ESP32S3MINI1
ESP32S3MINI1U
Datasheet
Smallsized module supporting 2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 (LE)
Built around ESP32S3 series of SoCs, Xtensa® dualcore 32bit LX7 microprocessor
Flash up to 8 MB, optional 2 MB PSRAM in chip package
39 GPIOs, rich set of peripherals
Onboard PCB antenna or external antenna connector
ESP32S3MINI1
ESP32S3MINI1U
Version1.0
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Copyright © 2022
www.espressif.com
1 Module Overview
1 Module Overview
Note:
Check the link or the QR code to make sure that you use the latest version of this document:
https://www.espressif.com/sites/default/files/documentation/esp32-s3-mini-1_mini-1u_datasheet_
en.pdf
1.1 Features
CPU and OnChip Memory
Peripherals
• ESP32-S3 embedded, Xtensa® dual-core 32-bit
• GPIO, SPI, LCD interface, Camera interface,
LX7 microprocessor, up to 240 MHz
UART, I2C, I2S, remote control, pulse counter,
LED PWM, USB 1.1 OTG, USB Serial/JTAG
• 384 KB ROM
controller, MCPWM, SDIO host, GDMA, TWAI®
controller (compatible with ISO 11898-1, i.e.
• 512 KB SRAM
CAN Specification 2.0), ADC, touch sensor,
• 16 KB SRAM in RTC
temperature sensor, timers and watchdogs
• Up to 8 MB Quad SPI flash
Integrated Components on Module
• 2 MB PSRAM (ESP32-S3FH4R2 only)
• 40 MHz crystal oscillator
WiFi
Antenna Options
• On-board PCB antenna
• 802.11 b/g/n
(ESP32-S3-MINI-1)
• Bit rate: 802.11n up to 150 Mbps
• External antenna via a connector
(ESP32-S3-MINI-1U)
• A-MPDU and A-MSDU aggregation
• 0.4 µs guard interval support
Operating Conditions
• Center frequency range of operating channel:
• Operating voltage/Power supply: 3.0 ~ 3.6 V
2412 ~ 2484 MHz
• Operating ambient temperature:
– 85 °C version: –40 ~ 85 °C
Bluetooth
– 105 °C version: –40 ~ 105 °C
• Bluetooth LE: Bluetooth 5, Bluetooth mesh
Certification
• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
• RF certification: See certificates for
• Advertising extensions
ESP32-S3-MINI-1 and ESP32-S3-MINI-1U
• Multiple advertisement sets
• Green certification: RoHS/REACH
• Channel selection algorithm #2
Test
• Internal co-existence mechanism between Wi-Fi
and Bluetooth to share the same antenna
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1 Module Overview
1.2 Description
ESP32-S3-MINI-1 and ESP32-S3-MINI-1U are two powerful, generic Wi-Fi + Bluetooth LE MCU modules that
feature a rich set of peripherals, yet an optimized size. They are an ideal choice for a wide variety of application
scenarios related to Internet of Things (IoT), such as embedded systems, smart home, wearable electronics,
etc.
ESP32-S3-MINI-1 comes with a PCB antenna. ESP32-S3-MINI-1U comes with an external antenna connector.
The variants and ordering information for the module are shown in Table 1.
Table 1: Ordering Information
Ordering Code
Chip Embedded
Flash (MB)
PSRAM (MB)
ESP32-S3-MINI-1-N8 (85 °C)
ESP32-S3FN8
8 (Quad SPI)
0
ESP32-S3-MINI-1-N4R2 (85 °C)
ESP32-S3FH4R2
4 (Quad SPI)
2 (Quad SPI)
ESP32-S3-MINI-1-H4R2 (105 °C)
ESP32-S3FH4R2
4 (Quad SPI)
2 (Quad SPI)
ESP32-S3-MINI-1U-N8 (85 °C)
ESP32-S3FN8
8 (Quad SPI)
0
ESP32-S3-MINI-1U-N4R2 (85 °C)
ESP32-S3FH4R2
4 (Quad SPI)
2 (Quad SPI)
ESP32-S3-MINI-1U-H4R2 (105 °C)
ESP32-S3FH4R2
4 (Quad SPI)
2 (Quad SPI)
1
Dimensions (mm)
15.4 × 20.5 × 2.4
15.4 × 15.4 × 2.4
The ESP32-S3FH4R2 chip is not yet in mass production, so modules embedded with this chip are still in sample
status.
At the core of the modules is an ESP32-S3, an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. You
can power off the CPU and make use of the low-power co-processor to constantly monitor the peripherals for
changes or crossing of thresholds.
ESP32-S3 integrates a rich set of peripherals including SPI, LCD, Camera interface, UART, I2C, I2S, remote
control, pulse counter, LED PWM, USB Serial/Jtag, MCPWM, SDIO host, GDMA, TWAI® controller (compatible
with ISO 11898-1, i.e., CAN Specification 2.0), ADC, touch sensor, temperature sensor, timers and watchdogs,
as well as up to 45 GPIOs. It also includes a full-speed USB 1.1 On-The-Go (OTG) interface to enable USB
communication.
Note:
* For more information on ESP32-S3, please refer to ESP32-S3 Series Datasheet .
