0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
B36S3RGB-F6C0001HOU1930

B36S3RGB-F6C0001HOU1930

  • 厂商:

    HARVATEK(宏齐)

  • 封装:

    -

  • 描述:

    B36S3RGB-F6C0001HOU1930

  • 数据手册
  • 价格&库存
B36S3RGB-F6C0001HOU1930 数据手册
Top View Chip LED B36S3RGB-F6C0001HOU1930 Harvatek Surface Mount CHIP LEDs Data Sheet B36S3RGB-F6C0001HOU1930 7 Official Product HT Part No. B36S3RGB-F6C0001HOU1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 27/07/2022 V1.0 Page 1/17 Top View Chip LED B36S3RGB-F6C0001HOU1930 DISCLAIMER............................................................................................................................ 3 LIFE SUPPORT POLICY ............................................................................................................. 3 PRODUCT SPECIFICATIONS ................................................................................................. 4 ATTENTION: ELECTROSTATIC DISCHARGE (ESD) PROTECTION ............................................... 4 LABEL SPECIFICATIONS ....................................................................................................... 5 SPECIFICATIONS RANGE ...................................................................................................... 6 PRODUCT FEATURES ............................................................................................................ 6 ELECTRO-OPTICAL CHARACTERISTICS ...................................................................................... 7 PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR REFLOW SOLDERING ............................................................................................................................. 7 CHARACTERISTICS OF B36S3RGB .......................................................................................... 9 PRECAUTION FOR USE ....................................................................................................... 10 PACKAGING .......................................................................................................................... 11 TAPE DIMENSION ................................................................................................................... 11 REEL DIMENSION ................................................................................................................... 12 PACKING ............................................................................................................................... 12 DRY PACK ............................................................................................................................ 13 BAKING................................................................................................................................. 13 PRECAUTIONS ....................................................................................................................... 13 HANDLING OF SILICONE RESIN LEDS ............................................................................... 14 REFLOW SOLDERING .......................................................................................................... 15 REWORKING .......................................................................................................................... 15 CLEANING ............................................................................................................................. 15 CAUTIONS OF PICK AND PLACE .............................................................................................. 16 REVISE HISTORY ................................................................................................................... 16 7 Official Product HT Part No. B36S3RGB-F6C0001HOU1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 27/07/2022 V1.0 Page 2/17 Top View Chip LED B36S3RGB-F6C0001HOU1930 DISCLAIMER HARVATEK reserves the right to make changes without further notice to any products herein to improve reliability, function or design. HARVATEK does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. Life Support Policy HARVATEK’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of HARVATEK or HARVATEK INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 7 Official Product HT Part No. B36S3RGB-F6C0001HOU1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 27/07/2022 V1.0 Page 3/17 Top View Chip LED B36S3RGB-F6C0001HOU1930 Product Specifications Item Specification Luminous Intensity(Iv) Red : Material Quantity 32 mcd typical Green : 46 mcd typical Blue : 8 mcd typical R@5mA;G/B@2mA/ Ts= 25O C; Tolerance ±10% Dominant Wavelength Red : 621 nm typical Green : 532 nm typical Blue : 470 nm typical R@5mA;G/B@2mA/ Ts= 25O C;Tolerance ± 0.5nm Forward Voltage Red : 2.4 V maximum Green : 3.1 V maximum Blue : 3.1 V maximum R@5mA;G/B@2mA/ Ts= 25O C;Tolerance ± 0.05V Ir < =1 µA @ VR = 5 V Resin Dark Epoxy Carrier tape EIA 481-1A specs Conductive black tape Reel EIA 481-1A specs Conductive black Label HT standard Paper Packing bag 250x230mm Aluminum laminated bag/ no-zipper One reel per bag Carton HT standard Paper Non-specified 24000pcs/reel Others: Each immediate box consists of 28 reels. The 28 reels may not necessarily have the same lot number or the same bin combinations of Iv, λD and Vf. Each reel has a label identifying its specification; the immediate box consists of a product label. ※Remarks: This product should be operated in forward bias. If a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. ATTENTION: Electrostatic Discharge (ESD) protection The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts built with AlGalnP, GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must be taken during design and assembly. If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process. 