S-5731 Series
www.ablic.com
www.ablicinc.com
HIGH-WITHSTAND VOLTAGE HIGH-SPEED
UNIPOLAR DETECTION TYPE
HALL EFFECT SWITCH IC
Rev.1.1_01
© ABLIC Inc., 2014-2017
This IC, developed by CMOS technology, is a unipolar detection type Hall effect switch IC with high-withstand voltage, highspeed detection and high-accuracy magnetic characteristics.
The output voltage changes when this IC detects the intensity level of magnetic flux density. Using this IC with a magnet
makes it possible to detect the open / close and rotation status in various devices.
This IC includes an output current limit circuit.
High-density mounting is possible by using the small SOT-23-3 package.
Due to its high-accuracy magnetic characteristics, this IC can make operation's dispersion in the system combined with
magnet smaller.
ABLIC Inc. offers a "magnetic simulation service" that provides the ideal combination of magnets and our Hall effect ICs for
customer systems. Our magnetic simulation service will reduce prototype production, development period and development
costs. In addition, it will contribute to optimization of parts to realize high cost performance.
For more information regarding our magnetic simulation service, contact our sales office.
Features
Pole detection*1:
Output logic*1:
Output form*1:
*1
Magnetic sensitivity :
Chopping frequency:
Output delay time:
Power supply voltage range:
Built-in regulator
Built-in output current limit circuit
Operation temperature range:
Lead-free (Sn 100%), halogen-free
Detection of S pole, detection of N pole
Active "L", active "H"
Nch open-drain output,
Nch driver built-in pull-up resistor
BOP = 3.0 mT typ.,
BOP = 6.0 mT typ.
fC = 250 kHz typ.
tD = 16.0 s typ.
VDD = 3.5 V to 26.0 V
Ta = 40C to 85C
*1. The option can be selected.
Applications
Home appliance
DC brushless motor
Housing equipment
Industrial equipment
Package
SOT-23-3
1
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL EFFECT SWITCH IC
Rev.1.1_01
S-5731 Series
Block Diagrams
1.
Nch open-drain output product
VDD
OUT
Regulator
Chopping
stabilized
amplifier
*1
Output current limit circuit
VSS
*1. Parasitic diode
Figure 1
2.
Nch driver built-in pull-up resistor product
VDD
OUT
Regulator
Chopping
stabilized
amplifier
Output current limit circuit
VSS
*1. Parasitic diode
Figure 2
2
*1
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL EFFECT SWITCH IC
Rev.1.1_01
S-5731 Series
Product Name Structure
1.
Product name
S-5731
x
x
x
x
-
M3T2
U
Environmental code
U: Lead-free (Sn 100%), halogen-free
Package abbreviation and packing specifications*1
M3T2: SOT-23-3, Tape
Magnetic sensitivity
1: BOP = 3.0 mT typ.
2: BOP = 6.0 mT typ.
Output logic
L: Active "L"
H: Active "H"
Pole detection
S: Detection of S pole
N: Detection of N pole
Output form
N: Nch open-drain output
R: Nch driver built-in pull-up resistor
*1. Refer to the tape drawing.
2.
Package
Table 1
Package Name
SOT-23-3
3.
Package Drawing Codes
Dimension
MP003-C-P-SD
Tape
MP003-C-C-SD
Reel
MP003-Z-R-SD
Product name list
Table 2
Product Name
Output Form
Pole Detection
S pole
S-5731NSL1-M3T2U Nch open-drain output
S pole
S-5731NSL2-M3T2U Nch open-drain output
N pole
S-5731NNL2-M3T2U Nch open-drain output
S-5731RSL1-M3T2U Nch driver built-in pull-up resistor S pole
Remark Please contact our sales office for products other than the above.
Output Logic
Active "L"
Active "L"
Active "L"
Active "L"
Magnetic Sensitivity
(BOP)
3.0 mT typ.
6.0 mT typ.
6.0 mT typ.
3.0 mT typ.
3
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL EFFECT SWITCH IC
Rev.1.1_01
S-5731 Series
Pin Configuration
1.
SOT-23-3
Top view
Table 3
1
2
Pin No.
