4.5 mA No load condition, f = 20 MHz, Vdd_2.8, Vdd_3.0, Vdd_3.3, Vdd_XX, Vdd_YY – 3.7 4.2 mA No load condition, f = 20 MHz, Vdd_2.5 – 3.5 4.1 mA No load condition, f = 20 MHz, Vdd_1.8 – – 4.2 mA Vdd_2.5, Vdd_2.8, Vdd_3.0, Vdd_3.3, Vdd_XX, Vdd_YY. OE = GND, Output in high-Z state – – 4.0 mA Vdd_1.8. OE = GND, Output in high-Z state – 2.6 4.3 A ST = GND, Vdd_2.8, Vdd_3.0, Vdd_3.3, Vdd_XX, Vdd_YY. Output is weakly pulled down – 1.4 2.5 A ST = GND, Vdd_2.5, Output is weakly pulled down – 0.6 1.3 A ST = GND, Vdd_1.8, Output is weakly pulled down OE Disable Current I_OD Standby Current I_std Rev 1.07 Contact SiTime for 1.5 V support Vdd_1.8 10 March 2021 www.sitime.com SiT1602B Low Power, Standard Frequency Oscillator Table 1. Electrical Characteristics (continued) Parameters Symbol Min. Typ. Max. Unit Condition LVCMOS Output Characteristics DC 45 – 55 % All Vdds. See Duty Cycle definition in Figure 3 and Footnote 6 Tr, Tf – 1 2 ns 20% - 80% Vdd_2.5, Vdd_2.8, Vdd_3.0, Vdd_3.3 – 1.3 2.5 ns 20% - 80% Vdd_1.8 – – 2 ns 20% - 80% Vdd_XX – – 2.7 ns 20% - 80% Vdd_YY Duty Cycle Rise/Fall Time Output High Voltage VOH 90% – – Vdd IOH = -4 mA (Vdd_3.0 and Vdd_3.3) IOH = -3 mA (Vdd_2.8 and Vdd_ 2.5) IOH = -2 mA (Vdd_1.8) Output Low Voltage VOL – – 10% Vdd IOH = -4 mA (Vdd_3.0 and Vdd_3.3) IOH = -3 mA (Vdd_2.8 and Vdd_ 2.5) IOH = -2 mA (Vdd_1.8) Input High Voltage VIH 70% – – Vdd Pin 1, OE or ST Input Low Voltage VIL – – 30% Vdd Pin 1, OE or ST Input Pull-up Impedance Z_in 50 87 150 k Pin 1, OE logic high or logic low, or ST logic high 2 – – M Pin 1, ST logic low Input Characteristics Startup and Resume Timing T_start – – 5 ms Measured from the time Vdd reaches its rated minimum value T_oe – – 138 ns T_resume – – 5 ms f = 77.76 MHz. For other frequencies, T_oe = 100 ns + 3*cycles Measured from the time ST pin crosses 50% threshold Startup Time Enable/Disable Time Resume Time Jitter RMS Period Jitter T_jitt Peak-to-peak Period Jitter T_pk RMS Phase Jitter (random) T_phj – 1.8 3 ps – – 3.3 ps – 12 25 ps – 14 30 ps – 0.5 0.9 ps – 1.3 2 ps – – 1.4 ps – – 2.3 ps f = 75 MHz, Vdd_1.8, Vdd_2.5, Vdd_2.8, Vdd_3.0, Vdd_3.3, Vdd_XX, f = 75 MHz, Vdd_YY f = 75 MHz, Vdd_2.5, Vdd_2.8, Vdd_3.0, Vdd_3.3, Vdd_XX, Vdd_YY f = 75 MHz, Vdd_1.8 f = 75 MHz, Integration bandwidth = 900 kHz to 7.5 MHz. Vdd_1.8, Vdd_2.5, Vdd_2.8, Vdd_3.0, Vdd_3.3, Vdd_XX f = 75 MHz, Integration bandwidth = 12 kHz to 20 MHz. Vdd_1.8, Vdd_2.5, Vdd_2.8, Vdd_3.0, Vdd_3.3, Vdd_XX f = 75 MHz, Integration bandwidth = 900 kHz to 7.5 MHz. Vdd_YY f = 75 MHz, Integration bandwidth = 12 kHz to 20 MHz. Vdd_YY Table 2. Pin Description Pin Symbol Functionality Output Enable OE/ST ̅ ̅ ̅ /NC 1 Standby H[1]: specified frequency output L: output is low (weak pull down). Device goes to sleep mode. Supply current reduces to I_std. 2 GND Power Any voltage between 0 and Vdd or Open[1]: Specified frequency output. Pin 1 has no function. Electrical ground 3 OUT Output Oscillator output 4 VDD Power Power supply voltage[2] No Connect Top View H[1]: specified frequency output L: output is high impedance. Only output driver is disabled. OE/ST ̅ ̅ ̅ /NC VDD GND OUT Figure 1. Pin Assignments Notes: 1. In OE or ST ̅ ̅ ̅ mode, a pull-up resistor of 10 kΩ or less is recommended if pin 1 is not externally driven. If pin 1 needs to be left floating, use the NC option. 