1.3 Applications
• Generic Low-power IoT Sensor Hub
• Mesh Network
• Generic Low-power IoT Data Loggers
• Home Automation
• Cameras for Video Streaming
• Smart Building
• Over-the-top (OTT) Devices
• Industrial Automation
• USB Devices
• Smart Agriculture
• Speech Recognition
• Audio Applications
• Image Recognition
• Health Care Applications
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1 Module Overview
• Wi-Fi-enabled Toys
• Retail & Catering Applications
• Wearable Electronics
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Contents
Contents
1
Module Overview
2
1.1
Features
2
1.2
Description
3
1.3
Applications
3
2
Block Diagram
8
3
Pin Definitions
9
3.1
Pin Layout
9
3.2
Pin Description
10
3.3
Strapping Pins
11
4
Electrical Characteristics
14
4.1
Absolute Maximum Ratings
14
4.2
Recommended Operating Conditions
14
4.3
DC Characteristics (3.3 V, 25 °C)
14
4.4
Current Consumption Characteristics
15
4.5
Wi-Fi RF Characteristics
15
4.5.1
Wi-Fi RF Standards
15
4.5.2
Wi-Fi RF Transmitter (TX) Specifications
16
4.5.3
Wi-Fi RF Receiver (RX) Specifications
17
4.6
Bluetooth LE Radio
18
4.6.1
Bluetooth LE RF Transmitter (TX) Specifications
18
4.6.2
Bluetooth LE RF Receiver (RX) Specifications
20
5
Module Schematics
23
6
Peripheral Schematics
25
7
Physical Dimensions and PCB Land Pattern
26
7.1
Physical Dimensions
26
7.2
Recommended PCB Land Pattern
28
7.3
Dimensions of External Antenna Connector
30
8
Product Handling
31
8.1
Storage Conditions
31
8.2
Electrostatic Discharge (ESD)
31
8.3
Reflow Profile
31
8.4
Ultrasonic Vibration
32
9
Related Documentation and Resources
33
Revision History
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List of Tables
List of Tables
1
Ordering Information
2
Pin Definitions
10
3
JTAG Signal Source Selection
12
4
Strapping Pins
12
5
The Default Value for VDD_SPI Voltage
13
6
Parameter Descriptions of Setup and Hold Times for the Strapping Pin
13
7
Absolute Maximum Ratings
14
8
Recommended Operating Conditions
14
9
DC Characteristics (3.3 V, 25 °C)
14
10
Current Consumption Depending on RF Modes
15
11
Current Consumption Depending on Work Modes
15
12
Wi-Fi RF Standards
16
13
TX Power with Spectral Mask and EVM Meeting 802.11 Standards
16
14
TX EVM Test
16
15
RX Sensitivity
17
16
Maximum RX Level
17
17
RX Adjacent Channel Rejection
18
18
Bluetooth LE Frequency
18
19
Transmitter Characteristics - Bluetooth LE 1 Mbps
18
20
Transmitter Characteristics - Bluetooth LE 2 Mbps
19
21
Transmitter Characteristics - Bluetooth LE 125 Kbps
19
22
Transmitter Characteristics - Bluetooth LE 500 Kbps
19
23
Receiver Characteristics - Bluetooth LE 1 Mbps
20
24
Receiver Characteristics - Bluetooth LE 2 Mbps
21
25
Receiver Characteristics - Bluetooth LE 125 Kbps
21
26
Receiver Characteristics - Bluetooth LE 500 Kbps
22
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List of Figures
List of Figures
1
ESP32-S3-MINI-1 Block Diagram
8
2
ESP32-S3-MINI-1U Block Diagram
8
3
Pin Layout (Top View)
9
4
Setup and Hold Times for the Strapping Pin
13
5
ESP32-S3-MINI-1 Schematics
23
6
ESP32-S3-MINI-1U Schematics
24
7
Peripheral Schematics
25
8
ESP32-S3-MINI-1 Physical Dimensions
26
9
ESP32-S3-MINI-1U Physical Dimensions
26
10
ESP32-S3-MINI-1 Recommended PCB Land Pattern
28
11
ESP32-S3-MINI-1U Recommended PCB Land Pattern
29
12
Dimensions of External Antenna Connector
30
13
Reflow Profile
31
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2 Block Diagram
2 Block Diagram
ESP32-S2-MINI-2
40 MHz
Crystal
40
MHz
3V3
ESP32-S3-MINI-1
Antenna
Crystal
3V3
Antenna
RF Matching
EN
EN
ESP32-S2FH4
ESP32-S2FN4R2
ESP32-S3FN8
RF Matching
GPIOs
ESP32-S3FH4R2
FLASH
(QSPI)
FLASH
(QSPI)
GPIOs
PSRAM(opt.)
(QSPI)
PSRAM(opt.)
(QSPI)
Figure 1: ESP32S3MINI1 Block Diagram
ESP32-S3-MINI-1U
40 MHz
Crystal
40
MHz
3V3
ESP32-S2-MINI-2U
Crystal
3V3
Antenna
Antenna
RF Matching
EN
EN
ESP32-S3FN8
ESP32-S3FH4R2
ESP32-S2FH4
RF Matching
GPIOs
ESP32-S2FN4R2
FLASH
(QSPI)
FLASH
(QSPI)
GPIOs
PSRAM(opt.)
(QSPI)
PSRAM(opt.)
(QSPI)
Figure 2: ESP32S3MINI1U Block Diagram
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3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout
The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 7.1 Physical Dimensions.
The pin diagram is applicable for ESP32-S3-MINI-1 and ESP32-S3-MINI-1U, but the latter has no keepout
zone.
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin 59
Pin 58
Pin 57
Pin 56
Pin 55
Pin 54
Pin 53
Pin 52
Pin 51
Pin 50
Pin 49
Pin 48
Pin 47
Pin 46
Pin 62
GND
Pin 60
Keepout Zone
Pin 65
GND
GND
Pin 1
Pin 45
EN
GND
Pin 2
Pin 44
IO46
3V3
Pin 3
Pin 43
GND
IO0
Pin 4
Pin 42
GND
Pin 41
IO45
Pin 40
RXD0
Pin 39
TXD0
Pin 38
IO42
Pin 37
IO41
IO1
Pin 5
IO2
Pin 6
IO3
Pin 7
IO4
Pin 8
IO5
Pin 9
GND
GND
GND
GND
Pin 61
GND
GND
IO6
Pin 10
Pin 36
IO40
IO7
Pin 11
Pin 35
IO39
IO8
Pin 12
Pin 34
IO38
IO9
Pin 13
Pin 33
IO37
IO10
Pin 14
Pin 32
IO36
IO11
Pin 15
Pin 31
IO35
Pin 27
Pin 28
Pin 29
Pin 30
IO33
IO34
IO48
Pin 26
IO26
IO47
Pin 24
Pin 25
IO19
IO21
Pin 23
IO18
GND
IO20
Pin 21
Pin 22
GND
IO17
Pin 20
IO16
Pin 18
IO14
IO15
Pin 17
IO13
Pin 19
Pin 16
IO12
Pin 63
GND
GND
Pin 64
GND
Figure 3: Pin Layout (Top View)
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3 Pin Definitions
3.2 Pin Description
The module has 65 pins. See pin definitions in Table 2.
For explanations of pin names and function names, as well as configurations of peripheral pins, please refer to
ESP32-S3 Series Datasheet .
Table 2: Pin Definitions
Type a Function
Name
No.
