ESP32-S3-MINI-1-N8

ESP32­S3­MINI­1 ESP32­S3­MINI­1U Datasheet Small­sized module supporting 2.4 GHz Wi­Fi (802.11 b/g/n) and Bluetooth® 5 (LE) Built around ESP32­S3 series of SoCs, Xtensa® dual­core 32­bit LX7 microprocessor Flash up to 8 MB, optional 2 MB PSRAM in chip package 39 GPIOs, rich set of peripherals On­board PCB antenna or external antenna connector ESP32­S3­MINI­1 ESP32­S3­MINI­1U Version1.0 Espressif Systems Copyright © 2022 www.espressif.com 1 Module Overview 1 Module Overview Note: Check the link or the QR code to make sure that you use the latest version of this document: https://www.espressif.com/sites/default/files/documentation/esp32-s3-mini-1_mini-1u_datasheet_ en.pdf 1.1 Features CPU and On­Chip Memory Peripherals • ESP32-S3 embedded, Xtensa® dual-core 32-bit • GPIO, SPI, LCD interface, Camera interface, LX7 microprocessor, up to 240 MHz UART, I2C, I2S, remote control, pulse counter, LED PWM, USB 1.1 OTG, USB Serial/JTAG • 384 KB ROM controller, MCPWM, SDIO host, GDMA, TWAI® controller (compatible with ISO 11898-1, i.e. • 512 KB SRAM CAN Specification 2.0), ADC, touch sensor, • 16 KB SRAM in RTC temperature sensor, timers and watchdogs • Up to 8 MB Quad SPI flash Integrated Components on Module • 2 MB PSRAM (ESP32-S3FH4R2 only) • 40 MHz crystal oscillator Wi­Fi Antenna Options • On-board PCB antenna • 802.11 b/g/n (ESP32-S3-MINI-1) • Bit rate: 802.11n up to 150 Mbps • External antenna via a connector (ESP32-S3-MINI-1U) • A-MPDU and A-MSDU aggregation • 0.4 µs guard interval support Operating Conditions • Center frequency range of operating channel: • Operating voltage/Power supply: 3.0 ~ 3.6 V 2412 ~ 2484 MHz • Operating ambient temperature: – 85 °C version: –40 ~ 85 °C Bluetooth – 105 °C version: –40 ~ 105 °C • Bluetooth LE: Bluetooth 5, Bluetooth mesh Certification • Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps • RF certification: See certificates for • Advertising extensions ESP32-S3-MINI-1 and ESP32-S3-MINI-1U • Multiple advertisement sets • Green certification: RoHS/REACH • Channel selection algorithm #2 Test • Internal co-existence mechanism between Wi-Fi and Bluetooth to share the same antenna Espressif Systems • HTOL/HTSL/uHAST/TCT/ESD 2 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 1 Module Overview 1.2 Description ESP32-S3-MINI-1 and ESP32-S3-MINI-1U are two powerful, generic Wi-Fi + Bluetooth LE MCU modules that feature a rich set of peripherals, yet an optimized size. They are an ideal choice for a wide variety of application scenarios related to Internet of Things (IoT), such as embedded systems, smart home, wearable electronics, etc. ESP32-S3-MINI-1 comes with a PCB antenna. ESP32-S3-MINI-1U comes with an external antenna connector. The variants and ordering information for the module are shown in Table 1. Table 1: Ordering Information Ordering Code Chip Embedded Flash (MB) PSRAM (MB) ESP32-S3-MINI-1-N8 (85 °C) ESP32-S3FN8 8 (Quad SPI) 0 ESP32-S3-MINI-1-N4R2 (85 °C) ESP32-S3FH4R2 4 (Quad SPI) 2 (Quad SPI) ESP32-S3-MINI-1-H4R2 (105 °C) ESP32-S3FH4R2 4 (Quad SPI) 2 (Quad SPI) ESP32-S3-MINI-1U-N8 (85 °C) ESP32-S3FN8 8 (Quad SPI) 0 ESP32-S3-MINI-1U-N4R2 (85 °C) ESP32-S3FH4R2 4 (Quad SPI) 2 (Quad SPI) ESP32-S3-MINI-1U-H4R2 (105 °C) ESP32-S3FH4R2 4 (Quad SPI) 2 (Quad SPI) 1 Dimensions (mm) 15.4 × 20.5 × 2.4 15.4 × 15.4 × 2.4 The ESP32-S3FH4R2 chip is not yet in mass production, so modules embedded with this chip are still in sample status. At the core of the modules is an ESP32-S3, an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. You can power off the CPU and make use of the low-power co-processor to constantly monitor the peripherals for changes or crossing of thresholds. ESP32-S3 integrates a rich set of peripherals including SPI, LCD, Camera interface, UART, I2C, I2S, remote control, pulse counter, LED PWM, USB Serial/Jtag, MCPWM, SDIO host, GDMA, TWAI® controller (compatible with ISO 11898-1, i.e., CAN Specification 2.0), ADC, touch sensor, temperature sensor, timers and watchdogs, as well as up to 45 GPIOs. It also includes a full-speed USB 1.1 On-The-Go (OTG) interface to enable USB communication. Note: * For more information on ESP32-S3, please refer to ESP32-S3 Series Datasheet . 1.3 Applications • Generic Low-power IoT Sensor Hub • Mesh Network • Generic Low-power IoT Data Loggers • Home Automation • Cameras for Video Streaming • Smart Building • Over-the-top (OTT) Devices • Industrial Automation • USB Devices • Smart Agriculture • Speech Recognition • Audio Applications • Image Recognition • Health Care Applications Espressif Systems 3 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 1 Module Overview • Wi-Fi-enabled Toys • Retail & Catering Applications • Wearable Electronics Espressif Systems 4 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 Contents Contents 1 Module Overview 2 1.1 Features 2 1.2 Description 3 1.3 Applications 3 2 Block Diagram 8 3 Pin Definitions 9 3.1 Pin Layout 9 3.2 Pin Description 10 3.3 Strapping Pins 11 4 Electrical Characteristics 14 4.1 Absolute Maximum Ratings 14 4.2 Recommended Operating Conditions 14 4.3 DC