RS1MA

RS1AA THRU RS1MA 1.0A Surface Mount Fast Recovery Rectifiers-50-1000V Package outline Features The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Fast switching for high efficiency Low reverse leakage Built-in strain relief,ideal for automated placement High forward surge current capability High temperature soldering guaranteed: 250 C/10 seconds at terminals Glass passivated chip junction Compliant to RoHS Directive 2011/65/EU SMA 0.108(2.75) 0.096(2.45) 0.067 (1.70) 0.051 (1.30) 0.177(4.50) 0.157(3.99) 0.012(0.305) 0.006(0.152) 0.096(2.42) 0.078(1.98) Mechanical data 0.060(1.52) 0.030(0.76) Case: JEDEC DO-214AC molded plastic body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any 0.208(5.28) 0.188(4.80) Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT PARAMETER 0.008(0.203)MAX. T A=25 oC unless otherwise noted) CONDITIONS Symbol MIN. TYP. MAX. UNIT Forward rectified current See Fig.2 IO 1.0 A Forward surge current 8.3ms single half sine-wave (JEDEC methode) I FSM 30 A V R = V RRM T A = 25 OC Reverse current Thermal resistance Junction to ambient NOTE 1 Diode junction capacitance f=1MHz and applied 4V DC reverse voltage *1 V RRM (V) V RMS*2 (V) *3 VR (V) RS1AA 50 35 50 RS1BA 100 70 100 RS1DA 200 140 200 RS1GA 400 280 400 RS1JA 600 420 600 RS1KA 800 560 800 RS1MA 1000 700 1000 *4 VF (V) *5 t rr (ns) Operating temperature T J, ( OC) O 75 CJ T STG μA 50 R θJA Storage temperature SYMBOLS 5.0 IR V R = V RRM T A = 100 OC pF 15 -55 C/W O +150 C *1 Repetitive peak reverse voltage *2 RMS voltage 150 *3 Continuous reverse voltage 1.30 -55 to +150 *4 Maximum forward voltage@I F=1.0A 250 *5 Maximum Reverse recovery time, note 2 500 Note: 1.P.C.B. mounted with 2.0x2.0”(5.0x5.0cm) copper pad areas 2. Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A www.fuxinsemi.com Page 1 Ver2.1 RS1AA THRU RS1MA 1.0A Surface Mount Fast Recovery Rectifiers-50-1000V Rating and characteristic curves AVERAGE FORWARD RECTIFIED CURRENT, AMPERES FIG. 1- FORWARD CURRENT DERATING CURVE 0.8 0.6 Single Phase Half Wave 60Hz Resistive or inductive Load 0.4 0.2 0 0 25 50 30 £PEAK FORWARD SURGE CURRENT, AMPERES 1.0 FIG. 2-MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 75 100 125 150 25 20 15 10 175 5.0 8.3ms SINGLE HALF SINE-WAVE (JEDEC Method) 1 10 LEAD TEMPERATURE, C FIG. 3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS FIG. 4-TYPICAL REVERSE CHARACTERISTICS 1,000 10 1 TJ=25 C PULSE WIDTH=300 ms 1%DUTY CYCLE 0.1 0.01 0.6 0.8 1.0 1.2 1.4 1.5 INSTANTANEOUS REVERSE CURRENT, MICROAMPERES INSTANTANEOUS FORWARD CURRENT,AMPERES 20 100 10 TJ=100 C 1 0.1 TJ=25 C 0.01 INSTANTANEOUS FORWARD VOLEAGE, VOLTS 20 40 60 80 100 FIG. 6-TYPICAL TRANSIENT THERMAL IMPEDANCE TRANSIENT THERMAL IMPEDANCE, C/W FIG. 5-TYPICAL JUNCTION CAPACITANCE TJ=25 C 100 0 PERCENT OF PEAK REVERSE VOLTAGE,% 200 JUNCTION CAPACITANCE, pF 100 NUMBER OF CYCLES AT 60 Hz 10 100 10 1 0.1 0.01 0.1 1 10 100 1 0.1 1.0 10 100 REVERSE VOLTAGE,VOLTS www.fuxinsemi.com t,PULSE DURATION,sec. Page 2 Ver2.1 RS1AA THRU RS1MA 1.0A Surface Mount Fast Recovery Rectifiers-50-1000V Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code RS1AA RS1BA RS1DA RS1GA RS1JA RS1KA RS1MA RS1A RS1B RS1D RS1G RS1J RS1K RS1M Example For Halogen D evice RS1M Marking code Suggested solder pad layout C A B Dimensions in inches and (millimeters) www.fuxinsemi.com PACKAGE A B C SMA 0.110 (2.80) 0.063 (1.60) 0.087 (2.20) Page 3 Ver2.1 RS1AA THRU RS1MA 1.0A Surface Mount Fast Recovery Rectifiers-50-1000V Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 o t25 C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o