ESP32C3 Series
Datasheet
UltraLowPower SoC with RISCV SingleCore CPU
Supporting IEEE 802.11b/g/n (2.4 GHz WiFi) and Bluetooth® 5 (LE)
Including:
ESP32-C3
ESP32-C3FN4
ESP32-C3FH4
ESP32-C3FH4AZ
Version 1.4
Espressif Systems
Copyright © 2023
www.espressif.com
Product Overview
ESP32-C3 series of SoCs is an ultra-low-power and highly-integrated MCU-based solution that supports 2.4
GHz Wi-Fi and Bluetooth® Low Energy (Bluetooth LE). The block diagram of ESP32-C3 is shown below.
Espressif’s ESP32-C3 Wi-Fi + Bluetooth® Low Energy SoC
Wireless MAC and
Baseband
Core System
RISC-V
32-bit
Microprocessor
Wi-Fi MAC
RF
2.4 GHz Balun + Switch
Wi-Fi
Baseband
2.4 GHz Transmitter
Cache
SRAM
Bluetooth LE
Link Controller
2.4 GHz Receiver
JTAG
ROM
Bluetooth LE
Baseband
RF Synthesizer
RTC
Peripherals
SPI0/1
⚙
SPI2
RTC
Memory
I2C
GPIO
RTC GPIO
I2S
UART
eFuse
Controller
PMU
Brownout Detector
Security
TWAI®
⚙
GDMA
LED PWM
RMT
RTC Super Watchdog Timer
DIG ADC
Controller
RTC Watchdog Timer
USB Serial/
JTAG
General-purpose Timers
SHA
⚙
RSA
AES
⚙
RNG
Temperature
Sensor
HMAC ⚙
Main System Watchdog Timers
Secure ⚙
Boot
System Timer
⚙
Digital ⚙
Signature
Flash
Encryption
Modules having power in specific power modes:
Active
Active and Modem-sleep
Active, Modem-sleep, and Light-sleep;
All modes
⚙
optional in Light-sleep
Figure 1: Block Diagram of ESP32C3
Solution Highlights
• A complete WiFi subsystem that complies
• Storage capacities ensured by 400 KB of
with IEEE 802.11b/g/n protocol and supports
SRAM (16 KB for cache) and 384 KB of ROM on
Station mode, SoftAP mode, SoftAP + Station
the chip, and SPI, Dual SPI, Quad SPI, and QPI
mode, and promiscuous mode
interfaces that allow connection to external flash
• A Bluetooth LE subsystem that supports
• Reliable security features ensured by
features of Bluetooth 5 and Bluetooth mesh
– Cryptographic hardware accelerators that
• 32bit RISCV singlecore processor with a
support AES-128/256, Hash, RSA, HMAC,
four-stage pipeline that operates at up to 160
digital signature and secure boot
MHz
– Random number generator
• Stateoftheart power and RF performance
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– Permission control on accessing internal
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• Rich set of peripheral interfaces and GPIOs,
memory, external memory, and peripherals
ideal for various scenarios and complex
– External memory encryption and decryption
applications
Features
WiFi
CPU and Memory
• 32-bit RISC-V single-core processor, up to 160
• IEEE 802.11 b/g/n-compliant
MHz
• Supports 20 MHz, 40 MHz bandwidth in 2.4
• CoreMark® score:
GHz band
– 1 core at 160 MHz: 407.22 CoreMark; 2.55
• 1T1R mode with data rate up to 150 Mbps
CoreMark/MHz
• Wi-Fi Multimedia (WMM)
• 384 KB ROM
• TX/RX A-MPDU, TX/RX A-MSDU
• 400 KB SRAM (16 KB for cache)
• Immediate Block ACK
• 8 KB SRAM in RTC
• Fragmentation and defragmentation
• Embedded flash (see details in Chapter 1
• Transmit opportunity (TXOP)
ESP32-C3 Series Comparison)
• Automatic Beacon monitoring (hardware TSF)
• SPI, Dual SPI, Quad SPI, and QPI interfaces that
allow connection to multiple external flash
• 4 × virtual Wi-Fi interfaces
• Access to flash accelerated by cache
• Simultaneous support for Infrastructure BSS in
Station mode, SoftAP mode, Station + SoftAP
• Supports flash in-Circuit Programming (ICP)
mode, and promiscuous mode
Note that when ESP32-C3 scans in Station mode,
Advanced Peripheral Interfaces
the SoftAP channel will change along with the
Station channel
• 22 or 16 programmable GPIOs
• Antenna diversity
• Digital interfaces:
• 802.11mc FTM
– 3 × SPI
– 2 × UART
– 1 × I2C
– 1 × I2S
Bluetooth
– Remote control peripheral, with 2 transmit
• Bluetooth LE: Bluetooth 5, Bluetooth mesh
channels and 2 receive channels
• High power mode (21 dBm)
– LED PWM controller, with up to 6 channels
• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
– Full-speed USB Serial/JTAG controller
• Advertising extensions
– General DMA controller (GDMA), with 3
• Multiple advertisement sets
transmit channels and 3 receive channels
– 1 × TWAI® controller compatible with ISO
• Channel selection algorithm #2
11898-1 (CAN Specification 2.0)
• Internal co-existence mechanism between Wi-Fi
and Bluetooth to share the same antenna
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• Analog interfaces:
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– 2 × 12-bit SAR ADCs, up to 6 channels
Security
– 1 × temperature sensor
• Secure boot
• Timers:
• Flash encryption
– 2 × 54-bit general-purpose timers
• 4096-bit OTP, up to 1792 bits for use
– 3 × digital watchdog timers
• Cryptographic hardware acceleration:
– 1 × analog watchdog timer
– AES-128/256 (FIPS PUB 197)
– 1 × 52-bit system timer
• Permission Control
• SHA Accelerator (FIPS PUB 180-4)
• RSA Accelerator
• Random Number Generator (RNG)
Low Power Management
• HMAC
• Power Management Unit with four power modes
• Digital signature
Applications (A Nonexhaustive List)
With ultra-low power consumption, ESP32-C3 is an ideal choice for IoT devices in the following areas:
– Wi-Fi speaker
• Smart Home
– Light control
– Logger toys and proximity sensing toys
– Smart button
• Smart Agriculture
– Smart plug
– Smart greenhouse
– Indoor positioning
– Smart irrigation
– Agriculture robot
• Industrial Automation
– Industrial robot
• Retail and Catering
– Mesh network
– POS machines
– Human machine interface (HMI)
– Service robot
– Industrial field bus
• Audio Device
– Internet music players
• Health Care
– Health monitor
– Live streaming devices
– Baby monitor
– Internet radio players
• Consumer Electronics
• Generic Low-power IoT Sensor Hubs
– Smart watch and bracelet
• Generic Low-power IoT Data Loggers
– Over-the-top (OTT) devices
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ESP32-C3 Series Datasheet v1.4
Contents
Contents
Product Overview
2
Solution Highlights
2
Features
3
Applications
4
1 ESP32C3 Series Comparison
9
1.1
ESP32-C3 Series Nomenclature
9
1.2
Comparison
9
2 Pin Definition
10
2.1
Pin Layout
10
2.2
Pin Description
11
2.3
Power Scheme
13
2.4
Strapping Pins
14
3 Functional Description
17
3.1
17
3.2
3.3
3.4
CPU and Memory
3.1.1 CPU
17
3.1.2 Internal Memory
17
3.1.3 External Flash
17
3.1.4 Address Mapping Structure
18
3.1.5 Cache
18
System Clocks
19
3.2.1 CPU Clock
19
3.2.2 RTC Clock
19
Analog Peripherals
19
3.3.1 Analog-to-Digital Converter (ADC)
19
3.3.2 Temperature Sensor
20
Digital Peripherals
20
3.4.1 General Purpose Input / Output Interface (GPIO)
20
3.4.2 Serial Peripheral Interface (SPI)
22
3.4.3 Universal Asynchronous Receiver Transmitter (UART)
23
3.4.4 I2C Interface
23
3.4.5 I2S Interface
24
3.4.6 Remote Control Peripheral
24
3.4.7 LED PWM Controller
24
3.4.8 General DMA Controller
24
3.4.9 USB Serial/JTAG Controller
25
®
3.4.10 TWAI Controller
3.5
25
Radio and Wi-Fi
25
3.5.1 2.4 GHz Receiver
26
3.5.2 2.4 GHz Transmitter
26
3.5.3 Clock Generator
26
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Contents
3.6
3.5.4 Wi-Fi Radio and Baseband
26
3.5.5 Wi-Fi MAC
27
3.5.6 Networking Features
27
Bluetooth LE
27
3.6.1 Bluetooth LE Radio and PHY
27
3.6.2 Bluetooth LE Link Layer Controller
27
3.7
Low Power Management
28
3.8
Timers
28
3.9
3.8.1 General Purpose Timers
28
3.8.2 System Timer
29
3.8.3 Watchdog Timers
29
Cryptographic Hardware Accelerators
30
3.10 Physical Security Features
30
3.11 Peripheral Pin Configurations
30
4 Electrical Characteristics
33
4.1
Absolute Maximum Ratings
33
4.2
Recommended Operating Conditions
33
4.3
VDD_SPI Output Characteristics
33
4.4
DC Characteristics (3.3 V, 25 °C)
34
4.5
ADC Characteristics
34
4.6
Current Consumption
35
4.6.1 RF Current Consumption in Active Mode
35
4.6.2 Current Consumption in Other Modes
35
4.7
Reliability
36
4.8
Wi-Fi Radio
36
4.9
4.8.1 Wi-Fi RF Transmitter (TX) Specifications
37
4.8.2 Wi-Fi RF Receiver (RX) Specifications
37
Bluetooth LE Radio
39
4.9.1 Bluetooth LE RF Transmitter (TX) Specifications
39
4.9.2 Bluetooth LE RF Receiver (RX) Specifications
40
5 Package Information
43
6 Related Documentation and Resources
44
Revision History
45
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ESP32-C3 Series Datasheet v1.4
List of Tables
List of Tables
1
ESP32-C3 Series Comparison
2
Pin Description
11
3
Description of ESP32-C3 Power-up and Reset Timing Parameters
14
4
Strapping Pins
15
5
Parameter Descriptions of Setup and Hold Times for the Strapping Pins
16
6
IO MUX Pin Functions
20
7
Power-Up Glitches on Pins
22
8
Mapping of SPI Signals and Chip Pins
23
9
Connection Between ESP32-C3 and External Flash
23
10
Peripheral Pin Configurations
30
11
Absolute Maximum Ratings
33
12
Recommended Operating Conditions
33
13
VDD_SPI Output Characteristics
33
14
DC Characteristics (3.3 V, 25 °C)
34
15
ADC Characteristics
34
16
ADC Calibration Results
35
17
Current Consumption Depending on RF Modes
35
18
Current Consumption in Modem-sleep Mode
35
19
Current Consumption in Low-Power Modes
36
20
Reliability Qualifications
36
21
Wi-Fi Frequency
36
22
TX Power with Spectral Mask and EVM Meeting 802.11 Standards
37
23
TX EVM Test
37
24
RX Sensitivity
37
25
Maximum RX Level
38
26
RX Adjacent Channel Rejection
38
27
Bluetooth LE Frequency
39
28
Transmitter Characteristics - Bluetooth LE 1 Mbps
39
29
Transmitter Characteristics - Bluetooth LE 2 Mbps
39
30
Transmitter Characteristics - Bluetooth LE 125 Kbps
40
31
Transmitter Characteristics - Bluetooth LE 500 Kbps
40
32
Receiver Characteristics - Bluetooth LE 1 Mbps
41
33
Receiver Characteristics - Bluetooth LE 2 Mbps
41
34
Receiver Characteristics - Bluetooth LE 125 Kbps
42
35
Receiver Characteristics - Bluetooth LE 500 Kbps
42
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ESP32-C3 Series Datasheet v1.4
List of Figures
List of Figures
1
Block Diagram of ESP32-C3
2
2
ESP32-C3 Series Nomenclature
9
3
ESP32-C3 Pin Layout (Top View, Excluding ESP32-C3FH4AZ)
10
4
ESP32-C3FH4AZ Pin Layout (Top View)
11
5
ESP32-C3 Power Scheme
13
6
ESP32-C3 Power-up and Reset Timing
14
7
Setup and Hold Times for the Strapping Pins
15
8
Address Mapping Structure
18
9
QFN32 (5×5 mm) Package
43
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ESP32-C3 Series Datasheet v1.4
1 ESP32-C3 Series Comparison
1. ESP32C3 Series Comparison
1.1 ESP32C3 Series Nomenclature
ESP32-C3
H
F
x
AZ
Other Identification Code
Flash
Flash temperature
H: High temperature
N: Normal temperature
Flash
Chip series
Figure 2: ESP32C3 Series Nomenclature
1.2 Comparison
Table 1: ESP32C3 Series Comparison
Ordering Code
ESP32-C3
1
ESP32-C3FN4
ESP32-C3FH4
ESP32-C3FH4AZ
2
Embedded Flash
Ambient Temperature (°C)
Package (mm)
GPIO No.