Characteristics (3.3 V, 25 °C) 14 4.4 Current Consumption Characteristics 15 4.5 Wi-Fi RF Characteristics 15 4.5.1 Wi-Fi RF Standards 15 4.5.2 Wi-Fi RF Transmitter (TX) Specifications 16 4.5.3 Wi-Fi RF Receiver (RX) Specifications 17 4.6 Bluetooth LE Radio 18 4.6.1 Bluetooth LE RF Transmitter (TX) Specifications 18 4.6.2 Bluetooth LE RF Receiver (RX) Specifications 20 5 Module Schematics 23 6 Peripheral Schematics 25 7 Physical Dimensions and PCB Land Pattern 26 7.1 Physical Dimensions 26 7.2 Recommended PCB Land Pattern 28 7.3 Dimensions of External Antenna Connector 30 8 Product Handling 31 8.1 Storage Conditions 31 8.2 Electrostatic Discharge (ESD) 31 8.3 Reflow Profile 31 8.4 Ultrasonic Vibration 32 9 Related Documentation and Resources 33 Revision History Espressif Systems 34 5 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 List of Tables List of Tables 1 Ordering Information 2 Pin Definitions 10 3 JTAG Signal Source Selection 12 4 Strapping Pins 12 5 The Default Value for VDD_SPI Voltage 13 6 Parameter Descriptions of Setup and Hold Times for the Strapping Pin 13 7 Absolute Maximum Ratings 14 8 Recommended Operating Conditions 14 9 DC Characteristics (3.3 V, 25 °C) 14 10 Current Consumption Depending on RF Modes 15 11 Current Consumption Depending on Work Modes 15 12 Wi-Fi RF Standards 16 13 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 16 14 TX EVM Test 16 15 RX Sensitivity 17 16 Maximum RX Level 17 17 RX Adjacent Channel Rejection 18 18 Bluetooth LE Frequency 18 19 Transmitter Characteristics - Bluetooth LE 1 Mbps 18 20 Transmitter Characteristics - Bluetooth LE 2 Mbps 19 21 Transmitter Characteristics - Bluetooth LE 125 Kbps 19 22 Transmitter Characteristics - Bluetooth LE 500 Kbps 19 23 Receiver Characteristics - Bluetooth LE 1 Mbps 20 24 Receiver Characteristics - Bluetooth LE 2 Mbps 21 25 Receiver Characteristics - Bluetooth LE 125 Kbps 21 26 Receiver Characteristics - Bluetooth LE 500 Kbps 22 Espressif Systems 3 6 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 List of Figures List of Figures 1 ESP32-S3-MINI-1 Block Diagram 8 2 ESP32-S3-MINI-1U Block Diagram 8 3 Pin Layout (Top View) 9 4 Setup and Hold Times for the Strapping Pin 13 5 ESP32-S3-MINI-1 Schematics 23 6 ESP32-S3-MINI-1U Schematics 24 7 Peripheral Schematics 25 8 ESP32-S3-MINI-1 Physical Dimensions 26 9 ESP32-S3-MINI-1U Physical Dimensions 26 10 ESP32-S3-MINI-1 Recommended PCB Land Pattern 28 11 ESP32-S3-MINI-1U Recommended PCB Land Pattern 29 12 Dimensions of External Antenna Connector 30 13 Reflow Profile 31 Espressif Systems 7 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 2 Block Diagram 2 Block Diagram ESP32-S2-MINI-2 40 MHz Crystal 40 MHz 3V3 ESP32-S3-MINI-1 Antenna Crystal 3V3 Antenna RF Matching EN EN ESP32-S2FH4 ESP32-S2FN4R2 ESP32-S3FN8 RF Matching GPIOs ESP32-S3FH4R2 FLASH (QSPI) FLASH (QSPI) GPIOs PSRAM(opt.) (QSPI) PSRAM(opt.) (QSPI) Figure 1: ESP32­S3­MINI­1 Block Diagram ESP32-S3-MINI-1U 40 MHz Crystal 40 MHz 3V3 ESP32-S2-MINI-2U Crystal 3V3 Antenna Antenna RF Matching EN EN ESP32-S3FN8 ESP32-S3FH4R2 ESP32-S2FH4 RF Matching GPIOs ESP32-S2FN4R2 FLASH (QSPI) FLASH (QSPI) GPIOs PSRAM(opt.) (QSPI) PSRAM(opt.) (QSPI) Figure 2: ESP32­S3­MINI­1U Block Diagram Espressif Systems 8 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 7.1 Physical Dimensions. The pin diagram is applicable for ESP32-S3-MINI-1 and ESP32-S3-MINI-1U, but the latter has no keepout zone. GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin 59 Pin 58 Pin 57 Pin 56 Pin 55 Pin 54 Pin 53 Pin 52 Pin 51 Pin 50 Pin 49 Pin 48 Pin 47 Pin 46 Pin 62 GND Pin 60 Keepout Zone Pin 65 GND GND Pin 1 Pin 45 EN GND Pin 2 Pin 44 IO46 3V3 Pin 3 Pin 43 GND IO0 Pin 4 Pin 42 GND Pin 41 IO45 Pin 40 RXD0 Pin 39 TXD0 Pin 38 IO42 Pin 37 IO41 IO1 Pin 5 IO2 Pin 6 IO3 Pin 7 IO4 Pin 8 IO5 Pin 9 GND GND GND GND Pin 61 GND GND IO6 Pin 10 Pin 36 IO40 IO7 Pin 11 Pin 35 IO39 IO8 Pin 12 Pin 34 IO38 IO9 Pin 13 Pin 33 IO37 IO10 Pin 14 Pin 32 IO36 IO11 Pin 15 Pin 31 IO35 Pin 27 Pin 28 Pin 29 Pin 30 IO33 IO34 IO48 Pin 26 IO26 IO47 Pin 24 Pin 25 IO19 IO21 Pin 23 IO18 GND IO20 Pin 21 Pin 22 GND IO17 Pin 20 IO16 Pin 18 IO14 IO15 Pin 17 IO13 Pin 19 Pin 16 IO12 Pin 63 GND GND Pin 64 GND Figure 3: Pin Layout (Top View) Espressif Systems 9 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 3 Pin Definitions 3.2 Pin Description The module has 65 pins. See pin definitions in Table 2. For explanations of pin names and function names, as well as configurations of peripheral pins, please refer to ESP32-S3 Series Datasheet . Table 2: Pin Definitions Type a Function Name No. GND 1, 2, 42, 43, 46-65 P GND 3V3 3 P Power supply IO0 4 I/O/T RTC_GPIO0, GPIO0 IO1 5 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0 IO2 6 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1 IO3 7 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2 IO4 8 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3 IO5 9 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4 IO6 10 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5 IO7 11 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6 IO8 12 