GND
1, 2, 42, 43, 46-65
P
GND
3V3
3
P
Power supply
IO0
4
I/O/T
RTC_GPIO0, GPIO0
IO1
5
I/O/T
RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0
IO2
6
I/O/T
RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1
IO3
7
I/O/T
RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2
IO4
8
I/O/T
RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3
IO5
9
I/O/T
RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4
IO6
10
I/O/T
RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5
IO7
11
I/O/T
RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6
IO8
12
I/O/T
RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1
IO9
13
I/O/T
RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD
IO10
14
I/O/T
IO11
15
I/O/T
IO12
16
I/O/T
IO13
17
I/O/T
IO14
18
I/O/T
IO15
19
I/O/T
RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
IO16
20
I/O/T
RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
IO17
21
I/O/T
RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6
IO18
22
I/O/T
RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3
IO19
23
I/O/T
RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D
IO20
24
I/O/T
RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
IO21
25
I/O/T
RTC_GPIO21, GPIO21
IO26
26
I/O/T
SPICS1, GPIO26
IO47
27
I/O/T
SPICLK_P_DIFF, GPIO47, SUBSPICLK_P_DIFF
IO33
28
I/O/T
SPIIO4, GPIO33, FSPIHD, SUBSPIHD
IO34
29
I/O/T
SPIIO5, GPIO34, FSPICS0, SUBSPICS0
IO48
30
I/O/T
SPICLK_N_DIFF, GPIO48, SUBSPICLK_N_DIFF
IO35
31
I/O/T
SPIIO6, GPIO35, FSPID, SUBSPID
IO36
32
I/O/T
SPIIO7, GPIO36, FSPICLK, SUBSPICLK
b
RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4,
SUBSPICS0
RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5,
SUBSPID
RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6,
SUBSPICLK
RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7,
SUBSPIQ
RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS,
SUBSPIWP
Cont’d on next page
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3 Pin Definitions
Table 2 – cont’d from previous page
a
Name
No.
Type
Function
IO37
33
I/O/T
SPIDQS, GPIO37, FSPIQ, SUBSPIQ
IO38
34
I/O/T
GPIO38, FSPIWP, SUBSPIWP
IO39
35
I/O/T
MTCK, GPIO39, CLK_OUT3, SUBSPICS1
IO40
36
I/O/T
MTDO, GPIO40, CLK_OUT2
IO41
37
I/O/T
MTDI, GPIO41, CLK_OUT1
IO42
38
I/O/T
MTMS, GPIO42
TXD0
39
I/O/T
U0TXD, GPIO43, CLK_OUT1
RXD0
40
I/O/T
U0RXD, GPIO44, CLK_OUT2
IO45
41
I/O/T
GPIO45
IO46
44
I/O/T
GPIO46
High: on, enables the chip.
EN
45
I
Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
a
P: power supply; I: input; O: output; T: high impedance. Pin functions in bold font are the default pin functions.
For pin 28 ∼ 29, 31 ∼ 33, the default function is decided by eFuse bit.
b
For modules with ordering codes ending with -N4R2 and -H4R2, IO26 connects to the embedded PSRAM and
is not available for other uses.
3.3 Strapping Pins
Note:
The content below is excerpted from Section Strapping Pins in ESP32-S3 Series Datasheet . For the strapping pin mapping between the chip and modules, please refer to Chapter 5 Module Schematics.
ESP32-S3 has four strapping pins:
• GPIO0
• GPIO45
• GPIO46
• GPIO3
Software can read the values of corresponding bits from register “GPIO_STRAPPING”.
During the chip’s system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog
reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as
strapping bits of “0” or “1”, and hold these bits until the chip is powered down or shut down.
GPIO0, GPIO45 and GPIO46 are connected to the chip’s internal weak pull-up/pull-down during the chip reset.
Consequently, if they are unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of these strapping pins.
GPIO3 is floating by default. Its strapping value can be configured to determine the source of the JTAG signal
inside the CPU, as shown in Table 4. In this case, the strapping value is controlled by the external circuit that
cannot be in a high impedance state. Table 3 shows more configuration combinations of
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3 Pin Definitions
EFUSE_DIS_USB_JTAG, EFUSE_DIS_PAD_JTAG, and EFUSE_STRAP_JTAG_SEL that determine the JTAG
signal source.
Table 3: JTAG Signal Source Selection
EFUSE_STRAP_JTAG_SEL
EFUSE_DIS_USB_JTAG
EFUSE_DIS_PAD_JTAG
JTAG Signal Source
1
0
0
Refer to Table 4
0
0
0
USB Serial/JTAG controller
don’t care
0
1
USB Serial/JTAG controller
don’t care
1
0
On-chip JTAG pins
don’t care
1
1
N/A
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-S3.
After reset, the strapping pins work as normal-function pins.
Refer to Table 4 for a detailed configuration of the strapping pins.
Table 4: Strapping Pins
VDD_SPI Voltage
Pin
Default
3.3 V
GPIO45
Pull-down
0
1.8 V
1
Booting Mode
1
Pin
Default
SPI Boot
Download Boot
GPIO0
Pull-up
1
0
GPIO46
Pull-down
Don’t care
0
Enabling/Disabling ROM Messages Print During Booting 2
Pin
Default
Enabled
Disabled
GPIO46
Pull-down
See the 2nd note
See the 2nd note
JTAG Signal Selection
Pin
Default
GPIO3
N/A
EFUSE_DIS_USB_JTAG = 0, EFUSE_DIS_PAD_JTAG = 0,
EFUSE_STRAP_JTAG_SEL=1
0: JTAG signal from on-chip JTAG pins
1: JTAG signal from USB Serial/JTAG controller
Note:
1. The strapping combination of GPIO46 = 1 and GPIO0 = 0 is invalid and will trigger unexpected behavior.
2. By default, the ROM boot messages are printed over UART0 (U0TXD pin) and USB Serial/JTAG controller together.
The ROM code printing can be disabled through configuration register and eFuse. For detailed information, please
refer to Chapter Chip Boot Control in ESP32-S3 Technical Reference Manual.
VDD_SPI voltage is determined either by the strapping value of GPIO45 or by EFUSE_VDD_SPI_TIEH. When
EFUSE_VDD_SPI_FORCE is 0, VDD_SPI voltage is determined by the strapping value of GPIO45; when
EFUSE_VDD_SPI_FORCE is 1, VDD_SPI voltage is determined by EFUSE_VDD_SPI_TIEH. Please refer to the
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3 Pin Definitions
following table for default configurations:
Table 5: The Default Value for VDD_SPI Voltage
Chip Variant
EFUSE_VDD_SPI_FORCE
EFUSE_VDD_SPI_TIEH
VDD_SPI Voltage
ESP32-S3
0
0
Determined by GPIO45
ESP32-S3R2
1
1
Force to 3.3 V
ESP32-S3R8
1
1
Force to 3.3 V
ESP32-S3R8V
1
0
Force to 1.8 V
ESP32-S3FN8
1
1
Force to 3.3 V
ESP32-S3FH4R2
1
1
Force to 3.3 V
Figure 4 shows the setup and hold times for the strapping pin before and after the CHIP_PU signal goes high.