—
–40 ∼ 105
QFN32 (5*5)
22
4 MB
–40 ∼ 85
QFN32 (5*5)
22
4 MB
–40 ∼ 105
QFN32 (5*5)
22
4 MB
–40 ∼ 105
QFN32 (5*5)
16
1
ESP32-C3 requires an external SPI flash.
2
For ESP32-C3FH4AZ, SPI0/SPI1 pins for flash connection are not bonded. For details, see Note 7
under Table 2 Pin Description.
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2 Pin Definition
2. Pin Definition
25 GPIO18
26 GPIO19
27 U0RXD
28 U0TXD
29 XTAL_N
30 XTAL_P
31 VDDA
32 VDDA
2.1 Pin Layout
LNA_IN
1
24 SPIQ
VDD3P3
2
23 SPID
VDD3P3
3
22 SPICLK
XTAL_32K_P
4
21 SPICS0
XTAL_32K_N
5
20 SPIWP
GPIO2
6
CHIP_EN
7
GPIO3
8
ESP32-C3
19 SPIHD
18 VDD_SPI
17 VDD3P3_CPU
GPIO10 16
GPIO9 15
GPIO8 14
MTDO 13
MTCK 12
VDD3P3_RTC 11
MTDI 10
MTMS
9
33 GND
Figure 3: ESP32C3 Pin Layout (Top View, Excluding ESP32C3FH4AZ)
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25 GPIO18
26 GPIO19
27 U0RXD
28 U0TXD
29 XTAL_N
30 XTAL_P
31 VDDA
32 VDDA
2 Pin Definition
LNA_IN
1
24 NC
VDD3P3
2
23 NC
VDD3P3
3
22 NC
XTAL_32K_P
4
21 NC
XTAL_32K_N
5
20 NC
GPIO2
6
CHIP_EN
7
GPIO3
8
ESP32-C3FH4AZ
19 NC
18 VDD_SPI
17 VDD3P3_CPU
GPIO10 16
GPIO9 15
GPIO8 14
MTDO 13
MTCK 12
VDD3P3_RTC 11
MTMS
9
MTDI 10
33 GND
Figure 4: ESP32C3FH4AZ Pin Layout (Top View)
2.2 Pin Description
Table 2: Pin Description
Name
No.
Type
Power Domain
Function
LNA_IN
1
I/O
—
RF input and output
VDD3P3
2
PA
—
Analog power supply
VDD3P3
3
PA
—
Analog power supply
XTAL_32K_P
4
I/O/T
VDD3P3_RTC
GPIO0,
ADC1_CH0,
XTAL_32K_P
XTAL_32K_N
5
I/O/T
VDD3P3_RTC
GPIO1,
ADC1_CH1,
XTAL_32K_N
GPIO2
6
I/O/T
VDD3P3_RTC
GPIO2,
ADC1_CH2,
FSPIQ
CHIP_EN
7
I
VDD3P3_RTC
High: on, enables the chip.
Low: off, the chip powers off.
Note: Do not leave the CHIP_EN pin floating.
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2 Pin Definition
Name
No.
Type
Power Domain
GPIO3
8
I/O/T
VDD3P3_RTC
GPIO3,
ADC1_CH3
MTMS
9
I/O/T
VDD3P3_RTC
GPIO4,
ADC1_CH4,
FSPIHD,
MTMS
MTDI
10
I/O/T
VDD3P3_RTC
GPIO5,
ADC2_CH0,
FSPIWP,
MTDI
VDD3P3_RTC
11
PD
—
MTCK
12
I/O/T
VDD3P3_CPU
GPIO6,
FSPICLK,
MTCK
MTDO
13
I/O/T
VDD3P3_CPU
GPIO7,
FSPID,
MTDO
GPIO8
14
I/O/T
VDD3P3_CPU
GPIO8
GPIO9
15
I/O/T
VDD3P3_CPU
GPIO9
GPIO10
16
I/O/T
VDD3P3_CPU
GPIO10,
VDD3P3_CPU
17
PD
—
VDD_SPI
18
I/O/T/PD
VDD3P3_CPU
GPIO11,
output power supply for flash6
SPIHD
19
I/O/T
VDD3P3_CPU
GPIO12,
SPIHD
SPIWP
20
I/O/T
VDD3P3_CPU
GPIO13,
SPIWP
SPICS0
21
I/O/T
VDD3P3_CPU
GPIO14,
SPICS0
SPICLK
22
I/O/T
VDD3P3_CPU
GPIO15,
SPICLK
SPID
23
I/O/T
VDD3P3_CPU
GPIO16,
SPID
SPIQ
24
I/O/T
VDD3P3_CPU
GPIO17,
SPIQ
GPIO18
25
I/O/T
VDD3P3_CPU
GPIO18,
USB_D
GPIO19
26
I/O/T
VDD3P3_CPU
GPIO19,
USB_D+
U0RXD
27
I/O/T
VDD3P3_CPU
GPIO20,
U0RXD
U0TXD
28
I/O/T
VDD3P3_CPU
GPIO21,
U0TXD
XTAL_N
29
—
—
External crystal output
XTAL_P
30
—
—
External crystal input
VDDA
31
PA
—
Analog power supply
VDDA
32
PA
—
Analog power supply
GND
33
G
—
Ground
7
Function
Input power supply for RTC
FSPICS0
Input power supply for CPU IO
1
PA : analog power supply; PD : power supply for RTC IO; I: input; O: output; T: high impedance.
2
Pin functions in bold font are the default pin functions in SPI boot mode.
3
Ports of embedded flash correspond to pins of ESP32-C3FN4 and ESP32-C3FH4 as follows:
• CS# = SPICS0
• IO0/DI = SPID
• IO1/DO = SPIQ
• CLK = SPICLK
• IO2/WP# = SPIWP
• IO3/HOLD# = SPIHD
These pins are not recommended for other uses.
4
For the data port connection between ESP32-C3 and external flash please refer to Section 3.4.2 Serial Peripheral
Interface (SPI).
5
The pin function in this table refers only to some fixed settings and do not cover all cases for signals that can be
input and output through the GPIO matrix. For more information on the GPIO matrix, please refer to Chapter IO
MUX and GPIO Matrix (GPIO, IO_MUX) in ESP32-C3 Technical Reference Manual.
6
By default VDD_SPI is the power supply pin for embedded flash or external flash. It can only be used as GPIO11
only when the chip is connected to an external flash, and this flash is powered by an external power supply.
7
For ESP32-C3FH4AZ, pins within the frame (namely pin 19 ∼ pin 24) are not bonded, and are labelled as ”not
connected”.
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ESP32-C3 Series Datasheet v1.4
2 Pin Definition
2.3 Power Scheme
ESP32-C3 has four input power pins:
• VDDA1
• VDDA2
• VDD3P3_RTC
• VDD3P3_CPU
And one input/output power pin:
• VDD_SPI
VDDA1 and VDDA2 are the input power supply for the analog domain.
When working as an output power supply, VDD_SPI can be powered by VDD3P3_CPU via RSP I (nominal 3.3 V).
VDD_SPI can be powered off via software to minimize the current leakage of flash in Deep-sleep mode.
RTC IO is powered from VDD3P3_RTC.