3
Symbol
Description
1
VSS
GND pin
2
VDD
Power supply pin
3
OUT
Output pin
Figure 3
Absolute Maximum Ratings
Table 4
Item
Symbol
Power supply voltage
Output current
Nch open-drain output product
Output voltage
Nch driver built-in pull-up resistor product
Operation ambient temperature
Storage temperature
Caution
(Ta = 25C unless otherwise specified)
Absolute Maximum Rating
Unit
VDD
IOUT
VOUT
Topr
Tstg
VSS 0.3 to VSS 28.0
20
VSS 0.3 to VSS 28.0
VSS 0.3 to VDD 0.3
40 to 85
40 to 125
V
mA
V
V
C
C
The absolute maximum ratings are rated values exceeding which the product could suffer physical
damage. These values must therefore not be exceeded under any conditions.
Thermal Resistance Value
Table 5
Item
Condition
Board A
Board B
Junction-to-ambient thermal resistance*1
SOT-23-3
JA
Board C
Board D
Board E
*1. Test environment: compliance with JEDEC STANDARD JESD51-2A
Remark
4
Symbol
Refer to " Power Dissipation" and "Test Board" for details.
Min.
Typ.
200
165
Max.
Unit
C/W
C/W
C/W
C/W
C/W
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL EFFECT SWITCH IC
Rev.1.1_01
S-5731 Series
Electrical Characteristics
Table 6
Item
Symbol
Power supply voltage
VDD
Current consumption
IDD
Output voltage
VOUT
Output drop voltage
VD
Leakage current
ILEAK
Output limit current
Output delay time
Chopping frequency
Start up time
IOM
tD
fC
tPON
Output rise time
tR
Output fall time
Pull-up resistor
(Ta = 25C, VDD = 12.0 V, VSS = 0 V unless otherwise specified)
Test
Condition
Min.
Typ. Max. Unit
Circuit
tF
RL
Nch open-drain output product
Average value
Nch driver built-in pull-up resistor product
Average value, VOUT = "H"
Nch open-drain output product
Output transistor Nch, VOUT = "L", IOUT = 10 mA
Nch driver built-in pull-up resistor product
Output transistor Nch, VOUT = "L", IOUT = 10 mA
Nch driver built-in pull-up resistor product
VOUT = "H", VD = VDD VOUT
Nch open-drain output product
Output transistor Nch, VOUT = "H" = 26.0 V
VOUT = 12.0 V
Nch open-drain output product
C = 20 pF, R = 820
Nch driver built-in pull-up resistor product
C = 20 pF
C = 20 pF, R = 820
Nch driver built-in pull-up resistor product
3.5
12.0
26.0
V
3.0
4.0
mA
1
3.0
4.0
mA
1
0.4
V
2
0.5
V
2
20
mV
2
10
A
3
22
16.0
250
30
70
mA
s
kHz
s
3
4
2.0
s
5
6.0
s
5
7
10
2.0
13
s
k
5
S pole
Magnetic flux density
applied to this IC (B)
BOPS
BRPS
0
tD
tD
tF
tR
90%
Output voltage (VOUT)
(Product with S pole
detection and active "L")
10%
tD
tD
tR
tF
90%
Output voltage (VOUT)
(Product with S pole
detection and active "H")
10%
Figure 4
Operation Timing
5
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL EFFECT SWITCH IC
Rev.1.1_01
S-5731 Series
Magnetic Characteristics
1.
Product with S pole detection
1. 1
Product with BOP = 3.0 mT typ.
Table 7
(Ta = 25C, VDD = 12.0 V, VSS = 0 V unless otherwise specified)
Item
Operation point*1
S pole
Release point*2
S pole
Hysteresis width*3
S pole
1. 2
Symbol
BOPS
BRPS
BHYSS
Condition
BHYSS = BOPS BRPS
Min.
1.5
1.0
Typ.
3.0
2.0
1.0
Max.
4.5
3.3
Unit
mT
mT
mT
Test Circuit
4
4
4
Product with BOP = 6.0 mT typ.
Table 8
(Ta = 25C, VDD = 12.0 V, VSS = 0 V unless otherwise specified)
Item
Operation point*1
S pole
Release point*2
S pole
Hysteresis width*3
S pole
2.