Details about the parameters are listed in Table 6.
tSU
CHIP_PU
tHD
VIL_nRST
VIH
Strapping pin
Figure 4: Setup and Hold Times for the Strapping Pin
Table 6: Parameter Descriptions of Setup and Hold Times for the Strapping Pin
Parameter
Description
tSU
Setup time before CHIP_PU goes from low to high
0
tHD
Hold time after CHIP_PU goes high
3
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4 Electrical Characteristics
4 Electrical Characteristics
4.1 Absolute Maximum Ratings
Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these or any other conditions beyond those
indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
Table 7: Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
VDD33
Power supply voltage
–0.3
3.6
V
TST ORE
Storage temperature
–40
105
°C
4.2 Recommended Operating Conditions
Table 8: Recommended Operating Conditions
Symbol
Parameter
Min
Typ
Max
VDD33
IV DD
TA
Operating ambient temperature
Power supply voltage
3.0
3.3
3.6
V
Current delivered by external power supply
0.5
—
—
A
–40
—
85 °C version
105 °C version
Unit
85
°C
105
4.3 DC Characteristics (3.3 V, 25 °C)
Table 9: DC Characteristics (3.3 V, 25 °C)
Symbol
Parameter
CIN
Pin capacitance
VIH
Min
—
High-level input voltage
0.75 × VDD
1
Typ
Max
Unit
2
—
pF
—
1
VDD + 0.3
V
1
VIL
Low-level input voltage
–0.3
—
0.25 × VDD
IIH
High-level input current
—
—
50
nA
Low-level input current
—
—
50
nA
—
—
IIL
VOH
VOL
2
2
High-level output voltage
0.8 × VDD
Low-level output voltage
1
V
V
1
—
—
0.1 × VDD
V
—
40
—
mA
—
28
—
mA
1
IOH
IOL
High-level source current (VDD = 3.3 V, VOH >=
2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1 = 3.3 V, VOL =
0.495 V, PAD_DRIVER = 3)
RP U
Internal weak pull-up resistor
—
45
—
kΩ
RP D
Internal weak pull-down resistor
—
45
—
kΩ
0.75 × VDD1
—
VDD1+ 0.3
V
VIH_nRST
Chip reset release voltage (EN voltage is within
the specified range)
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Table 9 – cont’d from previous page
Symbol
VIL_nRST
Parameter
Chip reset voltage (EN voltage is within the
specified range)
1
VDD is the I/O voltage for pins of a particular power domain.
2
VOH and VOL are measured using high-impedance load.
Min
Typ
Max
Unit
–0.3
—
0.25 × VDD1
V
4.4 Current Consumption Characteristics
With the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section Low Power Management
in ESP32-S3 Series Datasheet .
Table 10: Current Consumption Depending on RF Modes
Work mode
Description
TX
Active (RF working)
RX
1
Peak (mA)
802.11b, 1 Mbps, @20.5 dBm
355
802.11g, 54 Mbps, @18 dBm
297
802.11n, HT20, MCS 7, @17.5 dBm
286
802.11n, HT40, MCS 7, @17 dBm
285
802.11b/g/n, HT20
95
802.11n, HT40
97
The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient
temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle.
2
The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle.
Note that the data in Table 11 only applies to the module variants that embed the chip variant ESP32-S3.
Table 11: Current Consumption Depending on Work Modes
Work mode
Description
Typ 2
Unit
Light-sleep
—
240 1
µA
Deep-sleep
Power off
1
RTC memory and RTC peripherals are powered on.
8
µA
RTC memory is powered on. RTC peripherals are powered off.
7
µA
CHIP_PU is set to low level. The chip is powered off.
1
µA
An extra PSRAM consumption of 40 µA should be added for modules embedded with ESP32S3FH4R2 chip.
2
Please refer to ESP32-S3 Series Datasheet if there are any inconsistencies.
4.5 WiFi RF Characteristics
4.5.1 WiFi RF Standards
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Table 12: WiFi RF Standards
Name
Description
Center frequency range of operating channel
1
Wi-Fi wireless standard
2412 ~ 2484 MHz
IEEE 802.11b/g/n
11b: 1, 2, 5.5 and 11 Mbps
20 MHz
Data rate
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz
11n: MCS0-7, 150 Mbps (Max)
PCB antenna, external antenna via the connector 2
Antenna type
1
11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
Device should operate in the center frequency range allocated by regional regulatory authorities. Target
center frequency range is configurable by software.
2
For the modules that use external antennas, the output impedance is 50 Ω. For other modules without
external antennas, the output impedance is irrelevant.
4.5.2 WiFi RF Transmitter (TX) Specifications
Target TX power is configurable based on device or certification requirements. The default characteristics are
provided in Table 13.