The RTC domain is powered from Low Power Voltage Regulator, which is powered from VDD3P3_RTC.
The Digital System domain is powered from Digital System Voltage Regulator, which is powered from
VDD3P3_CPU and VDD3P3_RTC at the same time.
Digital IO is powered from VDD3P3_CPU.
The power scheme diagram is shown in Figure 5.
Figure 5: ESP32C3 Power Scheme
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ESP32-C3 Series Datasheet v1.4
2 Pin Definition
Notes on CHIP_EN:
Figure 6 shows the power-up and reset timing of ESP32-C3. Details about the parameters are listed in Table
3.
t0
t1
2.8 V
VDDA,
VDD3P3,
VDD3P3_RTC,
VDD3P3_CPU
VIL_nRST
CHIP_EN
Figure 6: ESP32C3 Powerup and Reset Timing
Table 3: Description of ESP32C3 Powerup and Reset Timing Parameters
Min
Parameter
t0
t1
Description
(µs)
Time between bringing up the VDDA, VDD3P3, VDD3P3_RTC, and
VDD3P3_CPU rails, and activating CHIP_EN
Duration of CHIP_EN signal level < VIL_nRST (refer to its value in
Table 14) to reset the chip
50
50
2.4 Strapping Pins
ESP32-C3 has three strapping pins:
• GPIO2
• GPIO8
• GPIO9
Software can read the values of GPIO2, GPIO8 and GPIO9 from GPIO_STRAPPING field in GPIO_STRAP_REG
register. For register description, please refer to Section GPIO Matrix Register Summary in
ESP32-C3 Technical Reference Manual.
During the chip’s system reset, the latches of the strapping pins sample the voltage level as strapping bits of ”0”
or ”1”, and hold these bits until the chip is powered down or shut down.
Types of system reset include:
• power-on reset
• RTC watchdog reset
• brownout reset
• analog super watchdog reset
• crystal clock glitch detection reset
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ESP32-C3 Series Datasheet v1.4
2 Pin Definition
By default, GPIO9 is connected to the internal weak pull-up resistor. If GPIO9 is not connected or connected to
an external high-impedance circuit, the latched bit value will be ”1”
To change the strapping bit values, you can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-C3.
After reset, the strapping pins work as normal-function pins.
Table 4 lists detailed booting configurations of the strapping pins.
Table 4: Strapping Pins
Booting Mode 1
Pin
Default
SPI Boot
Download Boot
GPIO2
N/A
1
1
GPIO8
N/A
Don’t care
1
1
0
GPIO9
Internal weak
pull-up
Enabling/Disabling ROM Messages Print in SPI Boot Mode
Pin
Default
Functionality
When the value of eFuse field EFUSE_UART_PRINT_CONTROL is
0 (default), print is enabled and not controlled by GPIO8.
GPIO8
N/A
1, if GPIO8 is 0, print is enabled; if GPIO8 is 1, it is disabled.
2, if GPIO8 is 0, print is disabled; if GPIO8 is 1, it is enabled.
3, print is disabled and not controlled by GPIO8.
1
The strapping combination of GPIO8 = 0 and GPIO9 = 0 is invalid and will trigger unexpected behavior.
Figure 7 shows the setup and hold times for the strapping pins before and after the CHIP_EN signal goes high.
Details about the parameters are listed in Table 5.
t0
CHIP_EN
t1
VIL_nRST
VIH
Strapping pin
Figure 7: Setup and Hold Times for the Strapping Pins
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ESP32-C3 Series Datasheet v1.4
2 Pin Definition
Table 5: Parameter Descriptions of Setup and Hold Times for the Strapping Pins
Min
Parameter
Description
t0
Setup time before CHIP_EN goes from low to high
0
t1
Hold time after CHIP_EN goes high
3
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ESP32-C3 Series Datasheet v1.4
3 Functional Description
3. Functional Description
This chapter describes the functions of ESP32-C3.
3.1 CPU and Memory
3.1.1 CPU
ESP32-C3 has a low-power 32-bit RISC-V single-core microprocessor with the following features:
• four-stage pipeline that supports a clock frequency of up to 160 MHz
• RV32IMC ISA
• 32-bit multiplier and 32-bit divider
• up to 32 vectored interrupts at seven priority levels
• up to 8 hardware breakpoints/watchpoints
• up to 16 PMP regions
• JTAG for debugging
For more information, please refer to Chapter ESP-RISC-V CPU in ESP32-C3 Technical Reference Manual.
3.1.2 Internal Memory
ESP32-C3’s internal memory includes:
• 384 KB of ROM: for booting and core functions.
• 400 KB of onchip SRAM: for data and instructions, running at a configurable frequency of up to 160
MHz. Of the 400 KB SRAM, 16 KB is configured for cache.
• RTC FAST memory: 8 KB of SRAM that can be accessed by the main CPU. It can retain data in
Deep-sleep mode.
• 4 Kbit of eFuse: 1792 bits are reserved for your data, such as encryption key and device ID.
• Embedded flash : See details in Chapter 1 ESP32-C3 Series Comparison.
For more information, please refer to Chapter System and Memory in ESP32-C3 Technical Reference
Manual.
3.1.3 External Flash
ESP32-C3 supports SPI, Dual SPI, Quad SPI, and QPI interfaces that allow connection to multiple external
flash.
CPU’s instruction memory space and read-only data memory space can map into external flash of ESP32-C3,
whose size can be 16 MB at most. ESP32-C3 supports hardware encryption/decryption based on XTS-AES to
protect developers’ programs and data in flash.
Through high-speed caches, ESP32-C3 can support at a time up to:
• 8 MB of instruction memory space which can map into flash as individual blocks of 64 KB. 8-bit, 16-bit and
32-bit reads are supported.
• 8 MB of data memory space which can map into flash as individual blocks of 64 KB. 8-bit, 16-bit and
32-bit reads are supported.
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Note:
After ESP32-C3 is initialized, software can customize the mapping of external flash into the CPU address space.
For more information, please refer to Chapter System and Memory in ESP32-C3 Technical Reference
Manual.
3.1.4 Address Mapping Structure
Figure 8: Address Mapping Structure
Note:
The memory space with gray background is not available for use.
3.1.5 Cache
ESP32-C3 has an eight-way set associative cache. This cache is read-only and has the following features:
• size: 16 KB
• block size: 32 bytes
• pre-load function
• lock function
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• critical word first and early restart
3.2 System Clocks
For more information, please refer to Chapter Reset and Clock in ESP32-C3 Technical Reference Manual.
3.2.1 CPU Clock
The CPU clock has three possible sources:
• external main crystal clock
• fast RC oscillator (typically about 17.5 MHz, and adjustable)
• PLL clock
The application can select the clock source from the three clocks above. The selected clock source drives the
CPU clock directly, or after division, depending on the application. Once the CPU is reset, the default clock
source would be the external main crystal clock divided by 2.
Note:
ESP32-C3 is unable to operate without an external main crystal clock.
3.2.2 RTC Clock
The RTC slow clock is used for RTC counter, RTC watchdog and low-power controller. It has three possible
sources:
• external low-speed (32 kHz) crystal clock
• internal slow RC oscillator (typically about 136 kHz, and adjustable)
• internal fast RC oscillator divided clock (derived from the fast RC oscillator divided by 256)
The RTC fast clock is used for RTC peripherals and sensor controllers. It has two possible sources:
• external main crystal clock divided by 2
• internal fast RC oscillator divide-by-N clock (typically about 17.5 MHz, and adjustable)
3.3 Analog Peripherals
For more information, please refer to Chapter On-Chip Sensors and Analog Signal Processing in ESP32-C3
Technical Reference Manual.
3.3.1 AnalogtoDigital Converter (ADC)
ESP32-C3 integrates two 12-bit SAR ADCs.
• ADC1 supports measurements on 5 channels, and is factory-calibrated.
• ADC2 supports measurements on 1 channel, and is not factory-calibrated.
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Note:
ADC2 of some chip revisions is not operable. For details, please refer to ESP32-C3 Series SoC Errata.
For ADC characteristics, please refer to Table 15.
For GPIOs assigned to ADC, please refer to Table 10.
3.3.2 Temperature Sensor
The temperature sensor generates a voltage that varies with temperature. The voltage is internally converted via
an ADC into a digital value.
The temperature sensor has a range of –40 °C to 125 °C. It is designed primarily to sense the temperature
changes inside the chip. The temperature value depends on factors like microcontroller clock frequency or I/O
load. Generally, the chip’s internal temperature is higher than the operating ambient temperature.
3.4 Digital Peripherals
3.4.1 General Purpose Input / Output Interface (GPIO)
ESP32-C3 has 22 or 16 GPIO pins which can be assigned various functions by configuring corresponding
registers. Besides digital signals, some GPIOs can be also used for analog functions, such as ADC.
All GPIOs have selectable internal pull-up or pull-down, or can be set to high impedance. When these GPIOs are
configured as an input, the input value can be read by software through the register. Input GPIOs can also be set
to generate edge-triggered or level-triggered CPU interrupts. All digital IO pins are bi-directional, non-inverting
and tristate, including input and output buffers with tristate control. These pins can be multiplexed with other
functions, such as the UART, SPI, etc. For low-power operations, the GPIOs can be set to holding state.
The IO MUX and the GPIO matrix are used to route signals from peripherals to GPIO pins. Together they provide
highly configurable I/O. Using GPIO Matrix, peripheral input signals can be configured from any IO pins while
peripheral output signals can be configured to any IO pins. Table 6 shows the IO MUX functions of each
pin.
Table 6: IO MUX Pin Functions
Name
No.
Function 0
Function 1
Function 2
Reset
Notes
XTAL_32K_P
4
GPIO0
GPIO0
—
0
R
XTAL_32K_N
5
GPIO1
GPIO1
—
0
R
GPIO2
6
GPIO2
GPIO2
FSPIQ
1
R
GPIO3
8
GPIO3
GPIO3
—
1
R
MTMS
9
MTMS
GPIO4
FSPIHD
1
R
MTDI
10
MTDI
GPIO5
FSPIWP
1
R
MTCK
12
MTCK
GPIO6
FSPICLK
1*
G
MTDO
13
MTDO
GPIO7
FSPID
1
G
GPIO8
14
GPIO8
GPIO8
—
1
—
GPIO9
15
GPIO9
GPIO9
—
3
—
GPIO10
16
GPIO10
GPIO10
FSPICS0
1
G
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Name
No.