Symbol
BOPS
BRPS
BHYSS
Condition
BHYSS = BOPS BRPS
Min.
3.0
2.5
Typ.
6.0
4.5
1.5
Max.
9.0
7.5
Unit
mT
mT
mT
Test Circuit
4
4
4
Product with N pole detection
2. 1
Product with BOP = 6.0 mT typ.
Table 9
(Ta = 25C, VDD = 12.0 V, VSS = 0 V unless otherwise specified)
Item
Operation point*1
N pole
*2
Release point
N pole
Hysteresis width*3
N pole
Symbol
BOPN
BRPN
BHYSN
Condition
BHYSN = BOPN BRPN
Min.
9.0
7.5
Typ.
6.0
4.5
1.5
Max.
3.0
2.5
Unit
mT
mT
mT
Test Circuit
4
4
4
*1. BOPN, BOPS: Operation points
BOPN and BOPS are the values of magnetic flux density when the output voltage (VOUT) changes after the magnetic flux
density applied to this IC by the magnet (N pole or S pole) is increased (by moving the magnet closer).
Even when the magnetic flux density exceeds BOPN or BOPS, VOUT retains the status.
*2. BRPN, BRPS: Release points
BRPN and BRPS are the values of magnetic flux density when the output voltage (VOUT) changes after the magnetic flux
density applied to this IC by the magnet (N pole or S pole) is decreased (the magnet is moved further away).
Even when the magnetic flux density falls below BRPN or BRPS, VOUT retains the status.
*3. BHYSN, BHYSS: Hysteresis widths
BHYSN and BHYSS are the difference between BOPN and BRPN, and BOPS and BRPS, respectively.
Remark
6
The unit of magnetic density mT can be converted by using the formula 1 mT = 10 Gauss.
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL EFFECT SWITCH IC
Rev.1.1_01
S-5731 Series
Test Circuits
A
*1
VDD
R
820
S-5731
Series OUT
VSS
*1.
Resistor (R) is unnecessary for Nch driver built-in pull-up resistor product.
Figure 5
Test Circuit 1
VDD
S-5731
Series OUT
VSS
Figure 6
A
V
Test Circuit 2
VDD
S-5731
Series OUT
VSS
A
V
Figure 7 Test Circuit 3
*1
VDD
R
820
S-5731
Series OUT
VSS
*1.
V
Resistor (R) is unnecessary for Nch driver built-in pull-up resistor product.
Figure 8
Test Circuit 4
7
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL EFFECT SWITCH IC
Rev.1.1_01
S-5731 Series
*1
VDD
S-5731
OUT
Series
VSS
*1.
R
820
C
20 pF
V
Resistor (R) is unnecessary for Nch driver built-in pull-up resistor product.
Figure 9
Test Circuit 5
Standard Circuit
*1
VDD
CIN
0.1 F
R
820
S-5731
Series OUT
VSS
*1. Resistor (R) is unnecessary for Nch driver built-in pull-up resistor product.
Figure 10
Caution The above connection diagram and constant will not guarantee successful operation. Perform
thorough evaluation using the actual application to set the constant.
8
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL EFFECT SWITCH IC
Rev.1.1_01
S-5731 Series
Operation
1.
Direction of applied magnetic flux
This IC detects the magnetic flux density which is vertical to the marking surface.
Figure 11 shows the direction in which magnetic flux is being applied.
N
S
Marking surface
Figure 11
2.
Position of Hall sensor
Figure 12 shows the position of Hall sensor.
The center of this Hall sensor is located in the area indicated by a circle, which is in the center of a package as
described below.
The following also shows the distance (typ. value) between the marking surface and the chip surface of a package.
Top view
The center of Hall sensor;
in this 0.3 mm
1
2
3
0.7 mm (typ.)
Figure 12
9
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL EFFECT SWITCH IC
Rev.1.1_01
S-5731 Series
3.
Basic operation
This IC changes the output voltage (V OUT ) according to the level of the magnetic flux density (N pole or
S pole) applied by a magnet.
The following explains the operation when the output logic is active "L".