Table 13: TX Power with Spectral Mask and EVM Meeting 802.11 Standards
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11b, 1 Mbps
—
20.5
—
802.11b, 11 Mbps
—
20.5
—
802.11g, 6 Mbps
—
20.0
—
802.11g, 54 Mbps
—
18.0
—
802.11n, HT20, MCS 0
—
19.0
—
802.11n, HT20, MCS 7
—
17.5
—
802.11n, HT40, MCS 0
—
18.5
—
802.11n, HT40, MCS 7
—
17.0
—
Rate
Table 14: TX EVM Test
Rate
Typ
SL1
(dB)
(dB)
(dB)
802.11b, 1 Mbps, @20.5 dBm
—
–24.5
–10
802.11b, 11 Mbps, @20.5 dBm
—
–24.5
–10
802.11g, 6 Mbps, @20 dBm
—
–23.0
–5
802.11g, 54 Mbps, @18 dBm
—
–29.5
–25
802.11n, HT20, MCS 0, @19 dBm
—
–24.0
–5
802.11n, HT20, MCS 7, @17.5 dBm
—
–30.5
–27
802.11n, HT40, MCS 0, @18.5 dBm
—
–25.0
–5
802.11n, HT40, MCS 7, @17 dBm
—
–30.0
–27
1
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4.5.3 WiFi RF Receiver (RX) Specifications
Table 15: RX Sensitivity
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11b, 1 Mbps
—
–98.2
—
802.11b, 2 Mbps
—
–95.6
—
802.11b, 5.5 Mbps
—
–92.8
—
802.11b, 11 Mbps
—
–88.5
—
802.11g, 6 Mbps
—
–93.0
—
802.11g, 9 Mbps
—
–92.0
—
802.11g, 12 Mbps
—
–90.8
—
802.11g, 18 Mbps
—
–88.5
—
802.11g, 24 Mbps
—
–85.5
—
802.11g, 36 Mbps
—
–82.2
—
802.11g, 48 Mbps
—
–78.0
—
802.11g, 54 Mbps
—
–76.2
—
802.11n, HT20, MCS 0
—
–93.0
—
802.11n, HT20, MCS 1
—
–90.6
—
802.11n, HT20, MCS 2
—
–88.4
—
802.11n, HT20, MCS 3
—
–84.8
—
802.11n, HT20, MCS 4
—
–81.6
—
802.11n, HT20, MCS 5
—
–77.4
—
802.11n, HT20, MCS 6
—
–75.6
—
802.11n, HT20, MCS 7
—
–74.2
—
802.11n, HT40, MCS 0
—
–90.0
—
802.11n, HT40, MCS 1
—
–87.5
—
802.11n, HT40, MCS 2
—
–85.0
—
802.11n, HT40, MCS 3
—
–82.0
—
802.11n, HT40, MCS 4
—
–78.5
—
802.11n, HT40, MCS 5
—
–74.4
—
802.11n, HT40, MCS 6
—
–72.5
—
802.11n, HT40, MCS 7
—
–71.2
—
Rate
Table 16: Maximum RX Level
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11b, 1 Mbps
—
5
—
802.11b, 11 Mbps
—
5
—
802.11g, 6 Mbps
—
5
—
802.11g, 54 Mbps
—
0
—
802.11n, HT20, MCS 0
—
5
—
802.11n, HT20, MCS 7
—
0
—
Rate
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Table 16 – cont’d from previous page
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11n, HT40, MCS 0
—
5
—
802.11n, HT40, MCS 7
—
0
—
Rate
Table 17: RX Adjacent Channel Rejection
Rate
Min
Typ
Max
(dB)
(dB)
(dB)
802.11b, 1 Mbps
—
35
—
802.11b, 11 Mbps
—
35
—
802.11g, 6 Mbps
—
31
—
802.11g, 54 Mbps
—
14
—
802.11n, HT20, MCS 0
—
31
—
802.11n, HT20, MCS 7
—
13
—
802.11n, HT40, MCS 0
—
19
—
802.11n, HT40, MCS 7
—
8
—
4.6 Bluetooth LE Radio
Table 18: Bluetooth LE Frequency
Parameter
Center frequency of operating channel
Min
Typ
Max
(MHz)
(MHz)
(MHz)
2402
—
2480
4.6.1 Bluetooth LE RF Transmitter (TX) Specifications
Table 19: Transmitter Characteristics Bluetooth LE 1 Mbps
Parameter
RF transmit power
Carrier frequency offset and drift
Modulation characteristics
Description
Min
RF power control range
Typ
Max
Unit
–25.00
0
20.00
Gain control step
—
3.00
—
dB
Max |fn |n=0, 1, 2, ..k
—
2.50
—
kHz
Max |f0 − fn |
—
2.00
—
kHz
Max |fn − fn−5 |
—
1.40
—
kHz
|f1 − f0 |
—
1.00
—
kHz
∆ f 1avg
—
249.00
—
kHz
—
198.00
—
kHz
—
0.86
—
—
Min ∆ f 2max (for at least
99.9% of all ∆ f 2max )
∆ f 2avg /∆ f 1avg
dBm
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Table 19 – cont’d from previous page
Parameter
Description
In-band spurious emissions
Min
Typ
Max
Unit
±2 MHz offset
—
–37.00
—
dBm
±3 MHz offset
—
–42.00
—
dBm
>±3 MHz offset
—
–44.00
—
dBm
Table 20: Transmitter Characteristics Bluetooth LE 2 Mbps
Parameter
Description
Min
RF power control range
RF transmit power
Carrier frequency offset and drift
Modulation characteristics
In-band spurious emissions
Typ
Max
Unit
–25.00
0
20.00
Gain control step
—
3.00
—
dB
Max |fn |n=0, 1, 2, ..k
—
2.50
—
kHz
Max |f0 − fn |
—
2.00
—
kHz
Max |fn − fn−5 |
—
1.40
—
kHz
|f1 − f0 |
—
1.00
—
kHz
∆ f 1avg
—
499.00
—
kHz
—
416.00
—
kHz
∆ f 2avg /∆ f 1avg
—
0.89
—
—
±4 MHz offset
—
–42.00
—
dBm
±5 MHz offset
—
–44.00
—
dBm
>±5 MHz offset
—
–47.00
—
dBm
Min ∆ f 2max (for at least
99.9% of all ∆ f 2max )
dBm
Table 21: Transmitter Characteristics Bluetooth LE 125 Kbps
Parameter
Description
Min
RF power control range
RF transmit power
Carrier frequency offset and drift
Modulation characteristics
Max
Unit
–25.00
0
20.00
Gain control step
—
3.00
—
dB
Max |fn |n=0, 1, 2, ..k
—
0.80
—
kHz
Max |f0 − fn |
—
1.00
—
kHz
|fn − fn−3 |
—
0.30
—
kHz
|f0 − f3 |
—
1.00
—
kHz
∆ f 1avg
—
248.00
—
kHz
—
222.00
—
kHz
±2 MHz offset
—
–37.00
—
dBm
±3 MHz offset
—
–42.00