Function 0
Function 1
Function 2
Reset
Notes
18
GPIO11
GPIO11
—
0
—
SPIHD
19
SPIHD
GPIO12
—
3
—
SPIWP
20
SPIWP
GPIO13
—
3
—
SPICS0
21
SPICS0
GPIO14
—
3
—
SPICLK
22
SPICLK
GPIO15
—
3
—
SPID
23
SPID
GPIO16
—
3
—
SPIQ
24
SPIQ
GPIO17
—
3
—
GPIO18
25
GPIO18
GPIO18
—
0
USB, G
GPIO19
26
GPIO19
GPIO19
—
0*
USB
U0RXD
27
U0RXD
GPIO20
—
3
G
U0TXD
28
U0TXD
GPIO21
—
4
—
VDD_SPI
1
1
For ESP32-C3FH4AZ, pins within the frame (namely pin 19 ∼ pin 24) are not bonded, and are labelled
as ”not connected”.
Reset
The default configuration of each pin after reset:
• 0 - input disabled, in high impedance state (IE = 0)
• 1 - input enabled, in high impedance state (IE = 1)
• 2 - input enabled, pull-down resistor enabled (IE = 1, WPD = 1)
• 3 - input enabled, pull-up resistor enabled (IE = 1, WPU = 1)
• 4 - output enabled, pull-up resistor enabled (OE = 1, WPU = 1)
• 0* - input disabled, pull-up resistor enabled (IE = 0, WPU = 0, USB_WPU = 1). See details in Notes
• 1* - When the value of eFuse bit EFUSE_DIS_PAD_JTAG is
0, input enabled, pull-up resistor enabled (IE = 1, WPU = 1)
1, input enabled, in high impedance state (IE = 1)
We recommend pulling high or low GPIO pins in high impedance state to avoid unnecessary power
consumption. You may add pull-up and pull-down resistors in your PCB design referring to Table 14, or enable
internal pull-up and pull-down resistors during software initialization.
Notes
• R - These pins have analog functions.
• USB - GPIO18 and GPIO19 are USB pins. The pull-up value of a USB pin is controlled by the pin’s pull-up
value together with USB pull-up value. If any of the two pull-up values is 1, the pin’s pull-up resistor will be
enabled. The pull-up resistors of USB pins are controlled by USB_SERIAL_JTAG_DP_PULLUP bit.
• G - These pins have glitches during power-up. See details in Table 7.
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Table 7: PowerUp Glitches on Pins
Typical Time Period
Pin
Glitch1
MTCK
Low-level glitch
5
MTDO
Low-level glitch
5
GPIO10
Low-level glitch
5
U0RXD
Low-level glitch
5
GPIO18
High-level glitch
50000
1
(ns)
Low-level glitch: the pin is at a low level output status during the
time period;
High-level glitch: the pin is at a high level output status during the
time period;
Pull-down glitch: the pin is at an internal weak pulled-down status
during the time period;
Pull-up glitch: the pin is at an internal weak pulled-up status during
the time period.
Please refer to Table 14 for detailed parameters about low/highlevel and pull-down/up.
For more information, please refer to Chapter IO MUX and GPIO Matrix (GPIO, IO_MUX) in ESP32-C3 Technical
Reference Manual.
3.4.2 Serial Peripheral Interface (SPI)
ESP32-C3 features three SPI interfaces (SPI0, SPI1, and SPI2). SPI0 and SPI1 can be configured to operate in
SPI memory mode, while SPI2 can be configured to operate in general-purpose SPI modes.
• SPI Memory mode
In SPI memory mode, SPI0 and SPI1 interface with SPI memory. Data are transferred in unit of byte. Up to
four-line STR reads and writes are supported. The clock frequency is configurable to a maximum of 120
MHz in STR mode.
• SPI2 Generalpurpose SPI (GPSPI) mode
When SPI2 acts as a general-purpose SPI, it can operate in master and slave modes. SPI2 supports
two-line full-duplex communication and single-/two-/four-line half-duplex communication in both master
and slave modes. The host’s clock frequency is configurable. Data are transferred in unit of byte. The clock
polarity (CPOL) and phase (CPHA) are also configurable. The SPI2 interface can connect to GDMA.
– In master mode, the clock frequency is 80 MHz at most, and the four modes of SPI transfer format are
supported.
– In slave mode, the clock frequency is 60 MHz at most, and the four modes of SPI transfer format are
also supported.
The mapping between SPI bus signals and GPIO pins is shown in Table 8:
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Table 8: Mapping of SPI Signals and Chip Pins
FullDuplex
HalfDuplex
SPI Signal
SPI Signal
Pin Function
Chip Pin Signal
FSPI Signals
MOSI
MOSI
D
FSPID
MISO
(MISO)
Q
FSPIQ
CS
CS
CS
FSPICS0 ~ 5
CLK
CLK
CLK
FSPICLK
—
—
WP
FSPIWP
—
—
HD
FSPIHD
In most cases, the data port connection between ESP32-C3 and external flash is as follows:
Table 9: Connection Between ESP32C3 and External Flash
External Flash Data Port
Chip Pin
SPI SingleLine Mode
SPI TwoLine Mode
SPI FourLine Mode
DI
IO0
IO0
SPID (SPID)
SPIQ (SPIQ)
DO
IO1
IO1
SPIWP (SPIWP)
WP#
—
IO2
SPIHD (SPIHD)
HOLD#
—
IO3
For GPIOs assigned to SPI, please refer to Table 10.
For more information, please refer to Chapter SPI Controller (SPI) in ESP32-C3 Technical Reference
Manual.
3.4.3 Universal Asynchronous Receiver Transmitter (UART)
ESP32-C3 has two UART interfaces, i.e. UART0 and UART1, which support IrDA and asynchronous
communication (RS232 and RS485) at a speed of up to 5 Mbps. The UART controller provides hardware flow
control (CTS and RTS signals) and software flow control (XON and XOFF). Both UART interfaces connect to
GDMA via UHCI0, and can be accessed by the GDMA controller or directly by the CPU.
For GPIOs assigned to UART, please refer to Table 10.
For more information, please refer to Chapter UART Controller (UART) in ESP32-C3 Technical Reference
Manual.
3.4.4 I2C Interface
ESP32-C3 has an I2C bus interface which is used for I2C master mode or slave mode, depending on your
configuration. The I2C interface supports:
• standard mode (100 Kbit/s)
• fast mode (400 Kbit/s)
• up to 800 Kbit/s (constrained by SCL and SDA pull-up strength)
• 7-bit and 10-bit addressing mode
• double addressing mode
• 7-bit broadcast address
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You can configure instruction registers to control the I2C interface for more flexibility.
For GPIOs assigned to I2C, please refer to Table 10.
For more information, please refer to Chapter I2C Controller (I2C) in ESP32-C3 Technical Reference
Manual.
3.4.5 I2S Interface
ESP32-C3 includes a standard I2S interface. This interface can operate as a master or a slave in full-duplex
mode or half-duplex mode, and can be configured for 8-bit, 16-bit, 24-bit, or 32-bit serial communication. BCK
clock frequency, from 10 kHz up to 40 MHz, is supported.
The I2S interface connects to the GDMA controller. The interface supports TDM PCM, TDM MSB alignment,
TDM standard, and PDM standard.
For GPIOs assigned to I2S, please refer to Table 10.
For more information, please refer to Chapter I2S Controller (I2S) in ESP32-C3 Technical Reference Manual.
3.4.6 Remote Control Peripheral
The Remote Control Peripheral (RMT) supports two channels of infrared remote transmission and two channels
of infrared remote reception. By controlling pulse waveform through software, it supports various infrared and
other single wire protocols. All four channels share a 192 × 32-bit memory block to store transmit or receive
waveform.
For GPIOs assigned to the Remote Control Peripheral, please refer to Table 10.
For more information, please refer to Chapter Remote Control Peripheral (RMT) in ESP32-C3 Technical Reference
Manual.
3.4.7 LED PWM Controller
The LED PWM controller can generate independent digital waveform on six channels. The LED PWM
controller:
• can generate digital waveform with configurable periods and duty cycle. The accuracy of duty cycle can be
up to 18 bits.
• has multiple clock sources, including APB clock and external main crystal clock.
• can operate when the CPU is in Light-sleep mode.
• supports gradual increase or decrease of duty cycle, which is useful for the LED RGB color-gradient
generator.
For GPIOs assigned to LED PWM, please refer to Table 10.
For more information, please refer to Chapter LED PWM Controller (LEDC) in ESP32-C3 Technical Reference
Manual.
3.4.8 General DMA Controller
ESP32-C3 has a general DMA controller (GDMA) with six independent channels, i.e. three transmit channels and
three receive channels. These six channels are shared by peripherals with DMA feature. The GDMA controller
implements a fixed-priority scheme among these channels, whose priority can be configured.
The GDMA controller controls data transfer using linked lists. It allows peripheral-to-memory and
memory-to-memory data transfer at a high speed. All channels can access internal RAM.
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Peripherals on ESP32-C3 with DMA feature are SPI2, UHCI0, I2S, AES, SHA, and ADC.
For more information, please refer to Chapter GDMA Controller (GDMA) in ESP32-C3 Technical Reference
Manual.
3.4.9 USB Serial/JTAG Controller
ESP32-C3 integrates a USB Serial/JTAG controller. This controller has the following features:
• CDC-ACM virtual serial port and JTAG adapter functionality
• USB 2.0 full speed compliant, capable of up to 12 Mbit/s transfer speed (Note that this controller does not
support the faster 480 Mbit/s high-speed transfer mode)
• programming embedded/external flash
• CPU debugging with compact JTAG instructions
• a full-speed USB PHY integrated in the chip
For GPIOs assigned to USB Serial/JTAG, please refer to Table 10.
For more information, please refer to Chapter USB Serial/JTAG Controller (USB_SERIAL_JTAG) in ESP32-C3
Technical Reference Manual.