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1 IO9 13 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD IO10 14 I/O/T IO11 15 I/O/T IO12 16 I/O/T IO13 17 I/O/T IO14 18 I/O/T IO15 19 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P IO16 20 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N IO17 21 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6 IO18 22 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3 IO19 23 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D­ IO20 24 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+ IO21 25 I/O/T RTC_GPIO21, GPIO21 IO26 26 I/O/T SPICS1, GPIO26 IO47 27 I/O/T SPICLK_P_DIFF, GPIO47, SUBSPICLK_P_DIFF IO33 28 I/O/T SPIIO4, GPIO33, FSPIHD, SUBSPIHD IO34 29 I/O/T SPIIO5, GPIO34, FSPICS0, SUBSPICS0 IO48 30 I/O/T SPICLK_N_DIFF, GPIO48, SUBSPICLK_N_DIFF IO35 31 I/O/T SPIIO6, GPIO35, FSPID, SUBSPID IO36 32 I/O/T SPIIO7, GPIO36, FSPICLK, SUBSPICLK b RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4, SUBSPICS0 RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5, SUBSPID RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6, SUBSPICLK RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7, SUBSPIQ RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS, SUBSPIWP Cont’d on next page Espressif Systems 10 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 3 Pin Definitions Table 2 – cont’d from previous page a Name No. Type Function IO37 33 I/O/T SPIDQS, GPIO37, FSPIQ, SUBSPIQ IO38 34 I/O/T GPIO38, FSPIWP, SUBSPIWP IO39 35 I/O/T MTCK, GPIO39, CLK_OUT3, SUBSPICS1 IO40 36 I/O/T MTDO, GPIO40, CLK_OUT2 IO41 37 I/O/T MTDI, GPIO41, CLK_OUT1 IO42 38 I/O/T MTMS, GPIO42 TXD0 39 I/O/T U0TXD, GPIO43, CLK_OUT1 RXD0 40 I/O/T U0RXD, GPIO44, CLK_OUT2 IO45 41 I/O/T GPIO45 IO46 44 I/O/T GPIO46 High: on, enables the chip. EN 45 I Low: off, the chip powers off. Note: Do not leave the EN pin floating. a P: power supply; I: input; O: output; T: high impedance. Pin functions in bold font are the default pin functions. For pin 28 ∼ 29, 31 ∼ 33, the default function is decided by eFuse bit. b For modules with ordering codes ending with -N4R2 and -H4R2, IO26 connects to the embedded PSRAM and is not available for other uses. 3.3 Strapping Pins Note: The content below is excerpted from Section Strapping Pins in ESP32-S3 Series Datasheet . For the strapping pin mapping between the chip and modules, please refer to Chapter 5 Module Schematics. ESP32-S3 has four strapping pins: • GPIO0 • GPIO45 • GPIO46 • GPIO3 Software can read the values of corresponding bits from register “GPIO_STRAPPING”. During the chip’s system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as strapping bits of “0” or “1”, and hold these bits until the chip is powered down or shut down. GPIO0, GPIO45 and GPIO46 are connected to the chip’s internal weak pull-up/pull-down during the chip reset. Consequently, if they are unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of these strapping pins. GPIO3 is floating by default. Its strapping value can be configured to determine the source of the JTAG signal inside the CPU, as shown in Table 4. In this case, the strapping value is controlled by the external circuit that cannot be in a high impedance state. Table 3 shows more configuration combinations of Espressif Systems 11 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 3 Pin Definitions EFUSE_DIS_USB_JTAG, EFUSE_DIS_PAD_JTAG, and EFUSE_STRAP_JTAG_SEL that determine the JTAG signal source. Table 3: JTAG Signal Source Selection EFUSE_STRAP_JTAG_SEL EFUSE_DIS_USB_JTAG EFUSE_DIS_PAD_JTAG JTAG Signal Source 1 0 0 Refer to Table 4 0 0 0 USB Serial/JTAG controller don’t care 0 1 USB Serial/JTAG controller don’t care 1 0 On-chip JTAG pins don’t care 1 1 N/A To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-S3. After reset, the strapping pins work as normal-function pins. Refer to Table 4 for a detailed configuration of the strapping pins. Table 4: Strapping Pins VDD_SPI Voltage Pin Default 3.3 V GPIO45 Pull-down 0 1.8 V 1 Booting Mode 1 Pin Default SPI Boot Download Boot GPIO0 Pull-up 1 0 GPIO46 Pull-down Don’t care 0 Enabling/Disabling ROM Messages Print During Booting 2 Pin Default Enabled Disabled GPIO46 Pull-down See the 2nd note See the 2nd note JTAG Signal Selection Pin Default GPIO3 N/A EFUSE_DIS_USB_JTAG = 0, EFUSE_DIS_PAD_JTAG = 0, EFUSE_STRAP_JTAG_SEL=1 0: JTAG signal from on-chip JTAG pins 1: JTAG signal from USB Serial/JTAG controller Note: 1. The strapping combination of GPIO46 = 1 and GPIO0 = 0 is invalid and will trigger unexpected behavior. 