MFBW1V2012-152-R

Technical Data 11108 Effective November 2021 Supersedes June 2020 MFBW1V2012 Multilayer chip ferrite bead Applications • Industrial connectivity (IoT) • Wireless communications • Bluetooth • WiFi • Antenna • Machine-to-machine (M2M) • Mobile phones Product features • Wearable devices • 0805 (2012 metric) package • Wireless LAN • High impedance values • Computing/gaming consoles • Multilayer monolithic construction yields high reliability • Broadband components • Impedance range from 0 Ω to 2000 Ω • RF transceiver modules Environmental compliance and general specifications • Operating temperature range: -55 °C to +125 °C (ambient plus self-temperature rise) HALOGEN Pb HF FREE MFBW1V2012 Multilayer chip ferrite bead  Technical Data 11108 Effective November 2021 Product specifications Part number3 Impedance tolerance Impedance (Ω) DCR (Ω) maximum @ +25 °C Test frequency1 (MHz) Test voltage1 (mV) Rated current2 (mA) maximum MFBW1V2012-000-R 0~15 Ω 0 0.03 100 50 3000 MFBW1V2012-050-R 0~15 Ω 5 0.03 100 50 3000 MFBW1V2012-070-R 0~11 Ω 7 0.03 100 50 3000 MFBW1V2012-090-R 5~13 Ω 9 0.03 100 50 3000 MFBW1V2012-110-R 7~15 Ω 11 0.03 100 50 3000 MFBW1V2012-150-R 9~21 Ω 15 0.03 100 50 3000 MFBW1V2012-190-R 12~25 Ω 19 0.03 100 50 3000 MFBW1V2012-300-R ±25% 30 0.05 100 50 3000 MFBW1V2012-310-R ±25% 31 0.05 100 50 3000 MFBW1V2012-360-R ±25% 36 0.06 100 50 3000 MFBW1V2012-600-R ±25% 60 0.06 100 50 3000 MFBW1V2012-700-R ±25% 70 0.08 100 50 2500 MFBW1V2012-800-R ±25% 80 0.08 100 50 2500 MFBW1V2012-101-R ±25% 100 0.10 100 50 2500 MFBW1V2012-121-R ±25% 120 0.10 100 50 2000 MFBW1V2012-151-R ±25% 150 0.10 100 50 2000 MFBW1V2012-181-R ±25% 180 0.15 100 50 2000 MFBW1V2012-201-R ±25% 200 0.15 100 50 2000 MFBW1V2012-221-R ±25% 220 0.15 100 50 2000 MFBW1V2012-301-R ±25% 300 0.20 100 50 2000 MFBW1V2012-501-R ±25% 500 0.25 100 50 1500 MFBW1V2012-601-R ±25% 600 0.25 100 50 1500 MFBW1V2012-801-R ±25% 800 0.30 100 50 800 MFBW1V2012-102-R ±25% 1000 0.30 100 50 800 MFBW1V2012-122-R ±25% 1200 0.45 100 50 500 MFBW1V2012-152-R ±25% 1500 0.50 100 50 300 MFBW1V2012-202-R ±25% 2000 0.50 100 50 300 1. Impedance test frequency and voltage. 2. Rated current: Current rating for an approximate self-temperature rise of 40 °C or less. 2 www.eaton.com/electronics 3. Part number definition: MFBW1V2012-xxx-R MFBW1V2012 = Product code and size xxx = Impedance value in Ω, last character equals number of zeros -R suffix = RoHS compliant Technical Data 11108 MFBW1V2012  Multilayer chip ferrite bead Effective November 2021  Mechanical parameters, schematic, pad layout (mm) Recommended pad layout Schematic a (2plcs) Part number L W T a F G H MFBW1V2012-xxx-R 2.0 ±0.20 1.2 ±0.20 0.9 ±0.20 0.5 ±0.3 1.60 ref 0.20 ref 1.20 ref Part marking: No marking All soldering surfaces to be coplanar within 0.1 millimeters Tolerances are ±0.1 millimeters unless stated otherwise Pad layout dimensions are reference only Traces or vias underneath the inductor is not recommended Packaging information (mm) Drawing not to scale Supplied in tape and reel packaging, 4000 parts per 7” diameter reel W±0.2 8.00 F±0.1 3.50 E1±0.2 1.75 E2 Min na P0±0.2 4.00 P1±0.2 4.00 P2±0.1 2.00 D0±0.1 1.55 A0 1.5±0.2 B0 2.3±0.2 T 0.95±0.1 T1 Max na www.eaton.com/electronics 3 MFBW1V2012 Multilayer chip ferrite bead  Technical Data 11108 Effective November 2021 Qualification testing No. Test item Sample size (pcs) Test condition Acceptable value/range 1 External visual 72 Specification No physical damage 2 Physical dimension 72 Specification Specification 3 Initial electrical test 72 Specification User specification 4 Solderability 6 +245 °C ±5 °C, dipping 5 ±1s >95% solder coverage 5 Resistance to soldering heat 6 +260 ±5 °C for 10 ±1 s 1. ΔZ/Z