3.4.10 TWAI® Controller
ESP32-C3 has a TWAI® controller with the following features:
• compatible with ISO 11898-1 protocol (CAN Specification 2.0)
• standard frame format (11-bit ID) and extended frame format (29-bit ID)
• bit rates from 1 Kbit/s to 1 Mbit/s
• multiple modes of operation: Normal, Listen Only, and Self-Test (no acknowledgment required)
• 64-byte receive FIFO
• acceptance filter (single and dual filter modes)
• error detection and handling: error counters, configurable error interrupt threshold, error code capture,
arbitration lost capture
For GPIOs assigned to TWAI, please refer to Table 10.
For more information, please refer to Chapter Two-wire Automotive Interface (TWAI) in ESP32-C3 Technical
Reference Manual.
3.5 Radio and WiFi
ESP32-C3 radio consists of the following blocks:
• 2.4 GHz receiver
• 2.4 GHz transmitter
• bias and regulators
• balun and transmit-receive switch
• clock generator
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3.5.1 2.4 GHz Receiver
The 2.4 GHz receiver demodulates the 2.4 GHz RF signal to quadrature baseband signals and converts them to
the digital domain with two high-resolution, high-speed ADCs. To adapt to varying signal channel conditions,
ESP32-C3 integrates RF filters, Automatic Gain Control (AGC), DC offset cancelation circuits, and baseband
filters.
3.5.2 2.4 GHz Transmitter
The 2.4 GHz transmitter modulates the quadrature baseband signals to the 2.4 GHz RF signal, and drives the
antenna with a high-powered CMOS power amplifier. The use of digital calibration further improves the linearity of
the power amplifier.
Additional calibrations are integrated to cancel any radio imperfections, such as:
• carrier leakage
• I/Q amplitude/phase matching
• baseband nonlinearities
• RF nonlinearities
• antenna matching
These built-in calibration routines reduce the cost, time, and specialized equipment required for product
testing.
3.5.3 Clock Generator
The clock generator produces quadrature clock signals of 2.4 GHz for both the receiver and the transmitter. All
components of the clock generator are integrated into the chip, including inductors, varactors, filters, regulators
and dividers.
The clock generator has built-in calibration and self-test circuits. Quadrature clock phases and phase noise are
optimized on chip with patented calibration algorithms which ensure the best performance of the receiver and the
transmitter.
3.5.4 WiFi Radio and Baseband
ESP32-C3 Wi-Fi radio and baseband support the following features:
• 802.11b/g/n
• 802.11n MCS0-7 that supports 20 MHz and 40 MHz bandwidth
• 802.11n MCS32
• 802.11n 0.4 µs guard interval
• data rate up to 150 Mbps
• RX STBC (single spatial stream)
• adjustable transmitting power
• antenna diversity
ESP32-C3 supports antenna diversity with an external RF switch. This switch is controlled by one or more
GPIOs, and used to select the best antenna to minimize the effects of channel imperfections.
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3.5.5 WiFi MAC
ESP32-C3 implements the full 802.11 b/g/n Wi-Fi MAC protocol. It supports the Basic Service Set (BSS) STA
and SoftAP operations under the Distributed Control Function (DCF). Power management is handled
automatically with minimal host interaction to minimize the active duty period.
ESP32-C3 Wi-Fi MAC applies the following low-level protocol functions automatically:
• 4 × virtual Wi-Fi interfaces
• infrastructure BSS in Station mode, SoftAP mode, Station + SoftAP mode, and promiscuous mode
• RTS protection, CTS protection, Immediate Block ACK
• fragmentation and defragmentation
• TX/RX A-MPDU, TX/RX A-MSDU
• transmit opportunity (TXOP)
• Wi-Fi multimedia (WMM)
• GCMP, CCMP, TKIP, WAPI, WEP, BIP, WPA2-PSK/WPA2-Enterprise, and WPA3-PSK/WPA3-Enterprise
• automatic beacon monitoring (hardware TSF)
• 802.11mc FTM
3.5.6 Networking Features
Espressif provides libraries for TCP/IP networking, ESP-WIFI-MESH networking, and other networking protocols
over Wi-Fi. TLS 1.0, 1.1 and 1.2 is also supported.
3.6 Bluetooth LE
ESP32-C3 includes a Bluetooth Low Energy subsystem that integrates a hardware link layer controller, an
RF/modem block and a feature-rich software protocol stack. It supports the core features of Bluetooth 5 and
Bluetooth mesh.
3.6.1 Bluetooth LE Radio and PHY
Bluetooth Low Energy radio and PHY in ESP32-C3 support:
• 1 Mbps PHY
• 2 Mbps PHY for higher data rates
• coded PHY for longer range (125 Kbps and 500 Kbps)
• HW Listen before talk (LBT)
3.6.2 Bluetooth LE Link Layer Controller
Bluetooth Low Energy Link Layer Controller in ESP32-C3 supports:
• LE advertising extensions, to enhance broadcasting capacity and broadcast more intelligent data
• multiple advertisement sets
• simultaneous advertising and scanning
• multiple connections in simultaneous central and peripheral roles
• adaptive frequency hopping and channel assessment
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• LE channel selection algorithm #2
• connection parameter update
• high duty cycle non-connectable advertising
• LE privacy 1.2
• LE data packet length extension
• link layer extended scanner filter policies
• low duty cycle directed advertising
• link layer encryption
• LE Ping
3.7 Low Power Management
With the use of advanced power-management technologies, ESP32-C3 can switch between different power
modes.
• Active mode: CPU and chip radio are powered on. The chip can receive, transmit, or listen.
• Modem-sleep mode: The CPU is operational and the clock speed can be reduced. Wi-Fi base band,
Bluetooth LE base band, and radio are disabled, but Wi-Fi and Bluetooth LE connection can remain active.
• Light-sleep mode: The CPU is paused. Any wake-up events (MAC, host, RTC timer, or external interrupts)
will wake up the chip. Wi-Fi and Bluetooth LE connection can remain active.
• Deep-sleep mode: CPU and most peripherals are powered down. Only the RTC memory is powered on.
Wi-Fi connection data are stored in the RTC memory. The RTC timer or the RTC GPIOs can wake up the
chip from the Deep-sleep mode.
For power consumption in different power modes, please refer to Section 4.6.
3.8 Timers
3.8.1 General Purpose Timers
ESP32-C3 is embedded with two 54-bit general-purpose timers, which are based on 16-bit prescalers and
54-bit auto-reload-capable up/down-timers.
The timers’ features are summarized as follows:
• a 16-bit clock prescaler, from 1 to 65536
• a 54-bit time-base counter programmable to be incrementing or decrementing
• able to read real-time value of the time-base counter
• halting and resuming the time-base counter
• programmable alarm generation
• level interrupt generation
For more information, please refer to Chapter Timer Group (TIMG) in ESP32-C3 Technical Reference
Manual.
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3.8.2 System Timer
ESP32-C3 integrates a 52-bit system timer, which has two 52-bit counters and three comparators. The system
timer has the following features:
• counters with a fixed clock frequency of 16 MHz
• three types of independent interrupts generated according to alarm value
• two alarm modes: target mode and period mode
• 52-bit target alarm value and 26-bit periodic alarm value
• automatic reload of counter value
• counters can be stalled if the CPU is stalled or in OCD mode
For more information, please refer to Chapter System Timer (SYSTIMER) in ESP32-C3 Technical Reference
Manual.
3.8.3 Watchdog Timers
For more information, please refer to Chapter Watchdog Timers (WDT) in ESP32-C3 Technical Reference
Manual.
Digital Watchdog Timers
ESP32-C3 contains three digital watchdog timers: one in each of the two timer groups (called Main System
Watchdog Timers, or MWDT) and one in the RTC module (called the RTC Watchdog Timer, or RWDT).
During the flash boot process, RWDT and the MWDT in timer group 0 (TIMG0) are enabled automatically in order
to detect and recover from booting errors.
Digital watchdog timers have the following features:
• four stages, each with a programmable timeout value. Each stage can be configured, enabled and
disabled separately
• interrupt, CPU reset, or core reset for MWDT upon expiry of each stage; interrupt, CPU reset, core reset, or
system reset for RWDT upon expiry of each stage
• 32-bit expiry counter
• write protection, to prevent RWDT and MWDT configuration from being altered inadvertently
• flash boot protection
If the boot process from an SPI flash does not complete within a predetermined period of time, the
watchdog will reboot the entire main system.
Analog Watchdog Timer
ESP32-C3 also has one analog watchdog timer: RTC super watchdog timer (SWD). It is an ultra-low-power
circuit in analog domain that helps to prevent the system from operating in a sub-optimal state and resets the
system if required.
SWD has the following features:
• Ultra-low power
• Interrupt to indicate that the SWD timeout period is close to expiring
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• Various dedicated methods for software to feed SWD, which enables SWD to monitor the working state of
the whole operating system
3.9 Cryptographic Hardware Accelerators
ESP32-C3 is equipped with hardware accelerators of general algorithms, such as AES-128/AES-256 (FIPS PUB
197), ECB/CBC/OFB/CFB/CTR (NIST SP 800-38A), SHA1/SHA224/SHA256 (FIPS PUB 180-4), and RSA3072.
The chip also supports independent arithmetic, such as Big Integer Multiplication and Big Integer Modular
Multiplication. The maximum operation length for RSA and Big Integer Modular Multiplication is 3072 bits. The
maximum factor length for Big Integer Multiplication is 1536 bits.
3.10
Physical Security Features
• Transparent external flash encryption (AES-XTS algorithm) with software inaccessible key prevents
unauthorized readout of your application code or data.
• Secure boot feature uses a hardware root of trust to ensure only signed firmware (with RSA-PSS signature)
can be booted.
• HMAC module can use a software inaccessible MAC key to generate MAC signatures for identity
verification and other purposes.
• Digital Signature module can use a software inaccessible secure key to generate RSA signatures for identity
verification.
• World Controller provides two running environments for software. All hardware and software resources are
sorted to two groups, and placed in either secure or general world. The secure world cannot be accessed
by hardware in the general world, thus establishing a security boundary.