2. By default, the ROM boot messages are printed over UART0 (U0TXD pin) and USB Serial/JTAG controller together. The ROM code printing can be disabled through configuration register and eFuse. For detailed information, please refer to Chapter Chip Boot Control in ESP32-S3 Technical Reference Manual. VDD_SPI voltage is determined either by the strapping value of GPIO45 or by EFUSE_VDD_SPI_TIEH. When EFUSE_VDD_SPI_FORCE is 0, VDD_SPI voltage is determined by the strapping value of GPIO45; when EFUSE_VDD_SPI_FORCE is 1, VDD_SPI voltage is determined by EFUSE_VDD_SPI_TIEH. Please refer to the Espressif Systems 12 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 3 Pin Definitions following table for default configurations: Table 5: The Default Value for VDD_SPI Voltage Chip Variant EFUSE_VDD_SPI_FORCE EFUSE_VDD_SPI_TIEH VDD_SPI Voltage ESP32-S3 0 0 Determined by GPIO45 ESP32-S3R2 1 1 Force to 3.3 V ESP32-S3R8 1 1 Force to 3.3 V ESP32-S3R8V 1 0 Force to 1.8 V ESP32-S3FN8 1 1 Force to 3.3 V ESP32-S3FH4R2 1 1 Force to 3.3 V Figure 4 shows the setup and hold times for the strapping pin before and after the CHIP_PU signal goes high. Details about the parameters are listed in Table 6. tSU CHIP_PU tHD VIL_nRST VIH Strapping pin Figure 4: Setup and Hold Times for the Strapping Pin Table 6: Parameter Descriptions of Setup and Hold Times for the Strapping Pin Parameter Description tSU Setup time before CHIP_PU goes from low to high 0 tHD Hold time after CHIP_PU goes high 3 Espressif Systems Min (ms) 13 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 4 Electrical Characteristics 4 Electrical Characteristics 4.1 Absolute Maximum Ratings Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 7: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V TST ORE Storage temperature –40 105 °C 4.2 Recommended Operating Conditions Table 8: Recommended Operating Conditions Symbol Parameter Min Typ Max VDD33 IV DD TA Operating ambient temperature Power supply voltage 3.0 3.3 3.6 V Current delivered by external power supply 0.5 — — A –40 — 85 °C version 105 °C version Unit 85 °C 105 4.3 DC Characteristics (3.3 V, 25 °C) Table 9: DC Characteristics (3.3 V, 25 °C) Symbol Parameter CIN Pin capacitance VIH Min — High-level input voltage 0.75 × VDD 1 Typ Max Unit 2 — pF — 1 VDD + 0.3 V 1 VIL Low-level input voltage –0.3 — 0.25 × VDD IIH High-level input current — — 50 nA Low-level input current — — 50 nA — — IIL VOH VOL 2 2 High-level output voltage 0.8 × VDD Low-level output voltage 1 V V 1 — — 0.1 × VDD V — 40 — mA — 28 — mA 1 IOH IOL High-level source current (VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3) Low-level sink current (VDD1 = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3) RP U Internal weak pull-up resistor — 45 — kΩ RP D Internal weak pull-down resistor — 45 — kΩ 0.75 × VDD1 — VDD1+ 0.3 V VIH_nRST Chip reset release voltage (EN voltage is within the specified range) Cont’d on next page Espressif Systems 14 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 4 Electrical Characteristics Table 9 – cont’d from previous page Symbol VIL_nRST Parameter Chip reset voltage (EN voltage is within the specified range) 1 VDD is the I/O voltage for pins of a particular power domain. 2 VOH and VOL are measured using high-impedance load. Min Typ Max Unit –0.3 — 0.25 × VDD1 V 4.4 Current Consumption Characteristics With the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to Section Low Power Management in ESP32-S3 Series Datasheet . Table 10: Current Consumption Depending on RF Modes Work mode Description TX Active (RF working) RX 1 Peak (mA) 802.11b, 1 Mbps, @20.5 dBm 355 802.11g, 54 Mbps, @18 dBm 297 802.11n, HT20, MCS 7, @17.5 dBm 286 802.11n, HT40, MCS 7, @17 dBm 285 802.11b/g/n, HT20 95 802.11n, HT40 97 The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle. 2 The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle. Note that the data in Table 11 only applies to the module variants that embed the chip variant ESP32-S3. Table 11: Current Consumption Depending on Work Modes Work mode Description Typ 2 Unit Light-sleep — 240 1 µA Deep-sleep Power off 1 RTC memory and RTC peripherals are powered on. 8 µA RTC memory is powered on. RTC peripherals are powered off. 7 µA CHIP_PU is set to low level. The chip is powered off. 1 µA An extra PSRAM consumption of 40 µA should be added for modules embedded with ESP32S3FH4R2 chip. 2 Please refer to ESP32-S3 Series Datasheet if there are any inconsistencies. 4.5 Wi­Fi RF Characteristics 4.5.1 Wi­Fi RF Standards Espressif Systems 15 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 4 Electrical Characteristics Table 12: Wi­Fi RF Standards Name Description Center frequency range of operating channel 1 Wi-Fi wireless standard 2412 ~ 2484 MHz IEEE 802.11b/g/n 11b: 1, 2, 5.5 and 11 Mbps 20 MHz Data rate 11n: MCS0-7, 72.2 Mbps (Max) 40 MHz 11n: MCS0-7, 150 Mbps (Max) PCB antenna, external antenna via the connector 2 Antenna type 1 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps Device should operate in the center frequency range allocated by regional regulatory authorities. Target center frequency range is configurable by software. 2 For the modules that use external antennas, the output impedance is 50 Ω. For other modules without external antennas, the output impedance is irrelevant. 