3. 1
Product with S pole detection
When the magnetic flux density of the S pole perpendicular to the marking surface exceeds the operation point
(BOPS) after the S pole of a magnet is moved closer to the marking surface of this IC, VOUT changes from "H" to "L".
When the S pole of a magnet is moved further away from the marking surface of this IC and the magnetic flux
density is lower than the release point (BRPS), VOUT changes from "L" to "H".
Figure 13 shows the relationship between the magnetic flux density and VOUT.
VOUT
BHYSS
H
L
N pole
BRPS
0
S pole
BOPS
Magnetic flux density (B)
Figure 13
3. 2
Product with N pole detection
When the magnetic flux density of the N pole perpendicular to the marking surface exceeds the operation point
(BOPN) after the N pole of a magnet is moved closer to the marking surface of this IC, VOUT changes from "H" to "L".
When the N pole of a magnet is moved further away from the marking surface of this IC and the magnetic flux
density of the N pole is lower than the release point (BRPN), VOUT changes from "L" to "H".
Figure 14 shows the relationship between the magnetic flux density and VOUT.
VOUT
BHYSN
H
L
N pole
BOPN
BRPN
0
S pole
Magnetic flux density (B)
Figure 14
10
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL EFFECT SWITCH IC
Rev.1.1_01
S-5731 Series
4.
Timing chart
Figure 15 shows the operation timing at power-on.
The initial output voltage at rising of power supply voltage (VDD) is either "H" or "L".
In case of B BOPS (operation point) or B BRPS (release point) at the time when the start up time (tPON) is passed after
rising of VDD, this IC outputs VOUT according to the applied magnetic flux density.
In case of BRPS B BOPS at the time when tPON is passed after rising of VDD, this IC maintains the initial output
voltage.
Product with S pole detection and active "L"
Product with S pole detection and active "H"
Power supply voltage
(VDD)
Power supply voltage
(VDD)
tPON
tPON
Output voltage (VOUT)
(B BOPS)
"H" / "L"
"L"
Output voltage (VOUT)
(B BOPS)
"H" / "L"
"H"
Output voltage (VOUT)
(B BRPS)
"H" / "L"
"H"
Output voltage (VOUT)
(B BRPS)
"H" / "L"
"L"
Output voltage (VOUT)
(BRPS B BOPS)
"H" / "L"
Latching
Output voltage (VOUT)
(BRPS B BOPS)
"H" / "L"
Latching
Figure 15
11
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL EFFECT SWITCH IC
Rev.1.1_01
S-5731 Series
Precautions
If the impedance of the power supply is high, the IC may malfunction due to a supply voltage drop caused by feedthrough current. Take care with the pattern wiring to ensure that the impedance of the power supply is low.
Note that the IC may malfunction if the power supply voltage rapidly changes. When the IC is used under the
environment where the power supply voltage rapidly changes, it is recommended to judge the output voltage of the IC
by reading it multiple times.
Note that the output voltage may rarely change if the magnetic flux density between the operation point and the release
point is applied to this IC continuously for a long time.
Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in electrostatic
protection circuit.
Although this IC has a built-in output current limit circuit, it may suffer physical damage such as product deterioration
under the environment where the absolute maximum ratings are exceeded.
The application conditions for the power supply voltage, the pull-up voltage, and the pull-up resistor should not exceed
the power dissipation.
Large stress on this IC may affect on the magnetic characteristics. Avoid large stress which is caused by the handling
during or after mounting the IC on a board.
ABLIC Inc. claims no responsibility for any disputes arising out of or in connection with any infringement by products
including this IC of patents owned by a third party.
12
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL EFFECT SWITCH IC
Rev.1.1_01
S-5731 Series
Power Dissipation
SOT-23-3
Tj = 125C max.
Power dissipation (PD) [W]
1.0
0.8 B
A
0.6
0.4
0.2
0.0
0
25
50
75
100
125
150
175
Ambient temperature (Ta) [C]
Board
A
B
C
D
E
Power Dissipation (PD)
0.50 W
0.61 W
13
SOT-23-3/3S/5/6 Test Board
IC Mount Area
(1) Board A
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
2
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.070
-
(2) Board B
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
Thermal via
1
2
3
4
Specification
114.3 x 76.2 x t1.6
FR-4
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
No. SOT23x-A-Board-SD-2.0
ABLIC Inc.