3.11
Peripheral Pin Configurations
Table 10: Peripheral Pin Configurations
Interface
Signal
Pin
Function
ADC
ADC1_CH0
XTAL_32K_P
Two 12-bit SAR ADCs
ADC1_CH1
XTAL_32K_N
ADC1_CH2
GPIO2
ADC1_CH3
GPIO3
ADC1_CH4
MTMS
ADC2_CH0
MTDI
MTDI
MTDI
MTCK
MTCK
MTMS
MTMS
MTDO
MTDO
JTAG
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Interface
Signal
Pin
Function
UART
U0RXD_in
Any GPIO pins
Two UART channels with hardware flow control
U0CTS_in
and GDMA
U0DSR_in
U0TXD_out
U0RTS_out
U0DTR_out
U1RXD_in
U1CTS_in
U1DSR_in
U1TXD_out
U1RTS_out
U1DTR_out
I2C
I2CEXT0_SCL_in
Any GPIO pins
One I2C channel in slave or master mode
I2CEXT0_SDA_in
I2CEXT1_SCL_in
I2CEXT1_SDA_in
I2CEXT0_SCL_out
I2CEXT0_SDA_out
I2CEXT1_SCL_out
I2CEXT1_SDA_out
LED PWM
ledc_ls_sig_out0~5
Any GPIO pins
Six independent PWM channels
I2S
I2S0O_BCK_in
Any GPIO pins
Stereo input and output from/to the audiocodec
Any GPIO pins
Two channels for an IR transceiver of various
I2S_MCLK_in
I2SO_WS_in
I2SI_SD_in
I2SI_BCK_in
I2SI_WS_in
I2SO_BCK_out
I2S_MCLK_out
I2SO_WS_out
I2SO_SD_out
I2SI_BCK_out
I2SI_WS_out
I2SO_SD1_out
Remote Control
RMT_SIG_IN0~1
Peripheral
RMT_SIG_OUT0~1
SPI0/1
SPICLK_out_mux
SPICLK
Support Standard SPI, Dual SPI, Quad SPI, and
SPICS0_out
SPICS0
QPI that allow connection to external flash
SPICS1_out
Any GPIO pins
SPID_in/_out
SPID
SPIQ_in/_out
SPIQ
SPIWP_in/_out
SPIWP
SPIHD_in/_out
SPIHD
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ESP32-C3 Series Datasheet v1.4
3 Functional Description
Interface
Signal
Pin
SPI2
FSPICLK_in/_out_mux
Any GPIO pins
SPI, Quad SPI, and QPI
FSPICS0_in/_out
• Connection to external flash, RAM, and
FSPICS1~5_out
other SPI devices
FSPID_in/_out
USB Serial/JTAG
TWAI
Function
• Master mode and slave mode of SPI, Dual
FSPIQ_in/_out
• Four modes of SPI transfer format
FSPIWP_in/_out
• Configurable SPI frequency
FSPIHD_in/_out
• 64-byte FIFO or GDMA buffer
USB_D+
GPIO19
USB-to-serial converter, and USB-to-JTAG
USB_D-
GPIO18
converter
twai_rx
Any GPIO pins
Compatible with ISO 11898-1 protocol
twai_tx
twai_bus_off_on
twai_clkout
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ESP32-C3 Series Datasheet v1.4
4 Electrical Characteristics
4. Electrical Characteristics
4.1 Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device.
Table 11: Absolute Maximum Ratings
Symbol
VDDA,
Parameter
VDD3P3,
VDD3P3_RTC,
Min
Voltage applied to power supply pins
VDD3P3_CPU, VDD_SPI
per power domain
TST ORE
Storage temperature
Max
Unit
–0.3
3.6
V
–40
150
°C
Max
Unit
4.2 Recommended Operating Conditions
Table 12: Recommended Operating Conditions
Symbol
Parameter
VDDA, VDD3P3
Voltage applied to power supply pins per
VDD3P3_RTC
power domain
VDD_SPI (working as
input power supply)1
VDD3P3_CPU2, 3
IV DD
4
TA
Min
Typ
3.0
3.3
3.6
V
—
3.0
3.3
3.6
V
Voltage applied to power supply pin
3.0
3.3
3.6
V
Current delivered by external power supply
0.5
—
—
A
Operating ambient
temperature
ESP32-C3
ESP32-C3FN4
105
–40
—
ESP32-C3FH4
85
°C
105
1
For more information, please refer to Section 2.3 Power Scheme.
2
When VDD_SPI is used to drive peripherals, VDD3P3_CPU should comply with the peripherals’ specifications. For more information, please refer to Table 13.
3
To write eFuse, VDD3P3_CPU should not be higher than 3.3 V.
4
If you use a single power supply, the recommended output current is 500 mA or more.
4.3 VDD_SPI Output Characteristics
Table 13: VDD_SPI Output Characteristics
Symbol
Parameter
RSP I
On-resistance in 3.3 V mode
Espressif Systems
Typ
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7.5
Unit
Ω
ESP32-C3 Series Datasheet v1.4
4 Electrical Characteristics
Note:
In real-life applications, when VDD_SPI works in 3.3 V output mode, VDD3P3_CPU may be affected by RSP I . For
example, when VDD3P3_CPU is used to drive a 3.3 V flash, it should comply with the following specifications:
VDD3P3_CPU > VDD_flash_min + I_flash_max*RSP I
Among which, VDD_flash_min is the minimum operating voltage of the flash, and I_flash_max the maximum current.
For more information, please refer to section 2.3 Power Scheme.
4.4 DC Characteristics (3.3 V, 25 °C)
Table 14: DC Characteristics (3.3 V, 25 °C)
Symbol
Parameter
CIN
Pin capacitance
VIH
Min
Typ
—
High-level input voltage
0.75 × VDD
1
Max
Unit
2
—
pF
1
—
VDD + 0.3
V
1
VIL
Low-level input voltage
–0.3
—
0.25 × VDD
IIH
High-level input current
—
—
50
nA
Low-level input current
—
—
50
nA
—
—
V
IIL
VOH
VOL
2
2
High-level output voltage
0.8 × VDD
Low-level output voltage
1
1
V
—
—
0.1 × VDD
V
—
40
—
mA
—
28
—
mA
—
kΩ
—
kΩ
1
IOH
High-level source current (VDD = 3.3 V,
VOH >= 2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1= 3.3 V, VOL =
IOL
0.495 V, PAD_DRIVER = 3)
RP U
Pull-up resistor
—
45
RP D
Pull-down resistor
—
45
VIH_nRST
VIL_nRST
Chip reset release voltage
0.75 × VDD
Chip reset voltage
1
–0.3
1
VDD is the I/O voltage for a particular power domain of pins.
2
VOH and VOL are measured using high-impedance load.
1
—
VDD + 0.3
—
0.25 × VDD
V
1
V
4.5 ADC Characteristics
Table 15: ADC Characteristics
Symbol
DNL (Differential nonlinearity)1
INL (Integral nonlinearity)
Sampling rate
Parameter
Min
ADC connected to an external
100 nF capacitor; DC signal input;
ambient temperature at 25 °C;
Wi-Fi off
—
Max
Unit
–7
7
LSB
–12
12
LSB
—
100
kSPS 2
1
To get better DNL results, you can sample multiple times and apply a filter, or calculate the average value.
2
kSPS means kilo samples-per-second.
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ESP32-C3 Series Datasheet v1.4
4 Electrical Characteristics
The calibrated ADC results after hardware calibration + software calibration are shown in Table 16. For higher
accuracy, you may implement your own calibration methods.
Table 16: ADC Calibration Results
Parameter
Description
Total error
Min
Max
Unit
ATTEN0, effective measurement range of 0 ~ 750
–10
10
mV
ATTEN1, effective measurement range of 0 ~ 1050
–10
10
mV
ATTEN2, effective measurement range of 0 ~ 1300
–10
10
mV
ATTEN3, effective measurement range of 0 ~ 2500
–35
35
mV
4.6 Current Consumption
The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF
port. All transmitters’ measurements are based on a 100% duty cycle.
4.6.1 RF Current Consumption in Active Mode
Table 17: Current Consumption Depending on RF Modes
Work mode
Description
TX
Active (RF working)
RX
Peak (mA)
802.11b, 1 Mbps, @21 dBm
335
802.11g, 54 Mbps, @19 dBm
285
802.11n, HT20, MCS7, @18.5 dBm
276
802.11n, HT40, MCS7, @18.5 dBm
278
802.11b/g/n, HT20
84
802.11n, HT40
87
4.6.2 Current Consumption in Other Modes
Table 18: Current Consumption in Modemsleep Mode
Mode
CPU Frequency
(MHz)
160
Modem-sleep2,3
80
Typ
Description
All Peripherals Clocks
All Peripherals Clocks
Disabled (mA)
Enabled (mA)1
CPU is running
23
28
CPU is idle
16
21
CPU is running
17
22
CPU is idle
13
18
1
In practice, the current consumption might be different depending on which peripherals are enabled.
2
In Modem-sleep mode, Wi-Fi is clock gated.
3
In Modem-sleep mode, the consumption might be higher when accessing flash. For a flash rated at 80
Mbit/s, in SPI 2-line mode the consumption is 10 mA.
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ESP32-C3 Series Datasheet v1.4
4 Electrical Characteristics
Table 19: Current Consumption in LowPower Modes
Mode
Description
Typ (µA)
Light-sleep
VDD_SPI and Wi-Fi are powered down, and all GPIOs are high-impedance
Deep-sleep
RTC timer + RTC memory
5
Power off
CHIP_EN is set to low level, the chip is powered off
1
130
4.7 Reliability
Table 20: Reliability Qualifications
Test Item
HTOL (High Temperature
Operating Life)
Test Conditions
Test Standard
125 °C, 1000 hours
JESD22-A108
HBM (Human Body Mode)1± 2000 V
ESD (Electro-Static
Discharge Sensitivity)
JS-001
2
CDM (Charge Device Mode) ± 1000 V
JS-002
Current trigger ± 200 mA
Latch up
JESD78
Voltage trigger 1.5 × VDDmax
Bake 24 hours @125 °C
Preconditioning
J-STD-020, JESD47,
Moisture soak (level 3: 192 hours @30 °C, 60% RH)
IR reflow solder: 260 + 0 °C, 20 seconds, three times
TCT (Temperature Cycling
Test)
JESD22-A113
–65 °C / 150 °C, 500 cycles
JESD22-A104
130 °C, 85% RH, 96 hours
JESD22-A118
150 °C, 1000 hours
JESD22-A103
–40 °C, 1000 hours
JESD22-A119
uHAST (Highly
Accelerated Stress Test,
unbiased)
HTSL (High Temperature
Storage Life)
LTSL (Low Temperature
Storage Life)
1
JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
2
JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.
