承
认
书
APPROVAL SHEET
客 户 名 称:
Customer
功率电感器
Power Inductor
产 品 名 称:
Part Name
客 户 料 号:
Customer P/N
物 料 描 述:
Material description
产 品 规 格:
PIM252010-S00 Series
Specification
版 本 号:
21.02
Version No.
日
期:
2021-9-3
DATE
制造
客户
Manufacturer
Customer
拟制
审核
确认
检验
审核
批准
Draft by
Checked by
Approve by
Check by
Checked by
Approval by
唐程华
冯东梅
冯东梅
履历表
Resume
版本
Ver. No.
修 改 明 细
Modify Details
修改
Reviser
日期
Date
21.01
首次发行 Initial issue
唐程华
2021-6-10
21.02
Add R47\R68\1R5\3R3\4R7 spec.
唐程华
2021-9-3
Page 1 of 10
目
录
TABLE OF CONTENTS
1
适用范围 Scope
2
型号表示办法 How To Order
3
尺寸与结构 External Dimensions and Structural Diagram
4
测试条件 Testing conditions.
5
工作温度范围 Operating Temperature Range
6
电气性能 Performance Specification
7
可靠性 Reliability Data
8
包装 Package
9
环保情况说明 Environmental Protection Statement
10
推荐使用的焊接曲线 Recommended soldering profile
11
清洗 Cleaning
12
贮存方法 Storage Methods
13
使用注意事项 Precautions For Use
Page 2 of 10
1. 适用范围 Scope.
本规格书适用于 PIM252010 系列贴片功率电感器。
This specification applies to the PIM252010 series of SMD power inductors.
2. 型号表示办法 How To Order.
PIM
①
252010 ②
1R0
□
T
□ □□
③
④
⑤
⑥
①产品代号,Product symbol.
②尺寸代码,Dimension code, 长度、宽度、厚度, Length /width /thickness.
③电感量标称值,Inductance,1R0→1.0µH,100→10µH,101→100µH.
④电感量公差代码,Inductance Tolerance code, N ±30%,M ±20%.
⑤包装代码,T-编带卷盘;Packing code: T-Tape & reel.
⑥内部代码,Internal code.
3. 尺寸与结构 External Dimensions and Structural Diagram.
单位 Unit:mm
I J I
F
G
A
F
3.1. 尺寸 External Dimensions
B
E
C
H
RECOMMENDED
LAND PATTERNS
顶部印字 Marking:不印字
A
B
C
E
Typical
F
Typical
G
Typical
2.5±0.2
2.0±0.2
1.00MAX
2.0
0.9
0.7
Page 3 of 10
H
I
J
Typical Typical Typical
2.1
1.0
0.6
3.2. 结构图 Structural drawing:
No.
部位 Component
材料 Material
①
本体 Body
合金材料
Alloy material
②
线圈 Winding
漆包线
Enamelled Wire
③
涂层 Shield
环氧树脂
Epoxy
④
电极 Electrode
底层—铜层 Base plating—Cu
镀层—镍层 Base plating—Ni
镀层—锡层 Base plating—Sn
Alloy material
Epoxy
Enamelled Wire
Electrode
4. 测试条件 Testing conditions.
4.1. 除非另有规定,否则在以下条件下测试. Unless otherwise specified
温度:常温
Temperature : Ordinary Temperature
20±15 ℃
湿度:常湿
Humidity: Ordinary Humidity
65±20 % RH
4.2. 当对测量结果有疑问时 In case of doubt
温度
Temperature
20±2 ℃
湿度
Humidity
65±5 % RH
大气压
Atmospheric Pressure
86 to 106 kPa
4.3. 测试示意图 Test schematic diagram.
LCR METER
LCUR
LPOT
HPOT
HCUR
LCUR
LPOT
HPOT
HCUR
Thermometer
DC Bias Current Source
LCUR
LPOT
HPOT
HCUR
+
Inductor
LCR METER
LCUR
LPOT
HPOT
HCUR
Thermocouple
Inductor
Ls & RDC test schematic diagram
Isat & Irms test schematic diagram
Page 4 of 10
-
5. 工作温度范围 Operating Temperature Range
-40℃~+125℃,包括自身发热。Including self-heating
6. 电气性能 Performance Specification
客户料号
Customers
Part No.
风华型号
Fenghua
Part No.
电感量
Inductance
Ls
(µH)
直流电阻
Direct Current
Resistance
RDC
(mΩ)
Max
Typ.