—
dBm
>±3 MHz offset
—
–44.00
—
dBm
Min ∆ f 1max (for at least
99.9% of all∆ f 1max )
In-band spurious emissions
Typ
dBm
Table 22: Transmitter Characteristics Bluetooth LE 500 Kbps
Parameter
RF transmit power
Description
Min
RF power control range
Typ
Max
–25.00
0
20.00
—
3.00
—
Gain control step
Unit
dBm
dB
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Table 22 – cont’d from previous page
Parameter
Description
Carrier frequency offset and drift
Modulation characteristics
Min
Max
Unit
Max |fn |n=0, 1, 2, ..k
—
0.80
—
kHz
Max |f0 − fn |
—
1.00
—
kHz
|fn − fn−3 |
—
0.85
—
kHz
|f0 − f3 |
—
0.34
—
kHz
∆ f 2avg
—
213.00
—
kHz
—
196.00
—
kHz
±2 MHz offset
—
–37.00
—
dBm
±3 MHz offset
—
–42.00
—
dBm
>±3 MHz offset
—
–44.00
—
dBm
Min ∆ f 2max (for at least
99.9% of all ∆ f 2max )
In-band spurious emissions
Typ
4.6.2 Bluetooth LE RF Receiver (RX) Specifications
Table 23: Receiver Characteristics Bluetooth LE 1 Mbps
Parameter
Description
Sensitivity @30.8% PER
—
—
–96.5
—
dBm
Maximum received signal @30.8% PER
—
—
8
—
dBm
Co-channel C/I
F = F0 MHz
—
8
—
dB
F = F0 + 1 MHz
—
4
—
dB
F = F0 – 1 MHz
—
4
—
dB
F = F0 + 2 MHz
—
–23
—
dB
F = F0 – 2 MHz
—
–23
—
dB
F = F0 + 3 MHz
—
–34
—
dB
F = F0 – 3 MHz
—
–34
—
dB
F > F0 + 3 MHz
—
–36
—
dB
F > F0 – 3 MHz
—
–37
—
dB
—
—
–36
—
dB
F = Fimage + 1 MHz
—
–39
—
dB
F = Fimage – 1 MHz
—
–34
—
dB
30 MHz ~ 2000 MHz
—
–12
—
dBm
2003 MHz ~ 2399 MHz
—
–18
—
dBm
2484 MHz ~ 2997 MHz
—
–16
—
dBm
3000 MHz ~ 12.75 GHz
—
–10
—
dBm
—
—
–29
—
dBm
Adjacent channel selectivity C/I
Image frequency
Adjacent channel to image frequency
Out-of-band blocking performance
Intermodulation
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Typ
Max
Unit
ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
4 Electrical Characteristics
Table 24: Receiver Characteristics Bluetooth LE 2 Mbps
Parameter
Description
Sensitivity @30.8% PER
—
—
–92
—
dBm
Maximum received signal @30.8% PER
—
—
3
—
dBm
Co-channel C/I
F = F0 MHz
—
8
—
dB
F = F0 + 2 MHz
—
4
—
dB
F = F0 – 2 MHz
—
4
—
dB
F = F0 + 4 MHz
—
–27
—
dB
F = F0 – 4 MHz
—
–27
—
dB
F = F0 + 6 MHz
—
–38
—
dB
F = F0 – 6 MHz
—
–38
—
dB
F > F0 + 6 MHz
—
–41
—
dB
F > F0 – 6 MHz
—
–41
—
dB
—
—
–27
—
dB
F = Fimage + 2 MHz
—
–38
—
dB
F = Fimage – 2 MHz
—
4
—
dB
30 MHz ~ 2000 MHz
—
–15
—
dBm
2003 MHz ~ 2399 MHz
—
–21
—
dBm
2484 MHz ~ 2997 MHz
—
–21
—
dBm
3000 MHz ~ 12.75 GHz
—
–9
—
dBm
—
—
–29
—
dBm
Adjacent channel selectivity C/I
Image frequency
Adjacent channel to image frequency
Out-of-band blocking performance
Intermodulation
Min
Typ
Max
Unit
Table 25: Receiver Characteristics Bluetooth LE 125 Kbps
Parameter
Description
Sensitivity @30.8% PER
—
—
–103.5
—
dBm
Maximum received signal @30.8% PER
—
—
8
—
dBm
Co-channel C/I
F = F0 MHz
—
4
—
dB
F = F0 + 1 MHz
—
1
—
dB
F = F0 – 1 MHz
—
2
—
dB
F = F0 + 2 MHz
—
–26
—
dB
F = F0 – 2 MHz
—
–26
—
dB
F = F0 + 3 MHz
—
–36
—
dB
F = F0 – 3 MHz
—
–39
—
dB
F > F0 + 3 MHz
—
–42
—
dB
F > F0 – 3 MHz
—
–43
—
dB
—
—
–42
—
dB
F = Fimage + 1 MHz
—
–43
—
dB
F = Fimage – 1 MHz
—
–36
—
dB
Adjacent channel selectivity C/I
Image frequency
Adjacent channel to image frequency
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Typ
Max
Unit
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4 Electrical Characteristics
Table 26: Receiver Characteristics Bluetooth LE 500 Kbps
Parameter
Description
Sensitivity @30.8% PER
—
—
–100
—
dBm
Maximum received signal @30.8% PER
—
—
8
—
dBm
Co-channel C/I
F = F0 MHz
—
4
—
dB
F = F0 + 1 MHz
—
1
—
dB
F = F0 – 1 MHz
—
0
—
dB
F = F0 + 2 MHz
—
–24
—
dB
F = F0 – 2 MHz
—
–24
—
dB
F = F0 + 3 MHz
—
–37
—
dB
F = F0 – 3 MHz
—
–39
—
dB
F > F0 + 3 MHz
—
–38
—
dB
F > F0 – 3 MHz
—
–42
—
dB
—
—
–38
—
dB
F = Fimage + 1 MHz
—
–42
—
dB
F = Fimage – 1 MHz
—
–37
—
dB
Adjacent channel selectivity C/I
Image frequency
Adjacent channel to image frequency
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Min
Typ
Max
Unit
ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
5 Module Schematics
This is the reference design of the module.
5
4
3
2
1
1
The values of C1 and C4 vary with
the selection of the crystal.
0.1uF
0.1uF
GND
GND
RF_ANT
1
2
L2
L3
GND
TBD
C11
C12
TBD TBD
TBD
C5
GND
3
GND XOUT
GND
TBD
CHIP_PU
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
LNA_IN
VDD3P3
VDD3P3
CHIP_PU
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
The values of L3, C5, C11, L2 and C12
vary with the actual PCB board.
NC: No component.