4.8 WiFi Radio
Table 21: WiFi Frequency
Parameter
Center frequency of operating channel
Espressif Systems
Min
Typ
Max
(MHz)
(MHz)
(MHz)
2412
—
2484
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4 Electrical Characteristics
4.8.1 WiFi RF Transmitter (TX) Specifications
Table 22: TX Power with Spectral Mask and EVM Meeting 802.11 Standards
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11b, 1 Mbps
—
21.0
—
802.11b, 11 Mbps
—
21.0
—
802.11g, 6 Mbps
—
21.0
—
802.11g, 54 Mbps
—
19.0
—
802.11n, HT20, MCS0
—
20.0
—
802.11n, HT20, MCS7
—
18.5
—
802.11n, HT40, MCS0
—
20.0
—
802.11n, HT40, MCS7
—
18.5
—
Rate
Table 23: TX EVM Test
Rate
Min
Typ
SL1
(dB)
(dB)
(dB)
802.11b, 1 Mbps, @21 dBm
—
–24.5
–10
802.11b, 11 Mbps, @21 dBm
—
–25.0
–10
802.11g, 6 Mbps, @21 dBm
—
–23.0
–5
802.11g, 54 Mbps, @19 dBm
—
–27.5
–25
802.11n, HT20, MCS0, @20 dBm
—
–22.5
–5
802.11n, HT20, MCS7, @18.5 dBm
—
–29.0
–27
802.11n, HT40, MCS0, @20 dBm
—
–22.5
–5
802.11n, HT40, MCS7, @18.5 dBm
—
–28.0
–27
1
SL stands for standard limit value.
4.8.2 WiFi RF Receiver (RX) Specifications
Table 24: RX Sensitivity
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11b, 1 Mbps
—
–98.4
—
802.11b, 2 Mbps
—
–96.0
—
802.11b, 5.5 Mbps
—
–93.0
—
802.11b, 11 Mbps
—
–88.6
—
802.11g, 6 Mbps
—
–93.8
—
802.11g, 9 Mbps
—
–92.2
—
802.11g, 12 Mbps
—
–91.0
—
802.11g, 18 Mbps
—
–88.4
—
802.11g, 24 Mbps
—
–85.8
—
802.11g, 36 Mbps
—
–82.0
—
Rate
Cont’d on next page
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4 Electrical Characteristics
Table 24 – cont’d from previous page
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11g, 48 Mbps
—
–78.0
—
802.11g, 54 Mbps
—
–76.6
—
802.11n, HT20, MCS0
—
–93.6
—
802.11n, HT20, MCS1
—
–90.8
—
802.11n, HT20, MCS2
—
–88.4
—
802.11n, HT20, MCS3
—
–85.0
—
802.11n, HT20, MCS4
—
–81.8
—
802.11n, HT20, MCS5
—
–77.8
—
802.11n, HT20, MCS6
—
–76.0
—
802.11n, HT20, MCS7
—
–74.8
—
802.11n, HT40, MCS0
—
–90.0
—
802.11n, HT40, MCS1
—
–88.0
—
802.11n, HT40, MCS2
—
–85.2
—
802.11n, HT40, MCS3
—
–82.0
—
802.11n, HT40, MCS4
—
–78.8
—
802.11n, HT40, MCS5
—
–74.6
—
802.11n, HT40, MCS6
—
–73.0
—
802.11n, HT40, MCS7
—
–71.4
—
Rate
Table 25: Maximum RX Level
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11b, 1 Mbps
—
5
—
802.11b, 11 Mbps
—
5
—
802.11g, 6 Mbps
—
5
—
802.11g, 54 Mbps
—
0
—
802.11n, HT20, MCS0
—
5
—
802.11n, HT20, MCS7
—
0
—
802.11n, HT40, MCS0
—
5
—
802.11n, HT40, MCS7
—
0
—
Rate
Table 26: RX Adjacent Channel Rejection
Rate
Min
Typ
Max
(dB)
(dB)
(dB)
802.11b, 1 Mbps
—
35
—
802.11b, 11 Mbps
—
35
—
802.11g, 6 Mbps
—
31
—
802.11g, 54 Mbps
—
20
—
802.11n, HT20, MCS0
—
31
—
Cont’d on next page
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ESP32-C3 Series Datasheet v1.4
4 Electrical Characteristics
Table 26 – cont’d from previous page
Rate
Min
Typ
Max
(dB)
(dB)
(dB)
802.11n, HT20, MCS7
—
16
—
802.11n, HT40, MCS0
—
25
—
802.11n, HT40, MCS7
—
11
—
4.9 Bluetooth LE Radio
Table 27: Bluetooth LE Frequency
Parameter
Min
Typ
Max
(MHz)
(MHz)
(MHz)
2402
—
2480
Center frequency of operating channel
4.9.1 Bluetooth LE RF Transmitter (TX) Specifications
Table 28: Transmitter Characteristics Bluetooth LE 1 Mbps
Parameter
Description
Min
RF power control range
RF transmit power
Carrier frequency offset and drift
Modulation characteristics
In-band spurious emissions
Typ
Max
Unit
–24.00
0
21.00
Gain control step
—
3.00
—
dB
Max |fn |n=0, 1, 2, ..k
—
17.00
—
kHz
Max |f0 − fn |
—
1.75
—
kHz
Max |fn − fn−5 |
—
1.46
—
kHz
|f1 − f0 |
—
0.80
—
kHz
∆ f 1avg
—
250.00
—
kHz
—
190.00
—
kHz
∆ f 2avg /∆ f 1avg
—
0.83
—
—
± 2 MHz offset
—
–37.62
—
dBm
± 3 MHz offset
—
–41.95
—
dBm
> ± 3 MHz offset
—
–44.48
—
dBm
Min ∆ f 2max (for at least
99.9% of all ∆ f 2max )
dBm
Table 29: Transmitter Characteristics Bluetooth LE 2 Mbps
Parameter
RF transmit power
Carrier frequency offset and drift
Description
Min
RF power control range
Max
Unit
–24.00
0
21.00
Gain control step
—
3.00
—
dB
Max |fn |n=0, 1, 2, ..k
—
20.80
—
kHz
Max |f0 − fn |
—
1.30
—
kHz
Max |fn − fn−5 |
—
1.33
—
kHz
|f1 − f0 |
—
0.70
—
kHz
∆ f 1avg
—
498.00
—
kHz
dBm
Cont’d on next page
Modulation characteristics
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4 Electrical Characteristics
Table 29 – cont’d from previous page
Parameter
Description
Min
Min ∆ f 2max (for at least
Max
Unit
—
430.00
—
kHz
∆ f 2avg /∆ f 1avg
—
0.93
—
—
± 4 MHz offset
—
–43.55
—
dBm
± 5 MHz offset
—
–45.26
—
dBm
> ± 5 MHz offset
—
–45.26
—
dBm
99.9% of all ∆ f 2max )
In-band spurious emissions
Typ
Table 30: Transmitter Characteristics Bluetooth LE 125 Kbps
Parameter
Description
Min
RF power control range
RF transmit power
Carrier frequency offset and drift
Modulation characteristics
Max
Unit
–24.00
0
21.00
Gain control step
—
3.00
—
dB
Max |fn |n=0, 1, 2, ..k
—
17.50
—
kHz
Max |f0 − fn |
—
0.45
—
kHz
|fn − fn−3 |
—
0.70
—
kHz
|f0 − f3 |
—
0.30
—
kHz
∆ f 1avg
—
250.00
—
kHz
—
235.00
—
kHz
± 2 MHz offset
—
–37.90
—
dBm
± 3 MHz offset
—
–41.00
—
dBm
> ± 3 MHz offset
—
–42.50
—
dBm
Min ∆ f 1max (for at least
99.9% of all∆ f 2max )
In-band spurious emissions
Typ
dBm
Table 31: Transmitter Characteristics Bluetooth LE 500 Kbps
Parameter
RF transmit power
Carrier frequency offset and drift
Modulation characteristics
Description
Min
RF power control range
Max
Unit
–24.00
0
21.00
Gain control step
—
3.00
—
dB
Max |fn |n=0, 1, 2, ..k
—
17.00
—
kHz
Max |f0 − fn |
—
0.88
—
kHz
|fn − fn−3 |
—
1.00
—
kHz
|f0 − f3 |
—
0.20
—
kHz
∆ f 2avg
—
208.00
—
kHz
—
190.00
—
kHz
± 2 MHz offset
—
–37.90
—
dBm
± 3 MHz offset
—
–41.30
—
dBm
> ± 3 MHz offset
—
–42.80
—
dBm
Min ∆ f 2max (for at least
99.9% of all ∆ f 2max )
In-band spurious emissions
Typ
dBm
4.9.2 Bluetooth LE RF Receiver (RX) Specifications
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4 Electrical Characteristics
Table 32: Receiver Characteristics Bluetooth LE 1 Mbps
Parameter
Description
Sensitivity @30.8% PER
—
—
–97
—
dBm
Maximum received signal @30.8% PER
—
—
5
—
dBm
Co-channel C/I
—
—
8
—
dB
F = F0 + 1 MHz
—
–3
—
dB
F = F0 – 1 MHz
—
–4
—
dB
F = F0 + 2 MHz
—
–29
—
dB
F = F0 – 2 MHz
—
–31
—
dB
F = F0 + 3 MHz
—
–33
—
dB
F = F0 – 3 MHz
—
–27
—
dB
F ≥ F0 + 4 MHz
—
–29
—
dB
F ≤ F0 – 4 MHz
—
–38
—
dB
—
—
–29
—
dB
F = Fimage + 1 MHz
—
–41
—
dB
F = Fimage – 1 MHz
—
–33
—
dB
30 MHz ~ 2000 MHz
—
–5
—
dBm
2003 MHz ~ 2399 MHz
—
–18
—
dBm
2484 MHz ~ 2997 MHz
—
–15
—
dBm
3000 MHz ~ 12.75 GHz
—
–5
—
dBm
—
—
–30
—
dBm
Adjacent channel selectivity C/I
Image frequency
Adjacent channel to image frequency
Out-of-band blocking performance
Intermodulation
Min
Typ
Max
Unit
Table 33: Receiver Characteristics Bluetooth LE 2 Mbps
Parameter
Description
Sensitivity @30.8% PER
—
—
–93
—
dBm
Maximum received signal @30.8% PER
—
—
3
—
dBm
Co-channel C/I
—
—
10
—
dB
F = F0 + 2 MHz
—
–7
—
dB
F = F0 – 2 MHz
—
–7
—
dB
F = F0 + 4 MHz
—
–28
—
dB
F = F0 – 4 MHz
—
–26
—
dB
F = F0 + 6 MHz
—
–26
—
dB
F = F0 – 6 MHz
—
–27
—
dB
F ≥ F0 + 8 MHz
—
–29
—
dB
F ≤ F0 – 8 MHz
—
–28
—
dB
—
—
–28
—
dB
F = Fimage + 2 MHz
—
–26
—
dB
F = Fimage – 2 MHz
—
–7
—
dB
30 MHz ~ 2000 MHz
—
–5
—
dBm
2003 MHz ~ 2399 MHz
—
–19
—
dBm
2484 MHz ~ 2997 MHz
—
–16
—
dBm
3000 MHz ~ 12.75 GHz
—
–5
—
dBm
—
—
–29
—
dBm
Adjacent channel selectivity C/I
Image frequency
Adjacent channel to image frequency
Out-of-band blocking performance
Intermodulation
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Min
Typ
Max
Unit
ESP32-C3 Series Datasheet v1.4
4 Electrical Characteristics