4.5.2 Wi­Fi RF Transmitter (TX) Specifications Target TX power is configurable based on device or certification requirements. The default characteristics are provided in Table 13. Table 13: TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ Max (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 20.5 — 802.11b, 11 Mbps — 20.5 — 802.11g, 6 Mbps — 20.0 — 802.11g, 54 Mbps — 18.0 — 802.11n, HT20, MCS 0 — 19.0 — 802.11n, HT20, MCS 7 — 17.5 — 802.11n, HT40, MCS 0 — 18.5 — 802.11n, HT40, MCS 7 — 17.0 — Rate Table 14: TX EVM Test Rate Typ SL1 (dB) (dB) (dB) 802.11b, 1 Mbps, @20.5 dBm — –24.5 –10 802.11b, 11 Mbps, @20.5 dBm — –24.5 –10 802.11g, 6 Mbps, @20 dBm — –23.0 –5 802.11g, 54 Mbps, @18 dBm — –29.5 –25 802.11n, HT20, MCS 0, @19 dBm — –24.0 –5 802.11n, HT20, MCS 7, @17.5 dBm — –30.5 –27 802.11n, HT40, MCS 0, @18.5 dBm — –25.0 –5 802.11n, HT40, MCS 7, @17 dBm — –30.0 –27 1 Espressif Systems Min SL stands for standard limit value. 16 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 4 Electrical Characteristics 4.5.3 Wi­Fi RF Receiver (RX) Specifications Table 15: RX Sensitivity Min Typ Max (dBm) (dBm) (dBm) 802.11b, 1 Mbps — –98.2 — 802.11b, 2 Mbps — –95.6 — 802.11b, 5.5 Mbps — –92.8 — 802.11b, 11 Mbps — –88.5 — 802.11g, 6 Mbps — –93.0 — 802.11g, 9 Mbps — –92.0 — 802.11g, 12 Mbps — –90.8 — 802.11g, 18 Mbps — –88.5 — 802.11g, 24 Mbps — –85.5 — 802.11g, 36 Mbps — –82.2 — 802.11g, 48 Mbps — –78.0 — 802.11g, 54 Mbps — –76.2 — 802.11n, HT20, MCS 0 — –93.0 — 802.11n, HT20, MCS 1 — –90.6 — 802.11n, HT20, MCS 2 — –88.4 — 802.11n, HT20, MCS 3 — –84.8 — 802.11n, HT20, MCS 4 — –81.6 — 802.11n, HT20, MCS 5 — –77.4 — 802.11n, HT20, MCS 6 — –75.6 — 802.11n, HT20, MCS 7 — –74.2 — 802.11n, HT40, MCS 0 — –90.0 — 802.11n, HT40, MCS 1 — –87.5 — 802.11n, HT40, MCS 2 — –85.0 — 802.11n, HT40, MCS 3 — –82.0 — 802.11n, HT40, MCS 4 — –78.5 — 802.11n, HT40, MCS 5 — –74.4 — 802.11n, HT40, MCS 6 — –72.5 — 802.11n, HT40, MCS 7 — –71.2 — Rate Table 16: Maximum RX Level Min Typ Max (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 5 — 802.11g, 54 Mbps — 0 — 802.11n, HT20, MCS 0 — 5 — 802.11n, HT20, MCS 7 — 0 — Rate Cont’d on next page Espressif Systems 17 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 4 Electrical Characteristics Table 16 – cont’d from previous page Min Typ Max (dBm) (dBm) (dBm) 802.11n, HT40, MCS 0 — 5 — 802.11n, HT40, MCS 7 — 0 — Rate Table 17: RX Adjacent Channel Rejection Rate Min Typ Max (dB) (dB) (dB) 802.11b, 1 Mbps — 35 — 802.11b, 11 Mbps — 35 — 802.11g, 6 Mbps — 31 — 802.11g, 54 Mbps — 14 — 802.11n, HT20, MCS 0 — 31 — 802.11n, HT20, MCS 7 — 13 — 802.11n, HT40, MCS 0 — 19 — 802.11n, HT40, MCS 7 — 8 — 4.6 Bluetooth LE Radio Table 18: Bluetooth LE Frequency Parameter Center frequency of operating channel Min Typ Max (MHz) (MHz) (MHz) 2402 — 2480 4.6.1 Bluetooth LE RF Transmitter (TX) Specifications Table 19: Transmitter Characteristics ­ Bluetooth LE 1 Mbps Parameter RF transmit power Carrier frequency offset and drift Modulation characteristics Description Min RF power control range Typ Max Unit –25.00 0 20.00 Gain control step — 3.00 — dB Max |fn |n=0, 1, 2, ..k — 2.50 — kHz Max |f0 − fn | — 2.00 — kHz Max |fn − fn−5 | — 1.40 — kHz |f1 − f0 | — 1.00 — kHz ∆ f 1avg — 249.00 — kHz — 198.00 — kHz — 0.86 — — Min ∆ f 2max (for at least 99.9% of all ∆ f 2max ) ∆ f 2avg /∆ f 1avg dBm Cont’d on next page Espressif Systems 18 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 4 Electrical Characteristics Table 19 – cont’d from previous page Parameter Description In-band spurious emissions Min Typ Max Unit ±2 MHz offset — –37.00 — dBm ±3 MHz offset — –42.00 — dBm >±3 MHz offset — –44.00 — dBm Table 20: Transmitter Characteristics ­ Bluetooth LE 2 Mbps Parameter Description Min RF power control range RF transmit power Carrier frequency offset and drift Modulation characteristics In-band spurious emissions Typ Max Unit –25.00 0 20.00 Gain control step — 3.00 — dB Max |fn |n=0, 1, 2, ..k — 2.50 — kHz Max |f0 − fn | — 2.00 — kHz Max |fn − fn−5 | — 1.40 — kHz |f1 − f0 | — 1.00 — kHz ∆ f 1avg — 499.00 — kHz — 416.00 — kHz ∆ f 2avg /∆ f 1avg — 0.89 — — ±4 MHz offset — –42.00 — dBm ±5 MHz offset — –44.00 — dBm >±5 MHz offset — –47.00 — dBm Min ∆ f 2max (for at least 99.9% of all ∆ f 2max ) dBm Table 21: Transmitter Characteristics ­ Bluetooth LE 125 Kbps Parameter Description Min RF power control range RF transmit power Carrier frequency offset and drift Modulation characteristics Max Unit –25.00 0 20.00 Gain control step — 3.00 — dB Max |fn |n=0, 1, 2, ..k — 0.80 — kHz Max |f0 − fn | — 1.00 — kHz |fn − fn−3 | — 0.30 — kHz |f0 − f3 | — 1.00 — kHz ∆ f 1avg — 248.00 — kHz — 222.00 — kHz ±2 MHz offset — –37.00 — dBm ±3 MHz offset — –42.00 — dBm >±3 MHz offset — –44.00 — dBm Min ∆ f 1max (for at least 99.9% of all∆ f 1max ) In-band spurious emissions Typ dBm Table 22: Transmitter Characteristics ­ Bluetooth LE 500 Kbps Parameter RF transmit power Description Min RF power control range Typ Max –25.00 0 20.00 — 3.00 — Gain control step Unit dBm dB Cont’d on next page Espressif Systems 19 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 4 Electrical Characteristics Table 22 – cont’d from previous page Parameter Description Carrier frequency offset and drift Modulation characteristics Min Max Unit Max |fn |n=0, 1, 2, ..k — 0.80 — kHz Max |f0 − fn | — 1.00 — kHz |fn − fn−3 | — 0.85 — kHz |f0 − f3 | — 0.34 — kHz ∆ f 2avg — 213.00 — kHz — 196.00 — kHz ±2 MHz offset — –37.00 — dBm ±3 MHz offset — –42.00 — dBm >±3 MHz offset — –44.00 — dBm Min ∆ f 2max (for at least 99.9% of all ∆ f 2max ) In-band spurious emissions Typ 4.6.2 Bluetooth LE RF Receiver (RX) Specifications Table 23: Receiver Characteristics ­ Bluetooth LE 1 Mbps Parameter Description Sensitivity @30.8% PER — — –96.5 — dBm Maximum received signal @30.8% PER — — 8 — dBm Co-channel C/I F = F0 MHz — 8 — dB F = F0 + 1 MHz — 4 — dB F = F0 – 1 MHz — 4 — dB F = F0 + 2 MHz — –23 — dB F = F0 – 2 MHz — –23 — dB F = F0 + 3 MHz — –34 — dB F = F0 – 3 MHz — –34 — dB F > F0 + 3 MHz — –36 — dB F > F0 – 3 MHz — –37 — dB — — –36 — dB F = Fimage + 1 MHz — –39 — dB F = Fimage – 1 MHz — –34 — dB 30 MHz ~ 2000 MHz — –12 — dBm 2003 MHz ~ 2399 MHz — –18 — dBm 2484 MHz ~ 2997 MHz — –16 — dBm 3000 MHz ~ 12.75 GHz — –10 — dBm — — –29 — dBm Adjacent channel selectivity C/I Image frequency Adjacent channel to image frequency Out-of-band blocking performance Intermodulation Espressif Systems 20 Submit Documentation Feedback Min Typ Max Unit ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 4 Electrical Characteristics Table 24: Receiver Characteristics ­ Bluetooth LE 2 Mbps Parameter Description Sensitivity @30.8% PER — — –92 — dBm Maximum received signal @30.8% PER — — 3 — dBm Co-channel C/I F = F0 MHz — 8 — dB F = F0 + 2 MHz — 4 — dB F = F0 – 2 MHz — 4 — dB F = F0 + 4 MHz — –27 — dB F = F0 – 4 MHz — –27 — dB F = F0 + 6 MHz — –38 — dB F = F0 – 6 MHz — –38 — dB F > F0 + 6 MHz — –41 — dB F > F0 – 6 MHz — –41 — dB — — –27 — dB F = Fimage + 2 MHz — –38 — dB F = Fimage – 2 MHz — 4 — dB 30 MHz ~ 2000 MHz — –15 — dBm 2003 MHz ~ 2399 MHz — –21 — dBm 2484 MHz ~ 2997 MHz — –21 — dBm 3000 MHz ~ 12.75 GHz — –9 — dBm — — –29 — dBm Adjacent channel selectivity C/I Image frequency Adjacent channel to image frequency Out-of-band blocking performance Intermodulation Min Typ Max Unit Table 25: Receiver Characteristics ­ Bluetooth LE 125 Kbps Parameter Description Sensitivity @30.8% PER — — –103.5 — dBm Maximum received signal @30.8% PER — — 8 — dBm Co-channel C/I F = F0 MHz — 4 — dB F = F0 + 1 MHz — 1 — dB F = F0 – 1 MHz — 2 — dB F = F0 + 2 MHz — –26 — dB F = F0 – 2 MHz — –26 — dB F = F0 + 3 MHz — –36 — dB F = F0 – 3 MHz — –39 — dB F > F0 + 3 MHz — –42 — dB F > F0 – 3 MHz — –43 — dB — — –42 — dB F = Fimage + 1 MHz — –43 — dB F = Fimage – 1 MHz — –36 — dB Adjacent channel selectivity C/I Image frequency Adjacent channel to image frequency Espressif Systems 21 Submit Documentation Feedback Min Typ Max Unit ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 4 Electrical Characteristics Table 26: Receiver Characteristics ­ Bluetooth LE 500 Kbps Parameter Description Sensitivity @30.8% PER — — –100 — dBm Maximum received signal @30.8% PER — — 8 — dBm Co-channel C/I F = F0 MHz — 4 — dB F = F0 + 1 MHz — 1 — dB F = F0 – 1 MHz — 0 — dB F = F0 + 2 MHz — –24 — dB F = F0 – 2 MHz — –24 — dB F = F0 + 3 MHz — –37 — dB F = F0 – 3 MHz — –39 — dB F > F0 + 3 MHz — –38 — dB F > F0 – 3 MHz — –42 — dB — — –38 — dB F = Fimage + 1 MHz — –42 — dB F = Fimage – 1 MHz — –37 — dB Adjacent channel selectivity C/I Image frequency Adjacent channel to image frequency Espressif Systems 22 Submit Documentation Feedback Min Typ Max Unit ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 5 Module Schematics This is the reference design of the module. 5 4 3 2 1 1 The values of C1 and C4 vary with the selection of the crystal. 0.1uF 0.1uF GND GND RF_ANT 1 2 L2 L3 GND TBD C11 C12 TBD TBD TBD C5 GND 3 GND XOUT GND TBD CHIP_PU GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 1 2 3 4 5 6 7 8 9 10 11 12 13 14 LNA_IN VDD3P3 VDD3P3 CHIP_PU GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 The values of L3, C5, C11, L2 and C12 vary with the actual PCB board. NC: No component. 15 16 17 18 19 20 21 22 23 24 25 26 27 28 U1 VDD33 42 41 40 39 38 37 36 35 34 33 32 31 30 29 GPIO37 GPIO36 GPIO35 GPIO34 GPIO33 GPIO47 GPIO48 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 62 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 VDD33 GND GPIO37 GPIO36 GPIO35 GPIO34 GPIO33 SPICLK_P SPICLK_N SPID SPIQ SPICLK SPICS0 SPIWP SPIHD VDD_SPI GND VDD33 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 63 VDD_SPI C13 C14 0.1uF 1uF ESP32-S3FN8 GND ESP32-S3FH4R2 GND GND GND 3V3 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 IO10 IO11 GND U2 65 GND ESP32-S3-MINI-1 EN IO46 GND GND IO45 RXD0 TXD0 IO42 IO41 IO40 IO39 IO38 IO37 IO36 IO35 GND CHIP_PU GPIO46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 C GPIO45 U0RXD U0TXD GPIO42 GPIO41 GPIO40 GPIO39 GPIO38 GPIO37 GPIO36 GPIO35 64 GND B ESP32-S3-MINI-1(pin-out) GND C15 0.1uF GND GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 GND LNA_IN D1 ESD EPAD GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND R4 GND GND GND IO12 IO13 IO14 IO15 IO16 IO17 IO18 IO19 IO20 IO21 IO26 IO47 IO33 IO34 IO48 1uF 0.1uF VDD33 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 GPIO47 GPIO33 GPIO34 GPIO48 10uF 56 55 54 53 52 51 50 49 48 47 46 45 44 43 C9 VDDA VDDA XTAL_P XTAL_N GPIO46 GPIO45 U0RXD U0TXD MTMS MTDI VDD3P3_CPU