2. A capacitor of value 0.1 µF or higher between Vdd and GND is required. Rev 1.07 Page 2 of 18 www.sitime.com SiT1602B Low Power, Standard Frequency Oscillator Table 3. Absolute Maximum Limits Attempted operation outside the absolute maximum ratings may cause permanent damage to the part. Actual performance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings. Min. Max. Unit Storage Temperature Parameter -65 150 °C Vdd -0.5 4 V Electrostatic Discharge – 2000 V Soldering Temperature (follow standard Pb free soldering guidelines) – 260 °C Junction Temperature[3] – 150 °C Note: 3. Exceeding this temperature for extended period of time may damage the device. Table 4. Thermal Consideration[4] Package JA, 4 Layer Board JA, 2 Layer Board JC, Bottom 7050 142 273 30 5032 97 199 24 3225 109 212 27 2520 117 222 26 2016 152 252 36 (°C/W) (°C/W) (°C/W) Note: 4. Refer to JESD51 for JA and JC definitions, and reference layout used to determine the JA and JC values in the above table. Table 5. Maximum Operating Junction Temperature[5] Max Operating Temperature (ambient) Maximum Operating Junction Temperature 70°C 80°C 85°C 95°C Note: 5. Datasheet specifications are not guaranteed if junction temperature exceeds the maximum operating junction temperature. Table 6. Environmental Compliance Parameter Condition/Test Method Mechanical Shock MIL-STD-883F, Method 2002 Mechanical Vibration MIL-STD-883F, Method 2007 Temperature Cycle JESD22, Method A104 Solderability MIL-STD-883F, Method 2003 Moisture Sensitivity Level MSL1 @ 260°C Rev 1.07 Page 3 of 18 www.sitime.com SiT1602B Low Power, Standard Frequency Oscillator Test Circuit and Waveform[6] Vdd Vout 4 Power Supply Test Point tr 3 80% Vdd 50% 15pF (including probe and fixture capacitance) 0.1 uF 2 1 tf 20% Vdd High Pulse (TH) Low Pulse (TL) Period Vdd OE/ST Function 1 kΩ Figure 3. Waveform Figure 2. Test Circuit Note: 6. Duty Cycle is computed as Duty Cycle = TH/Period. Timing Diagrams 90% Vdd Vdd Vdd 50% Vdd Pin 4 Voltage T_start [7] No Glitch during start up T_resume ST Voltage CLK Output CLK Output HZ HZ T_start: Time to start from power-off T_resume: Time to resume from ST Figure 4. Startup Timing (OE/ ST ̅ ̅ ̅ Mode) Figure 5. Standby Resume Timing ( ST ̅ ̅ ̅ Mode Only) Vdd Vdd 50% Vdd OE Voltage OE Voltage T_oe 50% Vdd T_oe CLK Output CLK Output HZ HZ T_oe: Time to re-enable the clock output T_oe: Time to put the output in High Z mode Figure 6. OE Enable Timing (OE Mode Only) Note: 7. Rev 1.07 Figure 7. OE Disable Timing (OE Mode Only) SiT1602 has “no runt” pulses and “no glitch” output during startup or resume. Page 4 of 18 www.sitime.com SiT1602B Low Power, Standard Frequency Oscillator Performance Plots[8] 1.8 2.5 2.8 3.0 3.3 5.2 5.0 20 4.8 15 Frequency (ppm) 4.6 Idd (mA) 4.4 4.2 4.0 3.8 3.6 DUT1 DUT2 DUT3 DUT4 DUT5 DUT6 DUT7 DUT8 DUT9 DUT10 10 5 0 -5 -10 3.4 -15 3.2 -20 3.0 10 20 30 40 50 60 70 -40 80 Figure 8. Idd vs Frequency -20 0 40 60 80 Figure 9. Frequency vs Temperature 1.8 V 2.5 V 2.8 V 3.0 V 3.3 V 55 4.0 54 3.5 53 3.0 Duty cycle (%) RMS period jitter (ps) 20 2.5 2.0 1.5 1.0 52 51 50 49 48 47 0.5 46 0.0 10 20 30 40 50 60 70 45 80 10 Figure 10. RMS Period Jitter vs Frequency 2.5 V 2.8 V 3.0 V 3.3 V 1.8 V 2.5 2.5 2.0 2.0 1.5 1.0 40 50 60 70 80 2.5 V 2.8 V 3.0 V 3.3 V 1.5 1.0 0.5 0.5 0.0 0.0 -40 -15 10 35 60 -40 85 Figure 12. 20%-80% Rise Time vs Temperature Rev 1.07 30 Figure 11. Duty Cycle vs Frequency Fall time (ns) Rise time (ns) 1.8 V 20 -15 10 35 60 85 Figure 13. 20%-80% Fall Time vs Temperature Page 5 of 18 www.sitime.com SiT1602B Low Power, Standard Frequency Oscillator Performance Plots[8] (continued) 2.5 V 2.8 V 3.0 V 1.8 V 3.3 V 0.9 1.8 0.8 1.6 0.7 IPJ (ps) IPJ (ps) 1.8 V 2.0 1.4 2.5 V 2.8 V 3.0 V 3.3 V 0.6 0.5 1.2 0.4 1.0 10 20 30 40 50 60 70 10 80 Figure 14. RMS Integrated Phase Jitter Random (12 kHz to 20 MHz) vs Frequency[9] 20 30 40 50 60 70 80 Figure 15. RMS Integrated Phase Jitter Random (900 kHz to 20 MHz) vs Frequency[9] Notes: 8. All plots are measured with 15 pF load at room temperature, unless otherwise stated. 