7 Official Product HT Part No. B36S3RGB-F6C0001HOU1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 27/07/2022 V1.0 Page 4/17 Top View Chip LED B36S3RGB-F6C0001HOU1930 Label Specifications ■Harvatek P/N: B 36S 3 RGB- F6C- 0001 HO Product Package size Dice Q’ty Color Current Series Number Taping PCB 0.69(L) x 0.69(W) x 0.5(H) mm 3:Tri. RGB(Full color) R:5mA X001~XZZZ 1.Taping style 2. Q’ty G:2mA B:2mA ■Lot No.: 7 Official Product HT Part No. B36S3RGB-F6C0001HOU1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 27/07/2022 V1.0 Page 5/17 Top View Chip LED B36S3RGB-F6C0001HOU1930 Specifications Range ■Luminous Intensity (Iv) Bin: R@5mA;G/B @2mA B36S3RGB Series IV Red Green Blue HF3 21.3 26.7 HG3 30 37.5 HB3 5.4 6.8 HG1 24 30 HH1 33.5 42 HC1 6 7.5 HG2 26.7 33.5 HH2 37.5 47 HC2 6.8 8.5 HG3 30 37.5 HH3 42 52.5 HC3 7.5 9.4 HH1 33.5 42 HJ1 47 60 HD1 8.5 10.7 HH2 37.5 47 HJ2 52.5 65.7 HD2 9.4 12 HH3 42 52.5 HJ3 60 75 HD3 10.7 13.4 Note: It maintains a tolerance of ±10% on Luminous Intensity Dominant Wavelength (λD) Bin: R@5mA;G/B @2mA B36S3RGB Series WD Red Green Blue RH2 618 623 GH1 526 530 BH1 464 468 RH3 623 628 GH2 528 532 BH2 466 470 RH4 628 633 GH3 530 534 BH3 468 472 GH4 532 536 BH4 470 474 GH5 534 538 Note: It maintains a tolerance of ±0.5nm on Color Bin Forward Voltage (Vf) Bin: R@5mA;G/B @2mA B36S3RGB Series Vf Red E18 1.6 Green 2.4 F2A 2.1 Blue 3.1 F2A 2.1 3.1 Note: It maintains a tolerance of ±0.05V on forward voltage measurements 7 Official Product HT Part No. B36S3RGB-F6C0001HOU1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 27/07/2022 V1.0 Page 6/17 Top View Chip LED B36S3RGB-F6C0001HOU1930 Product Features Electro-Optical Characteristics ( TSoldering 25 ℃) Dominant Wavelength Code for parts Viewing Forward Voltage (V) Lighting Iv (mcd) /Chromaticity Coordinate Material IF (mA) Angle Color typ. Max TYP. nm / CIE (X,Y) Typ. B36S3RGB-F6 Red AlGanInP 1.9 2.4 621 32 5 B36S3RGB-F6 Green InGaN 2.5 3.1 532 46 2 B36S3RGB-F6 Blue InGaN 2.6 3.1 470 8 2 2 120 Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering (Unit :mm Tolerance: +/-0.1) Outline Dim. Suggest Soldering Pattern Soldering terminals may shift in the x, y direction. 7 Official Product HT Part No. B36S3RGB-F6C0001HOU1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 27/07/2022 V1.0 Page 7/17 1 2 Top View Chip LED B36S3RGB-F6C0001HOU1930 Absolute Maximum Ratings(絕對最大額定值) o (TS 25 C) Series PD (mW) IF (mA) IFP (mA) VR TOP (oC) TST (oC) (系列) (消耗功率) (順向電流) (脈衝順向電流) (反向電壓) (操作溫度) (儲存溫度) Operation Storage Color Power Dissipation Forward Current Pulse Forward Current Reverse Voltage Temperature Temperature -30~+80 -40~+85 Red/ Green 5 24.4 Blue 2 20 5 2 ** Condition for IFP is pulse of 1/10 duty and 0.1msec width Remarks:This product should be operated in forward bias.If a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. 7 Official Product HT Part No. B36S3RGB-F6C0001HOU1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 27/07/2022 V1.0 Page 8/17 Top View Chip LED B36S3RGB-F6C0001HOU1930 Characteristics of B36S3RGB Relative Intensity vs. Forward Current Forward Voltage vs. Forward Current Forward Current vs. Ambient Temperature Wavelength vs. Forward Current 7 Official Product HT Part No. B36S3RGB-F6C0001HOU1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 27/07/2022 V1.0 Page 9/17 Top View Chip LED B36S3RGB-F6C0001HOU1930 Precaution for Use 1. The chips should not be used directly in any type of fluid such as water, oil, organic solvent, etc. 2. When the LEDs are illuminating, the maximum ambient temperature should be first considered before operation. 3. LEDs must be stored in a clean environment. A sealed container with a nitrogen atmosphere is necessary if the storage period is over 3 months after shipping. 4. The LEDs must be used within 4weeks after unpacked. Unused products must be 5. 6. repacked in an anti-electrostatic package, folded to close any opening and then stored in a dry and cool space. The appearance and specifications of the products may be modified for improvement without further notice. The LEDs are sensitive to the static electricity and surge. It is strongly recommended to use a grounded wrist band and anti-electrostatic glove when handling the LEDs. If a voltage over the absolute maximum rating is applied to LEDs, it will damage LEDs. Damaged LEDs will show some abnormal characteristics such as remarkable increase of leak current, lower turn-on voltage and getting unlit at low current. 7 Official Product HT Part No. B36S3RGB-F6C0001HOU1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 27/07/2022 V1.0 Page 10/17 Top View Chip LED B36S3RGB-F6C0001HOU1930 Packaging Tape Dimension Dim. A Dim. B Dim. C Q’ty/Reel 0.77±0.03 0.77±0.03 0.55±0.05 24K Unit: mm 7 Official Product HT Part No. B36S3RGB-F6C0001HOU1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 27/07/2022 V1.0 Page 11/17 Top View Chip LED B36S3RGB-F6C0001HOU1930 Reel Dimension Packing 28 28 boxes per carton is available depending on shipment quantity. . 7 Official Product HT Part No. B36S3RGB-F6C0001HOU1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 27/07/2022 V1.0 Page 12/17 Top View Chip LED B36S3RGB-F6C0001HOU1930 Dry Pack All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times during transportation or storage. Every reel is packaged in a moisture protected anti-static bag. Each bag is properly sealed prior to shipment. A humidity indicator will be included in the moisture protected anti-static bag prior to shipment. The packaging sequence is as follows: Baking Baking before soldering is recommended when the package has been unsealed for 4weeks. The conditions are as followings: 1. MBB open≤672hrs, 50±3℃×(3hrs). 2. MBB open>672hrs, 50±3℃×(8~12hrs)and
B36S3RGB-F6C0001HOU1930 价格&库存

很抱歉,暂时无法提供与“B36S3RGB-F6C0001HOU1930”相匹配的价格&库存,您可以联系我们找货

免费人工找货