MTDO MTCK GPIO38 C8 GPIO46 GPIO45 U0RXD U0TXD GPIO42 GPIO41 GPIO40 GPIO39 GPIO38 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 499 C10 57 C7 PCB_ANT B R3 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 VDD3P3_RTC XTAL_32K_P XTAL_32K_N GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 SPICS1 GND 2.0nH(0.1nH) C6 GND ANT1 10K(NC) GND GND L1 D VDD33 0 C2 10nF TBD R1 VDD33 23 Submit Documentation Feedback C3 1uF C4 GND 40MHz(±10ppm) The value of R4 varies with the actual PCB board. VDD33 XIN TBD GND Y1 2 C1 D C GND GND 4 GND GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 Espressif Systems 5 Module Schematics A A Figure 5: ESP32­S3­MINI­1 Schematics Title Size A4 5 4 3 Date: 2 Page Name Tuesday, May 10, 2022 Rev 1.1 Confidential and Proprietary Sheet 1 2 of 2 5 4 3 2 1 1 3 GND XOUT 2 10K(NC) 10uF 1uF 0.1uF 0.1uF GND RF_ANT 1 L2 TBD ANT1 C11 C12 CONN TBD TBD GND GND GND The values of C11, L2 and C12 vary with the actual PCB board. NC: No component. LNA_IN CHIP_PU GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 1 2 3 4 5 6 7 8 9 10 11 12 13 14 LNA_IN VDD3P3 VDD3P3 CHIP_PU GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 U1 42 41 40 39 38 37 36 35 34 33 32 31 30 29 GPIO37 GPIO36 GPIO35 GPIO34 GPIO33 GPIO47 GPIO48 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 GND 62 VDD33 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 VDD33 GND GPIO37 GPIO36 GPIO35 GPIO34 GPIO33 SPICLK_P SPICLK_N SPID SPIQ SPICLK SPICS0 SPIWP SPIHD VDD_SPI D1 ESD GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 63 VDD_SPI C13 C14 0.1uF 1uF ESP32-S3FN8 GND ESP32-S3FH4R2 GND GND GND 3V3 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 IO10 IO11 GND U2 65 GND ESP32-S3-MINI-1U EN IO46 GND GND IO45 RXD0 TXD0 IO42 IO41 IO40 IO39 IO38 IO37 IO36 IO35 GND CHIP_PU GPIO46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 C GPIO45 U0RXD U0TXD GPIO42 GPIO41 GPIO40 GPIO39 GPIO38 GPIO37 GPIO36 GPIO35 64 GND B ESP32-S3-MINI-1U(pin-out) GND GND GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 C15 0.1uF GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 VDD33 0.1uF GND EPAD GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND R4 GND GND 15 16 17 18 19 20 21 22 23 24 25 26 27 28 GND 56 55 54 53 52 51 50 49 48 47 46 45 44 43 C9 VDDA VDDA XTAL_P XTAL_N GPIO46 GPIO45 U0RXD U0TXD MTMS MTDI VDD3P3_CPU MTDO MTCK GPIO38 C8 57 C7 GND 24 Submit Documentation Feedback C6 C10 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 VDD3P3_RTC XTAL_32K_P XTAL_32K_N GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 SPICS1 GND 2.0nH(0.1nH) VDD33 IO12 IO13 IO14 IO15 IO16 IO17 IO18 IO19 IO20 IO21 IO26 IO47 IO33 IO34 IO48 499 GPIO46 GPIO45 U0RXD U0TXD GPIO42 GPIO41 GPIO40 GPIO39 GPIO38 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 R3 GND GND L1 D VDD33 R1 VDD33 4 3 2 TBD GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 GPIO47 GPIO33 GPIO34 GPIO48 C2 10nF C4 0 C3 1uF GND Y1 GND 40MHz(±10ppm) The value of R4 varies with the actual PCB board. VDD33 XIN TBD The values of C1 and C4 vary with the selection of the crystal. B 4 C1 D C GND GND A A Figure 6: ESP32­S3­MINI­1U Schematics Title Size A4 5 4 3 Date: 2 Page Name Tuesday, May 10, 2022 Rev 1.1 Confidential and Proprietary Sheet 1 2 of 2 5 Module Schematics Espressif Systems GND 6 Peripheral Schematics 4 3 2 6 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 VDD33 C1 C3 22uF 0.1uF GND JP4 1 2 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 IO10 IO11 GND 1 2 Boot Option 63 GND EN IO46 C7 R2 2 R3 R5 0(NC) 0(NC) R4 R6 X1: ESR = Max. 70 KΩ R1 TBD GND TMS TDI TDO TCK 1 2 3 4 1 2 3 4 UART JP2 1 2 3 4 1 2 3 4 JTAG SW1 R7 C8 0 EN 0.1uF GND USB_D+ USB_D- 0 0 GND GND U1 C6 TBD NC: No component. TBD JP1 IO45 RXD0 TXD0 IO42 IO41 IO40 IO39 IO38 IO37 IO36 IO35 64 GND C5 12pF(NC) C2 VDD33 IO12 IO13 IO14 IO15 IO16 IO17 IO18 IO19 IO20 IO21 IO26 IO47 IO33 IO34 IO48 12pF(NC) X1 32.768KHz(NC) GND 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 GND EN GND IO46 3V3 GND IO0 GND IO1 IO45 IO2 RXD0 IO3 TXD0 IO4 ESP32-S3-MINI-1/ESP32-S3-MINI-1U IO42 IO5 IO41 IO6 IO40 IO7 IO39 IO8 IO38 IO9 IO37 IO10 IO36 IO11 IO35 NC C4 1 GND 65 GND 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 GND GND IO12 IO13 IO14 IO15 IO16 IO17 IO18 IO19 IO20 IO21 IO26 IO47 IO33 IO34 IO48 62 EPAD GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 GND JP3 1 2 1 2 USB OTG TBD GND Figure 7: Peripheral Schematics • Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. • To ensure that the power supply to the ESP32-S3 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32-S3’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32-S3 Series Datasheet . 4 Espressif Systems 3 25 Submit Documentation Feedback 2 ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 7 Physical Dimensions and PCB Land Pattern 7 Physical Dimensions and PCB Land Pattern 7.1 Physical Dimensions Unit: mm 0.8 2.4±0.15 Top view 4.5 4.5 1.2 0.5 Ø 0.7 15.45 14.8 13.2 12.3 11.5 10.6 13.55 0. 