15
16
17
18
19
20
21
22
23
24
25
26
27
28
U1
VDD33
42
41
40
39
38
37
36
35
34
33
32
31
30
29
GPIO37
GPIO36
GPIO35
GPIO34
GPIO33
GPIO47
GPIO48
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
62
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
VDD33
GND
GPIO37
GPIO36
GPIO35
GPIO34
GPIO33
SPICLK_P
SPICLK_N
SPID
SPIQ
SPICLK
SPICS0
SPIWP
SPIHD
VDD_SPI
GND
VDD33
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO10
GPIO11
63
VDD_SPI
C13
C14
0.1uF
1uF
ESP32-S3FN8
GND
ESP32-S3FH4R2
GND
GND
GND
3V3
IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
IO10
IO11
GND
U2
65
GND
ESP32-S3-MINI-1
EN
IO46
GND
GND
IO45
RXD0
TXD0
IO42
IO41
IO40
IO39
IO38
IO37
IO36
IO35
GND
CHIP_PU
GPIO46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
C
GPIO45
U0RXD
U0TXD
GPIO42
GPIO41
GPIO40
GPIO39
GPIO38
GPIO37
GPIO36
GPIO35
64
GND
B
ESP32-S3-MINI-1(pin-out)
GND
C15
0.1uF
GND
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
GND
LNA_IN
D1
ESD
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
R4
GND
GND
GND
IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO47
IO33
IO34
IO48
1uF
0.1uF
VDD33
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO26
GPIO47
GPIO33
GPIO34
GPIO48
10uF
56
55
54
53
52
51
50
49
48
47
46
45
44
43
C9
VDDA
VDDA
XTAL_P
XTAL_N
GPIO46
GPIO45
U0RXD
U0TXD
MTMS
MTDI
VDD3P3_CPU
MTDO
MTCK
GPIO38
C8
GPIO46
GPIO45
U0RXD
U0TXD
GPIO42
GPIO41
GPIO40
GPIO39
GPIO38
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
499
C10
57
C7
PCB_ANT
B
R3
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
VDD3P3_RTC
XTAL_32K_P
XTAL_32K_N
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
SPICS1
GND
2.0nH(0.1nH)
C6
GND
ANT1
10K(NC)
GND
GND
L1
D
VDD33
0
C2
10nF
TBD
R1
VDD33
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C3
1uF
C4
GND
40MHz(±10ppm)
The value of R4 varies with the actual
PCB board.
VDD33
XIN
TBD
GND
Y1
2
C1
D
C
GND
GND
4
GND
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO26
Espressif Systems
5 Module Schematics
A
A
Figure 5: ESP32S3MINI1 Schematics
Title
Size
A4
5
4
3
Date:
2
Page Name
Tuesday, May 10, 2022
Rev
1.1 Confidential and Proprietary
Sheet
1
2
of
2
5
4
3
2
1
1
3
GND XOUT
2
10K(NC)
10uF
1uF
0.1uF
0.1uF
GND
RF_ANT
1
L2
TBD
ANT1
C11
C12
CONN
TBD
TBD
GND
GND
GND
The values of C11, L2 and C12
vary with the actual PCB board.
NC: No component.
LNA_IN
CHIP_PU
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
LNA_IN
VDD3P3
VDD3P3
CHIP_PU
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
U1
42
41
40
39
38
37
36
35
34
33
32
31
30
29
GPIO37
GPIO36
GPIO35
GPIO34
GPIO33
GPIO47
GPIO48
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
GND
62
VDD33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
VDD33
GND
GPIO37
GPIO36
GPIO35
GPIO34
GPIO33
SPICLK_P
SPICLK_N
SPID
SPIQ
SPICLK
SPICS0
SPIWP
SPIHD
VDD_SPI
D1
ESD
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO10
GPIO11
63
VDD_SPI
C13
C14
0.1uF
1uF
ESP32-S3FN8
GND
ESP32-S3FH4R2
GND
GND
GND
3V3
IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
IO10
IO11
GND
U2
65
GND
ESP32-S3-MINI-1U
EN
IO46
GND
GND
IO45
RXD0
TXD0
IO42
IO41
IO40
IO39
IO38
IO37
IO36
IO35
GND
CHIP_PU
GPIO46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
C
GPIO45
U0RXD
U0TXD
GPIO42
GPIO41
GPIO40
GPIO39
GPIO38
GPIO37
GPIO36
GPIO35
64
GND
B
ESP32-S3-MINI-1U(pin-out)
GND
GND
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO26
C15
0.1uF
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
VDD33
0.1uF
GND
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
R4
GND
GND
15
16
17
18
19
20
21
22
23
24
25
26
27
28
GND
56
55
54
53
52
51
50
49
48
47
46
45
44
43
C9
VDDA
VDDA
XTAL_P
XTAL_N
GPIO46
GPIO45
U0RXD
U0TXD
MTMS
MTDI
VDD3P3_CPU
MTDO
MTCK
GPIO38
C8
57
C7
GND
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C6
C10
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
VDD3P3_RTC
XTAL_32K_P
XTAL_32K_N
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
SPICS1
GND
2.0nH(0.1nH)
VDD33
IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO47
IO33
IO34
IO48
499
GPIO46
GPIO45
U0RXD
U0TXD
GPIO42
GPIO41
GPIO40
GPIO39
GPIO38
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
R3
GND
GND
L1
D
VDD33
R1
VDD33
4
3
2
TBD
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO26
GPIO47
GPIO33
GPIO34
GPIO48
C2
10nF
C4
0
C3
1uF
GND
Y1
GND
40MHz(±10ppm)
The value of R4 varies with the actual
PCB board.
VDD33
XIN
TBD
The values of C1 and C4 vary with
the selection of the crystal.
B
4
C1
D
C
GND
GND
A
A
Figure 6: ESP32S3MINI1U Schematics
Title
Size
A4
5
4
3
Date:
2
Page Name
Tuesday, May 10, 2022
Rev
1.1 Confidential and Proprietary
Sheet
1
2
of
2
5 Module Schematics
Espressif Systems
GND
6 Peripheral Schematics
4
3
2
6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
VDD33
C1
C3
22uF
0.1uF
GND
JP4
1
2
IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
IO10
IO11
GND
1
2
Boot Option
63
GND
EN
IO46
C7
R2
2
R3
R5
0(NC)
0(NC)
R4
R6
X1: ESR = Max. 70 KΩ
R1
TBD
GND
TMS
TDI
TDO
TCK
1
2
3
4
1
2
3
4
UART
JP2
1
2
3
4
1
2
3
4
JTAG
SW1
R7
C8
0 EN
0.1uF
GND
USB_D+
USB_D-
0
0
GND
GND
U1
C6
TBD
NC: No component.