饱和电流
Saturation
Current
Isat
(A)
温升电流
Temperature
Rise Current
Irms
(A)
印字
Marking
PIM252010-R47MTS00
0.47
±20%
22
15.0
6.50
5.60
---
PIM252010-R68MTS00
0.68
±20%
27
22.9
5.50
5.00
---
PIM252010-1R0MTS00
1.00
±20%
30
25.7
4.80
4.10
---
PIM252010-1R5MTS00
1.50
±20%
55
42.8
3.90
3.00
---
PIM252010-2R2MTS00
2.20
±20%
70
62.6
3.00
2.10
---
PIM252010-3R3MTS00
3.30
±20%
100
86.0
2.50
2.00
---
PIM252010-4R7MTS00
4.70
±20%
160
145.0
2.00
1.60
---
测试条件与仪器 Test condition & equipment:
项目 Item
测试条件 Test condition
测试仪器 Test equipment
电感量 Ls
1MHz/1V
HP4263B\IM3532-50 or equivalent
直流电阻 RDC
直流电
HP4263B\RM3545 or equivalent
饱和电流 Isat
1MHz/1V
Microtest 6379 & 6220 or equivalent
温升电流 Irms
ambient temperature 20℃
Microtest 6379 & 6220 or equivalent
direct-current
Isat:指使电感量比初始值下降约 30%的电流值,加载电流的时间 1 秒以内。
The DC current at which the inductance drops approximate 30% from its value without current, Load current time within1 s.
Irms: 指使电感器表面温度上升 40℃的电流值。
The DC current is inductor surface temperature to rise by 40℃.
Page 5 of 10
7. 可靠性 Reliability Data
序号
No.
项目
Items
要求
Requirements
试验方法及备注
Test Methods and Remarks
在电感器线圈和本体顶面中间施加
绝缘电阻
7.1
Insulation Resistance
100 V 直流电压保持 60 s。
≥100MΩ
100 V DC between inductor coil and The
middle of the top surface of the body for
60 seconds.
在(245±5) ℃熔融的焊锡
可焊性
7.2
Solderability
电极面 90%以上覆盖新的焊料。
(96.5Sn/3.0Ag/0.5Cu)中浸(5±1) s。
90% or more of electrode area shall
Dip pads in flux and dip in solder pot
be coated by new solder.
(96.5Sn/3.0Ag/0.5Cu) at (245±5) ℃ for
(5±1) seconds.
耐焊接热
7.3
外观无可见机械损伤;
在(260±5) ℃熔融的焊锡
电感量变化率:±10%以内。
(96.5Sn/3.0Ag/0.5Cu)中浸(10±1) s。
Resistance to Soldering
Heat
Dip pads in flux and dip in solder pot
No visible mechanical damage.
(96.5Sn/3.0Ag/0.5Cu) at (260±5) ℃ for
Inductance change: Within ±10%
(10±1) seconds.
将电感器用(260±5) ℃,(20±5) s 焊在带
元件的端子与本体结合无松动、无
端子强度
7.4
Adhesion of terminal
electrode
脱落。
Strong bond between the pad and
the core, without come off PC
board.
有 0.3 mm 厚锡膏的基板上,然后用冶具
垂直电极面方向加压 10 N,(10±1) s。
Inductors shall be subjected to
(260±5)℃ for (20±5) s Soldering in the
base whit 0.3mm solder. And then aplomb
electrode way plus tax 10 N for (10±1)
seconds.
外观无可见机械损伤;
7.5
耐高温
电感量变化率:±10%以内。
High temperature
No visible mechanical damage.
Inductance change: Within ±10%
外观无可见机械损伤;
7.6
耐低温
电感量变化率:±10%以内。
Low temperature
No visible mechanical damage.
Inductance change: Within ±10%
Page 6 of 10
温度(+85 ± 2 )℃,时间(96±2) h;
Temperature is (+85±2)℃ and keep
(96±2) hours.
温度(-40℃ ±2) ℃,时间(96±2) h;
Temperature is (-40±2)℃ and keep
(96±2) hours.
(续上表 Continue on the table)
序号
No.
项目
Items
要求
Requirements
试验方法及备注
Test Methods and Remarks
(-40±3) ℃,时间(30±3) min ↔ (125℃±2) ℃/(30±3)
min,转换时间(2~3) min,循环32次;
温度变化
7.7
Thermal shock
外观无可见机械损伤;电感量变
在室温下放置 2 小时后、48 小时内测试。
化率:±10%以内。
The test sample shall be placed at (-40±3)℃ and
No visible mechanical damage.