5 0.6 1.2 14 0.6 20.5±0.15 5.05 15.4±0.15 10.6 11.5 12.3 13.2 14.8 Side view Bottom view Figure 8: ESP32­S3­MINI­1 Physical Dimensions Unit: mm 15.4±0.15 0.8 0.85 0.7 Top view 4.5 1.2 0.5 14 0.6 14.8 13.2 12.3 11.5 10.6 13.55 15.4±0.15 1.6 0.6 1.2 3.2 2.4±0.15 4.5 10.6 11.5 12.3 13.2 14.8 Side view Bottom view Figure 9: ESP32­S3­MINI­1U Physical Dimensions Espressif Systems 26 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 7 Physical Dimensions and PCB Land Pattern Note: For information about tape, reel, and product marking, please refer to Espressif Module Package Information. Espressif Systems 27 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 7 Physical Dimensions and PCB Land Pattern 7.2 Recommended PCB Land Pattern Unit: mm : Pad Antenna Area Pin 1 1.2 4.5 0.6 4.5 1.2 14.8 13.2 12.3 11.5 10.6 20.5 0.6 5.05 15.4 10.6 11.5 12.3 13.2 14.8 Figure 10: ESP32­S3­MINI­1 Recommended PCB Land Pattern Espressif Systems 28 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 7 Physical Dimensions and PCB Land Pattern Unit: mm : Pad 15.4 Pin 1 4.5 0.6 15.4 14.8 13.2 12.3 11.5 10.6 4.5 1.2 1.2 0.6 10.6 11.5 12.3 13.2 14.8 Figure 11: ESP32­S3­MINI­1U Recommended PCB Land Pattern Espressif Systems 29 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 7 Physical Dimensions and PCB Land Pattern 7.3 Dimensions of External Antenna Connector ESP32-S3-MINI-1U uses the third generation external antenna connector as shown in Figure 12. This connector is compatible with the following connectors: • W.FL Series connector from Hirose • MHF III connector from I-PEX • AMMC connector from Amphenol Unit: mm Tolerance: +/-0.1 mm CONTACT 1.7 2.00±0.10 A A GROUND CONTACT 2.05±0.10 0.85 0.57 1.7 CONTACT 1.40 0.10 HOUSING HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; SHELL SECTION: A-A SCALE: 1:1 PERFORMANCE: CONTACT RESISTANCE: 20mOHM Max. DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; INSULATION RESISTANCE: 500MOHM Min. Figure 12: Dimensions of External Antenna Connector Espressif Systems 30 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 8 Product Handling 8 Product Handling 8.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and /60%RH. If the above conditions are not met, the module needs to be baked. 8.2 Electrostatic Discharge (ESD) • Human body model (HBM): ±2000 V • Charged-device model (CDM): ±500 V 8.3 Reflow Profile Temperature (℃) Solder the module in a single reflow. Peak Temp. 235 ~ 250 ℃ 250 Preheating zone 150 ~ 200 ℃ 60 ~ 120 s 217 200 Reflow zone 217 ℃ 60 ~ 90 s Cooling zone –1 ~ –5 ℃/s Soldering time > 30 s Ramp-up zone 1 ~ 3 ℃/s 100 50 25 Time (sec.) 0 0 50 100 150 200 250 Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 13: Reflow Profile Espressif Systems 31 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 8 Product Handling 8.4 Ultrasonic Vibration Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate. Espressif Systems 32 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 9 Related Documentation and Resources 9 Related Documentation and Resources Related Documentation • ESP32-S3 Series Datasheet – Specifications of the ESP32-S3 hardware. • ESP32-S3 Technical Reference Manual – Detailed information on how to use the ESP32-S3 memory and peripherals. • ESP32-S3 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-S3 into your hardware product. • Certificates https://espressif.com/en/support/documents/certificates • Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone • ESP-IDF Programming Guide for ESP32-S3 – Extensive documentation for the ESP-IDF development framework. • ESP-IDF and other development frameworks on GitHub. https://github.com/espressif • ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ • The ESP Journal – Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ • See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos Products • ESP32-S3 Series SoCs – Browse through all ESP32-S3 SoCs. https://espressif.com/en/products/socs?id=ESP32-S3 • ESP32-S3 Series Modules – Browse through all ESP32-S3-based modules. https://espressif.com/en/products/modules?id=ESP32-S3 • ESP32-S3 Series DevKits – Browse through all ESP32-S3-based devkits. https://espressif.com/en/products/devkits?id=ESP32-S3 • ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en Contact Us • See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems 33 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 Revision History Revision History Date Version Release notes • Update information about flash and PSRAM on the title page and in Section 1.1 • Add certification and test information • Add information of new module variants and their ambient operating temperature versions in Table 1 2022-05-24 v1.0 • Add the second note in Table 2 • Add Table 5 and update description of ROM code printing in Section 3.3 • Add notes in Table 11 • Update Bluetooth LE RF data • Update module schematics in Section 5 • Other minor updates 2021-11-16 v0.6 Overall update for chip revision 1 2021-03-30 v0.1 Preliminary release, for chip revision 0 Espressif Systems 34 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.0 Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. 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