TBD
JP1
IO45
RXD0
TXD0
IO42
IO41
IO40
IO39
IO38
IO37
IO36
IO35
64
GND
C5
12pF(NC)
C2
VDD33
IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO47
IO33
IO34
IO48
12pF(NC)
X1
32.768KHz(NC)
GND
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
GND
EN
GND
IO46
3V3
GND
IO0
GND
IO1
IO45
IO2
RXD0
IO3
TXD0
IO4 ESP32-S3-MINI-1/ESP32-S3-MINI-1U IO42
IO5
IO41
IO6
IO40
IO7
IO39
IO8
IO38
IO9
IO37
IO10
IO36
IO11
IO35
NC
C4
1
GND
65
GND
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
GND
GND
IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO47
IO33
IO34
IO48
62
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
GND
JP3
1
2
1
2
USB OTG
TBD
GND
Figure 7: Peripheral Schematics
• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal
performance. If you choose to solder it, please apply the correct amount of soldering paste.
• To ensure that the power supply to the ESP32-S3 chip is stable during power-up, it is advised to add an
RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and
C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module
and the power-up and reset sequence timing of the chip. For ESP32-S3’s power-up and reset sequence
timing diagram, please refer to Section Power Scheme in ESP32-S3 Series Datasheet .
4
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2
ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
7 Physical Dimensions and PCB Land Pattern
7 Physical Dimensions and PCB Land Pattern
7.1 Physical Dimensions
Unit: mm
0.8
2.4±0.15
Top view
4.5
4.5
1.2
0.5
Ø
0.7
15.45
14.8
13.2
12.3
11.5
10.6
13.55
0.
5
0.6
1.2
14
0.6
20.5±0.15
5.05
15.4±0.15
10.6
11.5
12.3
13.2
14.8
Side view
Bottom view
Figure 8: ESP32S3MINI1 Physical Dimensions
Unit: mm
15.4±0.15
0.8
0.85
0.7
Top view
4.5
1.2
0.5
14
0.6
14.8
13.2
12.3
11.5
10.6
13.55
15.4±0.15
1.6
0.6
1.2
3.2
2.4±0.15
4.5
10.6
11.5
12.3
13.2
14.8
Side view
Bottom view
Figure 9: ESP32S3MINI1U Physical Dimensions
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ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
7 Physical Dimensions and PCB Land Pattern
Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.
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ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
7 Physical Dimensions and PCB Land Pattern
7.2 Recommended PCB Land Pattern
Unit: mm
: Pad
Antenna Area
Pin 1
1.2
4.5
0.6
4.5
1.2
14.8
13.2
12.3
11.5
10.6
20.5
0.6
5.05
15.4
10.6
11.5
12.3
13.2
14.8
Figure 10: ESP32S3MINI1 Recommended PCB Land Pattern
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ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
7 Physical Dimensions and PCB Land Pattern
Unit: mm
: Pad
15.4
Pin 1
4.5
0.6
15.4
14.8
13.2
12.3
11.5
10.6
4.5
1.2
1.2
0.6
10.6
11.5
12.3
13.2
14.8
Figure 11: ESP32S3MINI1U Recommended PCB Land Pattern
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ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
7 Physical Dimensions and PCB Land Pattern
7.3 Dimensions of External Antenna Connector
ESP32-S3-MINI-1U uses the third generation external antenna connector as shown in Figure 12. This connector
is compatible with the following connectors:
• W.FL Series connector from Hirose
• MHF III connector from I-PEX
• AMMC connector from Amphenol
Unit: mm
Tolerance: +/-0.1 mm
CONTACT
1.7
2.00±0.10
A
A
GROUND CONTACT
2.05±0.10
0.85
0.57
1.7
CONTACT
1.40
0.10
HOUSING
HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;
CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;
SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;
SHELL
SECTION: A-A
SCALE: 1:1
PERFORMANCE:
CONTACT RESISTANCE: 20mOHM Max.
DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE;
INSULATION RESISTANCE: 500MOHM Min.
Figure 12: Dimensions of External Antenna Connector
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ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
8 Product Handling
8 Product Handling
8.1 Storage Conditions
The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.
After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
/60%RH. If the above conditions are not met, the module needs to be baked.
8.2 Electrostatic Discharge (ESD)
• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V
8.3 Reflow Profile
Temperature (℃)
Solder the module in a single reflow.
Peak Temp.
235 ~ 250 ℃
250
Preheating zone
150 ~ 200 ℃
60 ~ 120 s
217
200
Reflow zone
217 ℃ 60 ~ 90 s
Cooling zone
–1 ~ –5 ℃/s
Soldering time
> 30 s
Ramp-up zone
1 ~ 3 ℃/s
100
50
25
Time (sec.)
0
0
50
100
150
200
250
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s
Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃
60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 13: Reflow Profile
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ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
8 Product Handling
8.4 Ultrasonic Vibration
Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or
ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or
even failure. As a consequence, the module may stop working or its performance may deteriorate.
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ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
9 Related Documentation and Resources
9 Related Documentation and Resources
Related Documentation
• ESP32-S3 Series Datasheet – Specifications of the ESP32-S3 hardware.
• ESP32-S3 Technical Reference Manual – Detailed information on how to use the ESP32-S3 memory and peripherals.
• ESP32-S3 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-S3 into your hardware product.
• Certificates
https://espressif.com/en/support/documents/certificates
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents
Developer Zone
• ESP-IDF Programming Guide for ESP32-S3 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos
Products
• ESP32-S3 Series SoCs – Browse through all ESP32-S3 SoCs.
https://espressif.com/en/products/socs?id=ESP32-S3
• ESP32-S3 Series Modules – Browse through all ESP32-S3-based modules.
https://espressif.com/en/products/modules?id=ESP32-S3
• ESP32-S3 Series DevKits – Browse through all ESP32-S3-based devkits.
https://espressif.com/en/products/devkits?id=ESP32-S3
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions
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ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
Revision History
Revision History
Date
Version
Release notes
• Update information about flash and PSRAM on the title page and in Section
1.1
• Add certification and test information
• Add information of new module variants and their ambient operating temperature versions in Table 1
2022-05-24
v1.0
• Add the second note in Table 2
• Add Table 5 and update description of ROM code printing in Section 3.3
• Add notes in Table 11
• Update Bluetooth LE RF data
• Update module schematics in Section 5
• Other minor updates
2021-11-16
v0.6
Overall update for chip revision 1
2021-03-30
v0.1
Preliminary release, for chip revision 0
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ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0
Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO
WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information
in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any
intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
www.espressif.com
All trade names, trademarks and registered trademarks mentioned in this document are property
of their respective owners, and are hereby acknowledged.
Copyright © 2022 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.
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