BK32001002-M

BK3-M SERIES Spark Gap (SPG) Data Sheet Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Approximately zero leaking current before clamping voltage Less decay at on/off state. High capability to withstand repeated lightning strikes. Low electrode capacitance(≤0.8pF) and high isolation(≥100MΩ). RoHS compliant. Bilateral symmetrical. Temperature, humidity and lightness insensitive. Operating temperature: -40℃ ~ +85℃ Storage temperature: -40℃ ~ +125℃ Meets MSL level 1, per J-STD-020 Safety certification: UL: E244458 Applications ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Power Supplies Motor sparks eliminating Relay switching spark absorbing Data line pulse guarding Electronic devices requiring UL497A and UL497B compliant Telephone/Fax/Modem High frequency signal transmitters/receivers Satellite antenna Radio amplifiers Alarm systems Cathode ray tubes in Monitors/TVs Dimensions 1.2 t d D L Revision：SPG-BK3-M SERIES-001(A2) 1.2 2.0 1.2 Recommended Pad Size(mm) 1/4 Symbol Dimension (mm) L 3.4±0.5 D Φ1.4±0.5 d Φ1.3±0.5 t 0.4±0.1 http://brightking.pulseelectronics.com BK3-M SERIES Electrical Characteristics Part Number DC Spark-over Voltage Minimum Insulation Resistance Maximum Capacitance (1KHz-6VMAX) Surge Current Capacity (8/20μs) Vs(V) Test Voltage(V) IROHM(MΩ) C(pf) BK3XX00702-M 140 50 100 0.8 300A BK3XX01002-M 200 100 100 0.8 300A BK3XX01502-M 300 100 100 0.8 300A Note：① Vs±XX% Test Methods and Results Items Test Method Standard DC Spark-over Voltage Measure starting discharge voltage (Vs) by gradually increasing applied DC voltage. Test current is 0.5mA max. And the DC voltage ascends up within 100V/s. Insulation Resistance Measure the insulation resistance across the terminal at regular voltage. But the test voltage doesn’t over the DC spark-over voltage. Capacitance Measure the electrostatic capacitance by applying a voltage of less than 6V (at 1KHz) between terminals. Static Life 10KV with 1500pf condenser is discharged through 0Ω resistor. 200 times at an interval of 10sec. Rate-of-change, within ±30% insulation resistance & capacitance, conformed to rated spec. Surge Current Capacity 1.2/50μs & 8/20μs, 300A, ±5 times, each time interval 60 seconds. Thereafter, outer appearance shall be visually examined. No crack and no failures Cold Resistance Measurement after -40℃/1000 HRS & normal temperature/2 HRS. Heat Resistance Measurement after 125℃/1000 HRS & normal temperature/2 HRS. Humidity Resistance Measurement after humidity 90~95℃(45℃) /1000 HRS & normal temperature/2 HRS. Temperature Cycle 10 times repetition of cycle -40℃/30min →normal, temp/2 min →125℃/30min, measurement after normal temp/2 HRS. Solder Ability Apply flux and immerse in molten solder 230±5℃ for 3sec up to the point of 1.5mm from body. Check for solder adhesion. Lead wire is evenly covered by solder. Solder Heat Measurement after lead wire is dipped up to the point of 1.5mm from body into 260±5℃ solder for 10sec. Conformed to rated spec. Revision：SPG-BK3-M SERIES-001(A2) 2/4 Meet specified value. Features are conformed to rated spec. http://brightking.pulseelectronics.com BK3-M SERIES Recommended Soldering Conditions Flow Soldering Conditions Air Priheat Soldering Reflow Soldering Conditions Air Priheat Cooling Soldering Cooling 260℃ 260℃ 250 250 △T Temperature (℃) Temperature (℃) △T 200 150 150~180℃ 200 150 150~180℃ 100 100 50 50 0 0 60~120 sec 60~120 sec 3~4 sec 10 sec. or less 60 sec. or less 1) Time shown in the above figures is measured from the point when chip surface reaches temperature. 2) Temperature difference in high temperature part should be within 110℃. 3) After soldering, do not force cool, allow the parts to cool gradually. Hand Soldering Solder iron temperature: 350±5℃ Heating time: 3 seconds max. General attention to soldering ● High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence strength, and the change of characteristic may occur. ● For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures exceeding 200℃ to fewer than 50 seconds. ● Please use a mild flux (containing less than 0.2wt% CI). Also, if the flux is water soluble, be sure to wash thoroughly to remove any residue from the underside of components that could affect resistance. Cleaning When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause cracking or a decrease in the adherence of the termination, we recommend that you use the conditions below. Frequency: 40kHz max. Output power: 20W/liter Cleaning time: 5 minutes max. Revision：SPG-BK3-M SERIES-001(A2) 3/4 http://brightking.pulseelectronics.com BK3-M SERIES Packaging Tape P0 P1 P2 D0 B T E F A A D1 W B B0 K0 Symbol Dimension (mm) W 8.00±0.30 P0 4.00±0.10 P1 4.00±0.10 P2 2.00±0.10 D0 Φ1.5±0.10 D1 Φ1.0±0.10 E 1.50±0.10 F 3.40±0.10 A0 1.60±0.10 K0 1.60±0.10 B0 4.00±0.10 T 0.20±0.10 D 178.0±3.0 d 13.0±1.0 L 11.0±3.0 SECTION B-B A0 SECTION A-A Reel d D L Quantity: 3000PCS Revision：SPG-BK3-M SERIES-001(A2) 4/4 http://brightking.pulseelectronics.com