(125±2)℃ for (30±3) min, different temperature
Inductance change: Within ±10%
conversion time is 2~3 minutes. The temperature
cycle shall be repeated 32 cycles.
Placed at room
temperature for 2 hours, within 48 hours of testing.
a:+20 ℃ (30~45) min →
温度特性
7.8
Temperature
characteristic
电感量变化率 Pc-b,Pc-d 不超过
±20%。
b: -40 ℃ (30~45) min
c: +20 ℃ (30~45) min →
d: +125 ℃ (30~45) min
Inductance change Pc-b,Pc-d:
7.9
Static
Humidity
→
e: +20 ℃ (30~45) min
Within ±20%
Pc -b =
恒定湿热
→
Lb − Lc
Ld − Lc
×100% ; Pc -d =
×100%
Lc
Lc
外观无可见机械损伤;
将电感器放置在于湿度(93±3)%RH,温度(40±2) ℃
电感量变化率:±10%以内。
的环境中存放(1000±2) h,在室温下放置 2 小时后、
No visible mechanical damage.
Inductance change: Within ±10%
48 小时内测试。
Inductors shall be subjected to (93±3)%RH . at
(60±2)℃ for (96±2) h . Placed at room temperature
for 2 hours, within 48 hours of testing.
耐久性
7.10
(寿命)
Life
外观无可见机械损伤;电感量变
温度(85 ±2)℃,时间(1000±24) h,施加 Irms,在室温
化率:±10%以内。
下放置 2 小时后、48 小时内测试。
No visible mechanical damage.
Inductors shall be store at (85±2)℃ for (1000±24)
Inductance change: Within ±10%
hours with Irms applied.
Placed at room temperature for 2 hours, within 48
hours of testing.
Page 7 of 10
8. 包装 Package
8.1. 载带尺寸 Tape Dimension(单位:毫米 Unit:mm)
P0
T
B0
W
F
D
E
P2
D1
P
A0
K0
W
A0
B0
D
D1
E
F
K0
P0
P2
P
T
8±0.3
2.2±0.1
2.7±0.1
1.5±0.1
1.0MIN
1.75±0.1
3.5±0.1
1.15±0.1
4.0±0.3
2.0±0.3
4.0±0.3
0.25±0.05
8
8.2. 供料方向 Direction of feed(单位:毫米 Unit:mm)
a
b
c
Direstion of feed
供料方向
D
底部视图
A
B
C
D
a
b
c
178
Typical
58
Typical
13
Typical
8.4
Typical
空带
Blank portions
装元件
Chip cavity
引带
Leader
8.3. 包装数量 Packing quantity
卷盘 REEL
纸盒 BOX
(PCS)
(PCS)
纸箱 Carton
(PCS)
3,000
15,000
150,000
8.4. 剥离力要求 Peeling required
8.4.1. F 力大小 F force:10~130g;
8.4.2. 面带剥离速度 Peeling speed:300mm/min±10%;
8.4.3. 面带剥离角度 Peeling angle:165°~180°。
Page 8 of 10
9. 环保情况说明 Environmental Protection Statement
RoHS 指令:本公司产品符合 RoHS 指令。
Response to RoHS directive:Our products are RoHS compliance.
10. 推荐使用的焊接曲线 Recommended soldering profile
10.1.本产品建议使用回流焊接法。
Applicable soldering process to the products is reflow soldering.
10.2.焊接材料 Soldering Materials
⑴焊料 Solder:Sn-3.0Ag-0.5Cu
⑵助焊剂:使用松香基助焊剂,禁止使用卤化物含量超过 0.2wt%的强酸性助焊剂和水溶性助焊剂。
Flux: Use rosin-based flux, but not strongly acidic flux (with chlorine exceeding 0.2 wt%). Do not use
water-soluble flux.
10.3.焊接曲线 Soldering Profile
10.4.烙铁焊接 Soldering Iron
使用烙铁进行返修时要求在 150℃下预热至少 1 分钟,不能直接用焊头接触磁体,返修焊接条件如下:
Reworking with electric soldering iron must preheating at 150℃ for 1 minute is required, and do not directly touch
the core with the tip of the soldering iron. The reworking soldering conditions are as follows:
10.4.1. 烙铁头温度 Temperature of soldering iron tip:350℃;
10.4.2. 烙铁输出功率 Soldering iron power output:≤30W;
10.4.3. 烙铁头直径 Diameter of soldering iron end:≤1.0mm;
10.4.4. 焊接时间 Soldering time:
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