9. Phase noise plots are measured with Agilent E5052B signal source analyzer. Integration range is up to 5 MHz for carrier frequencies below 40 MHz. Rev 1.07 Page 6 of 18 www.sitime.com SiT1602B Low Power, Standard Frequency Oscillator Programmable Drive Strength High Output Load Capability The SiT1602 includes a programmable drive strength feature to provide a simple, flexible tool to optimize the clock rise/fall time for specific applications. Benefits from the programmable drive strength feature are: ◼ Improves system radiated electromagnetic interference (EMI) by slowing down the clock rise/fall time The rise/fall time of the input clock varies as a function of the actual capacitive load the clock drives. At any given drive strength, the rise/fall time becomes slower as the output load increases. As an example, for a 3.3 V SiT1602 device with default drive strength setting, the typical rise/fall time is 1 ns for 15 pF output load. The typical rise/fall time slows down to 2.6 ns when the output load increases to 45 pF. One can choose to speed up the rise/fall time to 1.83 ns by then increasing the drive strength setting on the SiT1602. ◼ Improves the downstream clock receiver’s (RX) jitter by decreasing (speeding up) the clock rise/fall time. ◼ Ability to drive large capacitive loads while maintaining full swing with sharp edge rates. For more detailed information about rise/fall time control and drive strength selection, see the SiTime Application Notes section. EMI Reduction by Slowing Rise/Fall Time SiT1602 Drive Strength Selection Figure 16 shows the harmonic power reduction as the rise/fall times are increased (slowed down). The rise/fall times are expressed as a ratio of the clock period. For the ratio of 0.05, the signal is very close to a square wave. For the ratio of 0.45, the rise/fall times are very close to neartriangular waveform. These results, for example, show that the 11th clock harmonic can be reduced by 35 dB if the rise/fall edge is increased from 5% of the period to 45% of the period. trise=0.05 trise=0.1 trise=0.15 trise=0.2 trise=0.25 trise=0.3 trise=0.35 trise=0.4 trise=0.45 10 Harmonic amplitude (dB) 0 -10 -20 -30 Tables 7 through 11 define the rise/fall time for a given capacitive load and supply voltage. 1. Select the table that matches the SiT1602 nominal supply voltage (1.8 V, 2.5 V, 2.8 V, 3.0 V, 3.3 V). 2. Select the capacitive load column that matches the application requirement (5 pF to 60 pF) 3. Under the capacitive load column, select the desired rise/fall times. 4. The left-most column represents the part number code for the corresponding drive strength. 5. Add the drive strength code to the part number for ordering purposes. Calculating Maximum Frequency -40 -50 -60 -70 -80 The SiT1602 can support up to 60 pF or higher in maximum capacitive loads with drive strength settings. Refer to the Rise/Fall Time Tables (Table 7 to 11) to determine the proper drive strength for the desired combination of output load vs. rise/fall time. 1 3 5 7 9 11 Any given rise/fall time in Table 7 through 11 dictates the maximum frequency under which the oscillator can operate with guaranteed full output swing over the entire operating temperature range. This max frequency can be calculated as the following: Harmonic number Max Frequency = Figure 