Table 34: Receiver Characteristics Bluetooth LE 125 Kbps
Parameter
Description
Sensitivity @30.8% PER
—
—
–105
—
dBm
Maximum received signal @30.8% PER
—
—
5
—
dBm
Co-channel C/I
—
—
3
—
dB
F = F0 + 1 MHz
—
–6
—
dB
F = F0 – 1 MHz
—
–6
—
dB
F = F0 + 2 MHz
—
–33
—
dB
F = F0 – 2 MHz
—
–43
—
dB
F = F0 + 3 MHz
—
–37
—
dB
F = F0 – 3 MHz
—
–47
—
dB
F ≥ F0 + 4 MHz
—
–40
—
dB
F ≤ F0 – 4 MHz
—
–50
—
dB
—
—
–40
—
dB
F = Fimage + 1 MHz
—
–50
—
dB
F = Fimage – 1 MHz
—
–37
—
dB
Adjacent channel selectivity C/I
Image frequency
Adjacent channel to image frequency
Min
Typ
Max
Unit
Table 35: Receiver Characteristics Bluetooth LE 500 Kbps
Parameter
Description
Sensitivity @30.8% PER
—
—
–100
—
dBm
Maximum received signal @30.8% PER
—
—
5
—
dBm
Co-channel C/I
—
—
3
—
dB
F = F0 + 1 MHz
—
–2
—
dB
F = F0 – 1 MHz
—
–3
—
dB
F = F0 + 2 MHz
—
–32
—
dB
F = F0 – 2 MHz
—
–33
—
dB
F = F0 + 3 MHz
—
–23
—
dB
F = F0 – 3 MHz
—
–40
—
dB
F ≥ F0 + 4 MHz
—
–34
—
dB
F ≤ F0 – 4 MHz
—
–44
—
dB
—
—
–34
—
dB
F = Fimage + 1 MHz
—
–46
—
dB
F = Fimage – 1 MHz
—
–23
—
dB
Adjacent channel selectivity C/I
Image frequency
Adjacent channel to image frequency
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Min
Typ
Max
Unit
ESP32-C3 Series Datasheet v1.4
5 Package Information
5. Package Information
Figure 9: QFN32 (5×5 mm) Package
Note:
• The source file of recommended PCB land pattern is provided for your reference. You can view it with Autodesk
Viewer;
• For reference PCB layout, please refer to ESP32-C3 Hardware Design Guidelines;
• For information about tape, reel, and product marking, please refer to Espressif Chip Packaging Information.
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ESP32-C3 Series Datasheet v1.4
6 Related Documentation and Resources
6. Related Documentation and Resources
Related Documentation
• ESP32-C3 Technical Reference Manual – Detailed information on how to use the ESP32-C3 memory and peripherals.
• ESP32-C3 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-C3 into your hardware product.
• ESP32-C3 Series SoC Errata – Descriptions of known errors in ESP32-C3 series of SoCs.
• Certificates
https://espressif.com/en/support/documents/certificates
• ESP32-C3 Product/Process Change Notifications (PCN)
https://espressif.com/en/support/documents/pcns?keys=ESP32-C3
• ESP32-C3 Advisories – Information on security, bugs, compatibility, component reliability.
https://espressif.com/en/support/documents/advisories?keys=ESP32-C3
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents
Developer Zone
• ESP-IDF Programming Guide for ESP32-C3 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos
Products
• ESP32-C3 Series SoCs – Browse through all ESP32-C3 SoCs.
https://espressif.com/en/products/socs?id=ESP32-C3
• ESP32-C3 Series Modules – Browse through all ESP32-C3-based modules.
https://espressif.com/en/products/modules?id=ESP32-C3
• ESP32-C3 Series DevKits – Browse through all ESP32-C3-based devkits.
https://espressif.com/en/products/devkits?id=ESP32-C3
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions
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ESP32-C3 Series Datasheet v1.4
Revision History
Revision History
Date
Version
Release Notes
• Deleted feature ”Antenna diversity” from Section 3.6.1 Bluetooth LE Radio and PHY
2022-12-15
v1.4
• Deleted feature ”Supports external power amplifier”
• Updated the glitch type of GPIO18 to high-level glitch in Table Power-Up
Glitches on Pins
• Updated notes for Table Power-Up Glitches on Pins
• Added links to the Technical Reference Manual and Peripheral Pin Configurations in Chapter 3 Functional Description
• Added a note about ADC2 error in Section 3.3.1 Analog-to-Digital Converter (ADC)
2022-11-15
v1.3
• Updated Section 3.8.3 Watchdog Timers
• Added Table ADC Calibration Results
• Updated Section 4.6.2 Current Consumption in Other Modes
• Updated RF transmit power in Section 4.9 Bluetooth LE Radio
• Updated the typo in Section 5 Package Information
• Updated Chapter 6 Related Documentation and Resources
• Added a new chip variant ESP32-C3FH4AZ;
2022-04-13
v1.2
• Updated Figure Block Diagram of ESP32-C3;
• Added the wake up source for Deep-sleep mode in Section 3.7 Low
Power Management.
• Updated Figure Block Diagram of ESP32-C3 to show power modes;
• Added CoreMark score in Features;
• Updated Table Pin Description to show default pin functions;
2021-10-26
v1.1
• Updated Figure ESP32-C3 Power Scheme and related descriptions;
• Added Table Mapping of SPI Signals and Chip Pins;
• Added note 3 to Table Recommended Operating Conditions;
• Other updates to wording.
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ESP32-C3 Series Datasheet v1.4
Revision History
Date
Version
Release Notes
• Updated power modes;
• Updated Section 2.4 Strapping Pins;
• Updated some clock names and their frequencies in Section 3.2 System
Clocks;
• Added clarification about ADC1 and ADC2 in Section 3.3.1 Analog-to-
2021-05-28
v1.0
Digital Converter (ADC);
• Updated the default configuration of U0RXD andU0TXD after reset in
Table IO MUX Pin Functions;
• Updated sampling rate in Table ADC Characteristics;
• Updated Table Reliability Qualifications;
• Added the link to recommended PCB land pattern in Chapter 5 Package
Information.
2021-04-23
v0.8
Updated Wi-Fi Radio and Bluetooth LE Radio data.
• Updated information about USB Serial/JTAG Controller;
• Added GPIO2 to Section 2.4 Strapping Pins;
• Updated Figure Address Mapping Structure;
• Added Table IO MUX Pin Functions and Table Power-Up Glitches on Pins
2021-04-07
v0.7
in Section 3.4.1 General Purpose Input / Output Interface (GPIO);
• Updated information about SPI2 in Section 3.4.2 Serial Peripheral Interface (SPI);
• Updated fixed-priority channel scheme in Section 3.4.8 General DMA
Controller;
• Updated Table Reliability Qualifications.
• Clarified that of the 400 KB SRAM, 16 KB is configured as cache;
2021-01-18
v0.6
• Updated maximum value to standard limit value in Table TX EVM Test in
Section 4.8.1 Wi-Fi RF Transmitter (TX) Specifications.
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ESP32-C3 Series Datasheet v1.4
Revision History
Date
Version
Release Notes
• Updated information about Wi-Fi;
• Added connection between embedded flash ports and chip pins to table notes in Section 2.2 Pin Description;
• Updated Figure ESP32-C3 Power Scheme, added Figure ESP32-C3
Power-up and Reset Timing and Table Description of ESP32-C3 Powerup and Reset Timing Parameters in Section 2.3 Power Scheme;
2021-01-13
v0.5
• Added Figure Setup and Hold Times for the Strapping Pins and Table
Parameter Descriptions of Setup and Hold Times for the Strapping Pins in
Section 2.4 Strapping Pins;
• Updated Table Peripheral Pin Configurations in Section 3.11 Peripheral
Pin Configurations;
• Added Chapter 4 Electrical Characteristics;
• Added Chapter 5 Package Information.
2020-11-27
v0.4
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ESP32-C3 Series Datasheet v1.4
Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO
WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information
in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any
intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
www.espressif.com
All trade names, trademarks and registered trademarks mentioned in this document are property
of their respective owners, and are hereby acknowledged.
Copyright © 2023 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.