2.9±0.2
1
2
3
+0.1
0.16 -0.06
0.95±0.1
1.9±0.2
0.4±0.1
No. MP003-C-P-SD-1.1
TITLE
SOT233-C-PKG Dimensions
No.
MP003-C-P-SD-1.1
ANGLE
UNIT
mm
ABLIC Inc.
+0.1
ø1.5 -0
4.0±0.1
2.0±0.1
+0.25
ø1.0 -0
0.23±0.1
4.0±0.1
1.4±0.2
3.2±0.2
1
2
3
Feed direction
No. MP003-C-C-SD-2.0
TITLE
SOT233-C-Carrier Tape
No.
MP003-C-C-SD-2.0
ANGLE
UNIT
mm
ABLIC Inc.
12.5max.
9.2±0.5
Enlarged drawing in the central part
ø13±0.2
No. MP003-Z-R-SD-1.0
SOT233-C-Reel
TITLE
MP003-Z-R-SD-1.0
No.
QTY.
ANGLE
UNIT
mm
ABLIC Inc.
3,000
Disclaimers (Handling Precautions)
1.
All the information described herein (product data, specifications, figures, tables, programs, algorithms and
application circuit examples, etc.) is current as of publishing date of this document and is subject to change without
notice.
2.
The circuit examples and the usages described herein are for reference only, and do not guarantee the success of
any specific mass-production design.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by the reasons other than the products
described herein (hereinafter "the products") or infringement of third-party intellectual property right and any other
right due to the use of the information described herein.
3.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by the incorrect information described
herein.
4.
Be careful to use the products within their ranges described herein. Pay special attention for use to the absolute
maximum ratings, operation voltage range and electrical characteristics, etc.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by failures and / or accidents, etc. due to
the use of the products outside their specified ranges.
5.
Before using the products, confirm their applications, and the laws and regulations of the region or country where they
are used and verify suitability, safety and other factors for the intended use.
6.
When exporting the products, comply with the Foreign Exchange and Foreign Trade Act and all other export-related
laws, and follow the required procedures.
7.
The products are strictly prohibited from using, providing or exporting for the purposes of the development of
weapons of mass destruction or military use. ABLIC Inc. is not liable for any losses, damages, claims or demands
caused by any provision or export to the person or entity who intends to develop, manufacture, use or store nuclear,
biological or chemical weapons or missiles, or use any other military purposes.
8.
The products are not designed to be used as part of any device or equipment that may affect the human body, human
life, or assets (such as medical equipment, disaster prevention systems, security systems, combustion control
systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment, aviation equipment,
aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle use or other uses by
ABLIC, Inc. Do not apply the products to the above listed devices and equipments.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by unauthorized or unspecified use of
the products.
9.
In general, semiconductor products may fail or malfunction with some probability. The user of the products should
therefore take responsibility to give thorough consideration to safety design including redundancy, fire spread
prevention measures, and malfunction prevention to prevent accidents causing injury or death, fires and social
damage, etc. that may ensue from the products' failure or malfunction.
The entire system in which the products are used must be sufficiently evaluated and judged whether the products are
allowed to apply for the system on customer's own responsibility.
10. The products are not designed to be radiation-proof. The necessary radiation measures should be taken in the
product design by the customer depending on the intended use.
11. The products do not affect human health under normal use. However, they contain chemical substances and heavy
metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips may be sharp. Be
careful when handling these with the bare hands to prevent injuries, etc.
12. When disposing of the products, comply with the laws and ordinances of the country or region where they are used.
13. The information described herein contains copyright information and know-how of ABLIC Inc. The information
described herein does not convey any license under any intellectual property rights or any other rights belonging to
ABLIC Inc. or a third party. Reproduction or copying of the information from this document or any part of this
document described herein for the purpose of disclosing it to a third-party is strictly prohibited without the express
permission of ABLIC Inc.
14. For more details on the information described herein or any other questions, please contact ABLIC Inc.'s sales
representative.
15. This Disclaimers have been delivered in a text using the Japanese language, which text, despite any translations into
the English language and the Chinese language, shall be controlling.
2.4-2019.07
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