16. Harmonic EMI reduction as a Function of Slower Rise/Fall Time 1 5 x Trf_20/80 where Trf_20/80 is the typical value for 20%-80% rise/fall time. Jitter Reduction with Faster Rise/Fall Time Power supply noise can be a source of jitter for the downstream chipset. One way to reduce this jitter is to speed up the rise/fall time of the input clock. Some chipsets may also require faster rise/fall time in order to reduce their sensitivity to this type of jitter. Refer to the Rise/Fall Time Tables (Table 7 to Table 11) to determine the proper drive strength. Example 1 Calculate fMAX for the following condition: ◼ Vdd = 1.8 V (Table 7) ◼ Capacitive Load: 30 pF ◼ Desired Tr/f time = 3 ns (rise/fall time part number code = E) ◼ fMAX = 66.666660 Part number for the above example: SiT1602BIE12-18E-66.666660 Drive strength code is inserted here. Default setting is “-” Rev 1.07 Page 7 of 18 www.sitime.com SiT1602B Low Power, Standard Frequency Oscillator Rise/Fall Time (20% to 80%) vs CLOAD Tables Table 8. Vdd = 2.5 V (Vdd_2.5) Rise/Fall Times for Specific CLOAD Table 7. Vdd = 1.8 V (Vdd_1.8) Rise/Fall Times for Specific CLOAD Rise/Fall Time Typ (ns) Rise/Fall Time Typ (ns) Drive Strength \ CLOAD 5 pF 15 pF 30 pF 45 pF 60 pF Drive Strength \ CLOAD 5 pF 15 pF 30 pF 45 pF 60 pF L A R B T E U F or "‐": default 6.16 3.19 2.11 1.65 0.93 0.78 0.70 0.65 11.61 6.35 4.31 3.23 1.91 1.66 1.48 1.30 22.00 11.00 7.65 5.79 3.32 2.94 2.64 2.40 31.27 16.01 10.77 8.18 4.66 4.09 3.68 3.35 39.91 21.52 14.47 11.08 6.48 5.74 5.09 4.56 L A R B T E or "‐": default U F 4.13 2.11 1.45 1.09 0.62 8.25 4.27 2.81 2.20 1.28 12.82 7.64 5.16 3.88 2.27 21.45 11.20 7.65 5.86 3.51 27.79 14.49 9.88 7.57 4.45 0.54 0.43 0.34 1.00 0.96 0.88 2.01 1.81 1.64 3.10 2.79 2.54 4.01 3.65 3.32 Table 9. Vdd = 2.8 V (Vdd_2.8) Rise/Fall Times for Specific CLOAD Table 10. Vdd = 3.0 V (Vdd_3.0) Rise/Fall Times for Specific CLOAD Rise/Fall Time Typ (ns) Rise/Fall Time Typ (ns) Drive Strength \ CLOAD L A R B T 5 pF 3.77 1.94 1.29 0.97 0.55 15 pF 7.54 3.90 2.57 2.00 1.12 30 pF 12.28 7.03 4.72 3.54 2.08 45 pF 19.57 10.24 7.01 5.43 3.22 60 pF 25.27 13.34 9.06 6.93 4.08 E or "‐": default U F 0.44 0.34 0.29 1.00 0.88 0.81 1.83 1.64 1.48 2.82 2.52 2.29 3.67 3.30 2.99 Drive Strength \ CLOAD L A R B T or "‐": default E U F 5 pF 3.60 1.84 1.22 0.89 15 pF 7.21 3.71 2.46 1.92 30 pF 11.97 6.72 4.54 3.39 45 pF 18.74 9.86 6.76 5.20 60 pF 24.30 12.68 8.62 6.64 0.51 0.38 0.30 0.27 1.00 0.92 0.83 0.76 1.97 1.72 1.55 1.39 3.07 2.71 2.40 2.16 3.90 3.51 3.13 2.85 Table 11. Vdd = 3.3 V (Vdd_3.3) Rise/Fall Times for Specific CLOAD Rise/Fall Time Typ (ns) Drive Strength \ CLOAD L A R B 5 pF 3.39 1.74 1.16 0.81 15 pF 6.88 3.50 2.33 1.82 30 pF 11.63 6.38 4.29 3.22 45 pF 17.56 8.98 6.04 4.52 60 pF 23.59 12.19 8.34 6.33 T or "‐": default E U F 0.46 0.33 0.28 0.25 1.00 0.87 0.79 0.72 1.86 1.64 1.46 1.31 2.60 2.30 2.05 1.83 3.84 3.35 2.93 2.61 Rev 1.07 Page 8 of 18 www.sitime.com SiT1602B Low Power, Standard Frequency Oscillator Pin 1 Configuration Options (OE, ST ̅ ̅ ̅ , or NC) Pin 1 of the SiT1602 can be factory-programmed to support three modes: Output Enable (OE), standby (ST ̅ ̅ ̅ ) or No Connect (NC). These modes can also be programmed with the Time Machine using field programmable devices. Output Enable (OE) Mode In the OE mode, applying logic Low to the OE pin only disables the output driver and puts it in Hi-Z mode. The core of the device continues to operate normally. Power consumption is reduced due to the inactivity of the output. When the OE pin is pulled High, the output is typically enabled in